Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human vision
| Project/Area Number |
15H01812
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| Research Category |
Grant-in-Aid for Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Medical systems
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| Research Institution | Tohoku University |
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Principal Investigator |
TANAKA Tetsu 東北大学, 医工学研究科, 教授 (40417382)
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| Co-Investigator(Kenkyū-buntansha) |
福島 誉史 東北大学, 工学研究科, 准教授 (10374969)
富田 浩史 岩手大学, 理工学部, 教授 (40302088)
清山 浩司 長崎総合科学大学, 工学部, 准教授 (60412722)
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| Co-Investigator(Renkei-kenkyūsha) |
KOYANAGI Mitsumasa 東北大学, 未来科学技術共同研究センター, 名誉教授 (60205531)
SUGANO Eriko 岩手大学, 理工学部, 准教授 (70375210)
KINO Hisashi 東北大学, 学際科学フロンティア研究所, 助教 (10633406)
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| Project Period (FY) |
2015-04-01 – 2018-03-31
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| Project Status |
Completed (Fiscal Year 2017)
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| Budget Amount *help |
¥39,000,000 (Direct Cost: ¥30,000,000、Indirect Cost: ¥9,000,000)
Fiscal Year 2017: ¥11,310,000 (Direct Cost: ¥8,700,000、Indirect Cost: ¥2,610,000)
Fiscal Year 2016: ¥12,090,000 (Direct Cost: ¥9,300,000、Indirect Cost: ¥2,790,000)
Fiscal Year 2015: ¥15,600,000 (Direct Cost: ¥12,000,000、Indirect Cost: ¥3,600,000)
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| Keywords | 人工網膜 / 三次元集積回路 / 医用システム / 生体医工学 / 人工視覚 / 人間医工学 |
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| Outline of Final Research Achievements |
In order to restore visual sensation of blind patients such as age-related macular degeneration and retinitis pigmentosa, a fully-implantable retinal prosthesis have been developed in this research. The fully implantable retinal prosthesis consists of an intraocular and extraocular units. The intraocular unit has a coupling coil, a stimulus electrode array, and a 3-D stacked retinal prosthesis chip. The 3-D stacked retinal prosthesis chip is composed of a photoreceptor chip and a stimulus current generator chip. In this research, power dissipation of the stimulus current generator chip with an edge enhancement function successfully decreased to 62% due to no idling function. Other functions such as dark current compensation and temperature compensation were implemented into the circuit. A transparent stimulus electrode using Al-doped ZnO was successfully developed and showed appropriate CIC and electrical impedance values, which leads to x3 photoelectric conversion performance.
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Report
(4 results)
Research Products
(57 results)
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[Presentation] Wide-range and precise tissue impedance anaysis circuit with ultralow current source using gate-induced drain-leakage current2016
Author(s)
Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, and Tetsu Tanaka
Organizer
2016 IEEE Biomedical Circuits and Systems Conference(BioCAS 2016)
Place of Presentation
Hotel Pullman Shanghai Skyway, Shanghai, China
Year and Date
2016-10-17
Related Report
Int'l Joint Research
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[Presentation] Influence of Cu-TSVs, CuSn-and PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips2016
Author(s)
Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, and Tetsu Tanaka
Organizer
The 66th Electronic Components and Technology Conference (ECTC)
Place of Presentation
The Cosmopolitan of Las Vegas, Las Vegas, USA
Year and Date
2016-05-31
Related Report
Int'l Joint Research
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[Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Chip-to-Wafer Self-Assembly and Direct Bonding2016
Author(s)
Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Kangwook Lee, and Mitsumasa Koyanagi
Organizer
The 66th Electronic Components and Technology Conference (ECTC)
Place of Presentation
The Cosmopolitan of Las Vegas, Las Vegas, USA
Year and Date
2016-05-31
Related Report
Int'l Joint Research
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[Presentation] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications2015
Author(s)
Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, and Kang-Wook Lee
Organizer
2015 International Conference on Solid State Devices and Materials
Place of Presentation
Sapporo Convention Center, Sapporo, Japan
Year and Date
2015-09-27
Related Report
Int'l Joint Research
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[Presentation] Reconfigured Multichip-on-wafer (mCoW) Cu/oxide Hybrid Bonding Technology for Ultra-high Density 3D Integration Using Recessed Oxide, Thin Glue Adhesive, and Thin Metal Capping Layers2015
Author(s)
Kangwook Lee, Chisato Nagai, Ai Nakamura, H. Aizawa, H. Hashiguchi, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Organizer
IEEE 2015 International 3D Systems Integration Conference (3DIC)
Place of Presentation
Sendai International Center, Sendai, Japan
Year and Date
2015-08-31
Related Report
Int'l Joint Research
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[Presentation] Transfer and Non-transfer Stacking Technologies Based on Chip-to-wafer Self-assembly for High-throughput and High-precision Alignment and Microbump Bonding2015
Author(s)
Takafumi FUKUSHIMA, Taku SUZUKI, Hideto HASHIGUCHI, Chisato NAGAI, Jichoel BEA, Hiroyuki HASHIMOTO, Mariappan MURUGESAN, Kang-Wook LEE, Tetsu TANAKA, Kazushi ASAMI, Yasuhiro KITAMURA, and Mitsumasa KOYANAGI
Organizer
IEEE 2015 International 3D Systems Integration Conference (3DIC)
Place of Presentation
Sendai International Center, Sendai, Japan
Year and Date
2015-08-31
Related Report
Int'l Joint Research
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