| Project/Area Number |
13555023
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 展開研究 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Tohoku University |
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Principal Investigator |
SAKA Masumi Tohoku University, Graduate School of Engineering, Professor, 大学院・工学研究科, 教授 (20158918)
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| Co-Investigator(Kenkyū-buntansha) |
YAMAMOTO Hiroshi Hitachi Construction Machinery Co. Led., Senior Researcher, 技術開発センタ, 主任研究員
YANG Ju Tohoku University, Graduate School of Engineering, Research Associate, 大学院・工学研究科, 助手 (60312609)
SOYAMA Hitoshi Tohoku University, Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (90211995)
AKAMATSU Satoshi Denshijiki Industry Co. Ltd., Engineer, 開発課, 技師(研究職)
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| Project Period (FY) |
2001 – 2002
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| Project Status |
Completed (Fiscal Year 2002)
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| Budget Amount *help |
¥13,000,000 (Direct Cost: ¥13,000,000)
Fiscal Year 2002: ¥4,000,000 (Direct Cost: ¥4,000,000)
Fiscal Year 2001: ¥9,000,000 (Direct Cost: ¥9,000,000)
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| Keywords | Millimeter Waves / Imaging / Compact System / Focusing Sensor / Nondestructive Evaluation / Resolution / Sensitivity / Liftoff Distance / 非破壊 |
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| Research Abstract |
1. Development of a compact imaging system
Usually, network analyzer is used as the equipment for microwave nondestructive testing. However, network analyzer has lager size and its price is high. Hence it becomes difficult to use it in the industrial environment. Therefore, a millimeter-wave compact equipment was developed to overcome these problems. Both the amplitude and the phase measurement can well be carried out by the compact equipment.
2. Development of a millimeter-wave reflection focusing sensor
A millimeter-wave focusing sensor utilizing two ellipsoidal reflectors woo developed for nondestructive evaluation of materials. By using the focusing sensor, liftoff distance between the sensor and sample woo effectively enlarged, while a higher spatial resolution was also obtained.
3. Detection of defects and evaluation of electrical characteristics in electronic devices and thin films with high spatial resolution
The delamination, which may occur between the chip pad and the encapsulate resin in IC packages, was inspected by millimeter-wave imaging technique. The full and part delamimations were successfully detected. Also a method for contactless measurement of the conductivity of thin conducting films, such us Indium Tin Oxide film, was developed. The measurement was successfully carried out by using the millimeter-wave compact equipment.
4. Quantitative evaluation of closed small cracks on the metal surface
A dual frequency technique was developed to evaluate the depth of small 2-D cracks of which situation regarding crack closure is unknown. On the other hand, a method to evaluate closure stress of cracks was developed. The effect of closure stress on the dual frequency technique was evaluated. In addition, to evaluate 3-D cracks, from the modified dual frequency equation, a new component named interference waveform was introduced, by which the shape and size of small 3-D cracks were successfully evaluated.
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