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Interfacial Reaction and Morphological Control between Cu Substrate and Pb-free Solders in Electronic Packaging

Research Project

Project/Area Number 13650751
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Structural/Functional materials
Research InstitutionTohoku University

Principal Investigator

XING Jun Liu  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (00323072)

Co-Investigator(Kenkyū-buntansha) OHNUMA Ikuo  Tohoku University, Graduate School of Engineering, Research Associate, 大学院・工学研究科, 助手 (20250714)
KAINUMA Ryosuke  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (20202004)
ISHIDA Kiyohito  Tohoku University, New Industry Creation Hatchery Center, Professor, 未来科学技術共同研究センター, 教授 (20151368)
Project Period (FY) 2001 – 2002
Project Status Completed (Fiscal Year 2002)
Budget Amount *help
¥4,100,000 (Direct Cost: ¥4,100,000)
Fiscal Year 2002: ¥1,800,000 (Direct Cost: ¥1,800,000)
Fiscal Year 2001: ¥2,300,000 (Direct Cost: ¥2,300,000)
KeywordsInterfacial reaction / Microstructure morphology / Phase diagram / Diffusion couple / Pb-free solders / Electronic Packaging / Kinetic simulation / Phase equilibria / 半導体パッケッジ
Research Abstract

The Pb-Sn alloy was widely used as micro-soldering materials in electronic packaging. However, The Sn base Pb-free solders to replace conventional Pb-Sn alloys have been designed and developed to meet the requirements arising from environmental and health issues concerning the toxicity of Pb. The interfacial reaction and microstructure between Cu substrate and Sn base Pb-free solders to the reliability of electronic packaging are very important. In the present project, the interfacial reaction and microstructure between Cu substrate and Sn base Pb-free solders were experimentally investigated. The main research results are as follows :
(1) In order to obtain the information related to microstructure control and phase equilibria, the phase diagrams in the Cu-Sn-X system (X : Ag, Bi, In, Sb, Zn) were experimentally determined in some important alloy systems for which there has been little or no experimental data. The thermodynamic calculations for these systems were also carried out on the basis of CALPHAD method ( Calculation of Phase Diagrams). A good agreement between the calculated and experimental results is obtained.
(2) Cu/Sn-X alloy (X : Ag, Sb, In, Bi, Pb) solid/liquid diffusion couples were prepared, and treated at 250, 250 and 300℃. The dissolution behavior and morphology of microstructure in molten Sn base solders were investigated with different times and temperatures. In particular, the reason for the uneven interface between h phase and liquid phase was explained due to the grooving effect.
(3) On the basis of diffusion coefficients estimated by the present study and reported by previous works, the kinetic parameters describing the dissolution behavior between Cu and Sn-X solders were optimized. Using these parameters, the simulation of diffusion behavior was carried out, and calculated results are in good agreement with the experimental data.

Report

(3 results)
  • 2002 Annual Research Report   Final Research Report Summary
  • 2001 Annual Research Report
  • Research Products

    (17 results)

All Other

All Publications (17 results)

  • [Publications] X.J.Liu: "Experimental Determinatioii and Thermodynamic Calculation of the Phase Equilibria in the Cu-In-Sn System"Journal of ELECTRONIC MATERIALS. 30・9. 1093-1103 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Experimental Determination and Thermodynamic Calculation of the Phase Eqnilibria and Surface Tension in the Sn-Ag-In System"Journal of ELECTRONIC MATERIALS. 31・11. 1139-1151 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Development of Pb-free Solders in Electronic Packaging Designed by Thermodynamic and Kinetics"Journal of Iron and Steel International. 6・1. 333-336 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] H.S.Liu: "Thermodynamic Assessment of the Cu-In Binary System"Journal of Phase Equilibria. 23・5. 409-415 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] Y.Cui: "Thermodynamic Calculation of Phase Diagram in the Bi-In-Sb Ternar System"Materials Transaction. 43・8. 1879-1886 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Thermodynamic Database on Micro-solders and Copper Base Alloy Systems"Journal of Electronic Materials. (in press). (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Mechanics and Materials Engineering for Science and Experiments"Science Press, New York. 623 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Experimental Determination and Thermodynamic Calculation of the Phase Equilibria in the Cu-In-Sn System"Journal of Electronic Materials. 30-9. 1093-1103 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Experimental Determination and Thermodynamic Calculation of the Phase Equilibria and Surface Tension in the Sn-Ag-In System"Journal of Electronic Materials. 31-11. 1139-1151 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Development of Pb-free Solders in Electronic Packaging Designed by Thermodynamic and Kinetics"Journal of Iron and Steel International. 6-1. 333-336 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] H.S.Liu: "Thermodynamic Assessment of the Cu-In Binary System"Journal of Phase Equilibria. 23-5. 409-415 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] Y.Cui: "Thermodynamic Calculation of Phase Diagram in the Bi-In-Sb Ternary System"Materials Transaction. 43-8. 1879-1886 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Thermodynamic Database on Micro-solders and Copper Base Alloy Systems"Journal of Electronic Materials, in press. (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Science Press, New York"Mechanics and Materials Engineering for Science and Experiments. 623 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] X.J.Liu: "Experimental Determination and Thermodynamic Calculation of the Phase Equilibria and Surface Tension in the Sn-Ag-In System"Journal of ELECTRONIC MATERIALS. 31・11. 1139-1151 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] X.J.Liu: "Development of Pb-free Solders in Electronic Packaging Designed by Thermodynamic and Kinetics"Journal of Iron and Steel International. 6・1. 333-336 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] X.J.Liu: "Experimental Determination and Thermodynamic Calculation of the Phase Equilibria in the Cu-In-Sn System"Journal of ELECTRONIC MATERIALS. 30・9. 1093-1103 (2001)

    • Related Report
      2001 Annual Research Report

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Published: 2001-04-01   Modified: 2016-04-21  

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