| Project/Area Number |
13450309
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Metal making engineering
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| Research Institution | Kyoto University |
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Principal Investigator |
AWAKURA Yasuhiro Kyoto Univ., Materials Science and Engineering, Professor, 工学研究科, 教授 (70109015)
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| Co-Investigator(Kenkyū-buntansha) |
MARUSE Kuniaki Kyoto Univ., Materials Science and Engineering, Research Associate, 工学研究科, 助手 (30283633)
HIRATO Tetsuji Kyoto Univ., Materials Science and Engineering, Associate Professor, 工学研究科, 助教授 (70208833)
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| Project Period (FY) |
2001 – 2003
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| Project Status |
Completed (Fiscal Year 2003)
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| Budget Amount *help |
¥11,000,000 (Direct Cost: ¥11,000,000)
Fiscal Year 2003: ¥1,800,000 (Direct Cost: ¥1,800,000)
Fiscal Year 2002: ¥1,700,000 (Direct Cost: ¥1,700,000)
Fiscal Year 2001: ¥7,500,000 (Direct Cost: ¥7,500,000)
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| Keywords | Electrodeposition / Composite coating / non-aqueous solutions / ionic liquid / room temperature molten salt / aluminium / magnesium / nano-sized particles / ナノサイズ粒子 / 電折 / 複合材料 / ジメチルスルホン |
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| Research Abstract |
The electrolytic codeposition of hydrophobic and hydrophilic micron-and nano-sized particles with aluminium from a non-aqueous electrolyte is illustrated. This introductory investigation demonstrates that the feasibility of codeposition of micron-and nano-sized particles from non-aqueous electrolytes. The large degree of codeposition of particles of different hydrophobicity confirms also that the elimination of the hydration force achieved by using non-aqueous electrolytes, suppresses the major limitations experienced in electrolytic codeposition from aqueous electrolytes. These limitations are the agglomeration of particles and the extremely difficulty to achieve, codeposition of hydrophobic particles like SiO_2, Al_2O_3, TiO_2, even the micron-size ones. Composite plating with nano-sized particles from relatively low cost and easily operational non-aqueous electrolytes opens the way towards the development of thin films and coatings with unique functional properties. The feasibility of codepositing particles from non-aqueous solutions opens new fields of applications of composite plating.
The electrodeposition of active metals, e.g. Al, Mg, and rare earths, from aqueous media is actually impossible due to their largely negative redox potentials. We developed a new ammonium-imide salt, trimethyl-n-hexylammonium bis ((trifluoromethyl)sulfonyl) amide (TMHA-Tf_2N) and investigated the electrodeposition of Mg and Zn-Mg alloy. Metalic Mg, which cannot be electrodepo sited from aqueous solution, was obtained at -2.8 V or ower potentials. Although the TMHA-Tf_2N liquid is hydrophobic, the deposition of Mg and its alloy was fairly affected by residual water in an electrolytic bath.
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