Identification of the strength control factor in lead-free solder/plating interface at high strain rate
| Project/Area Number |
16560072
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Yamaguchi University |
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Principal Investigator |
KAMINISHI Ken Yamaguchi University, Graduate School of Innovation & Technology Management, Department of Technology Management, Professor, 大学院・技術経営研究科, 教授 (50177581)
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| Project Period (FY) |
2004 – 2005
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| Project Status |
Completed (Fiscal Year 2005)
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| Budget Amount *help |
¥3,700,000 (Direct Cost: ¥3,700,000)
Fiscal Year 2005: ¥1,000,000 (Direct Cost: ¥1,000,000)
Fiscal Year 2004: ¥2,700,000 (Direct Cost: ¥2,700,000)
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| Keywords | high strain rates / lead-free solder / finite element method / impact analysis / 任意曲線法 / 接合界面 |
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| Research Abstract |
The tensile characteristics of low melting point lead-free solder material at high strain rates were investigated using the impact tensile test equipment on the basis of the direct tension split Hopkinson bar technique. Furthermore, using the same test equipment, the impact tensile test of joint specimen was carried out in order to examine the impact strength of solder/plating interface. By finally using an electromotive force method and FEM analysis, the strength evaluation of BGA solder joints at high strain rates was performed. The results are summarized as follows :
1.The impact tensile strength of solder/plating interface decreased significantly with increasing strain rate.
2.By using the measurement of electromotive force and dynamic elastic-plastic FEM analysis, the impact strength of a lead-free solder ball mounted in the substrate could be evaluated.
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Report
(3 results)
Research Products
(2 results)
