| Project/Area Number |
13555196
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 展開研究 |
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| Research Field |
Material processing/treatments
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
KONDO Ken-ichi Tokyo Institute of Technology, Materials and Structures Laboratory, Professor, 応用セラミックス研究所, 教授 (50111670)
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| Co-Investigator(Kenkyū-buntansha) |
SOMA Takao NGK INSULATORS, LTD. Research&Development Laboratory, Group Leader, 開発センター, 研究開発統括(研究職)
HIRONAKA Yoichiro Materials and Structures Laboratory, Research Associate, 応用セラミックス研究所, 助手 (20293061)
NAKAMURA Kazutaka g. Materials and Structures Laboratory, Associate Professor, 応用セラミックス研究所, 助教授 (20302979)
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| Project Period (FY) |
2001 – 2002
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| Project Status |
Completed (Fiscal Year 2002)
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| Budget Amount *help |
¥9,900,000 (Direct Cost: ¥9,900,000)
Fiscal Year 2002: ¥3,600,000 (Direct Cost: ¥3,600,000)
Fiscal Year 2001: ¥6,300,000 (Direct Cost: ¥6,300,000)
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| Keywords | ultrashort pulsed laser / femtosecond / laser processing / quartz / gyro-sensor / ablation / threshold / フェムト秒レーザー / 誘電破壊 / 石英 / センサー / 光通信 / 微細加工 / 衝撃波 |
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| Research Abstract |
Laser-matter interaction has various mechanisms, which involved both physical and chemical processes, depending on laser intensity and a pulse width. Laser is now used for precise material processing in order to make optical devices. In this research, we performed precise laser processing of a quartz sample, which is a base material of the double T-type gyro-sensor, using a femtosecond laser beam. We also studied the mechanism of laser processing at intensity around 10 J/cm^2 and a pulse width of 80 fs and ablation threshold of the quartz. The femtosecond laser used wad a table-top tera-watt (T^3) laser system, which is base on a Ti : sapphire laser and a chirp pulse amplification. The amplified 300-ps laser beam (wavelength of 800 nm) was compressed to 80 fs by using a pair of gratings. Using the 80 fs laser pulse, both the surface processing and the cutting of the quartz were examined. A threshold intensity of laser ablation for the surface processing was obtained to be 8.6 J/cb^2. In order to cut the quartz plate (300-・m thick), energy of 670・J was required. The laser cutting of the quartz plate was demonstrated by using a 1kHz femtosecond laser system.
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