| Budget Amount *help |
¥15,300,000 (Direct Cost: ¥15,300,000)
Fiscal Year 2006: ¥5,500,000 (Direct Cost: ¥5,500,000)
Fiscal Year 2005: ¥9,800,000 (Direct Cost: ¥9,800,000)
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| Research Abstract |
Using ultra-high polishing pressure and polishing speed, this research aims to develop the double side surface polishing method of ultra-high removal rate for various kinds of workpieces such as magnet disk substrate, silicon wafer and so on. The new type of double side surface polishing machine based on new concept is manufactured on trial. In the machine, the workpiece is rotated by the couple of the friction forces in the reverse directions to each other, which are caused from the contact between workpiece and upper or lower polishing plate. That is, in the rotation mechanism of workpiece, the gear is not used. On the contrary, in the conventional polishing machine, the rotation of workpiece is done with the gear cut on the outside circle of carrier holding the disk substrate. Furthermore the double side surface polishing characteristics in the conditions of ultra-high polishing pressure and polishing speed using the new type of machine is examined. The summary is as follows ;
1) Imp
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rovement of polishing machine
(1) Establishment of stable rotation technique of workpiece
First of all, the couple of friction forces is caused by stepping the polishing plate. In the method, to machine the plate the precise seep is difficult. And also the stable rotation of workpiece is obtained difficult. To resolve the problem, the new technique in which the contact friction force between the workpiece and polisher is changed by holing a part of the polisher (surface is developed. Using the method, the stable rotation of workpiece is done.
(2) Development of cooling system of polisher
In the polishing conditions of ultra-high pressure and speed, large polishing heat occurs. Due to the heat, polisher surface is damaged. To solve the problem, the cooling systems of polishing plate are developed. The method is useful for the remove of generated heat.
(3) Investigation of dynamic pressure on polishing characteristics
In the condition ultra-high polishing speed, large buoyancy is found to reduce polishing pressure. On the basis of the result, the relationship between removal rate and polishing condition is cleared experimentally.
2) Development of linear type of double surface polishing machine
A linear type of double surface polishing machine in which the workpiece is rotated by the couple of friction forces as mentioned above for the rotary type of new double surface polishing machine is manufactured on trial. The machine is ascertained possible to perform the effective polishing operation.
3) Investigation of polishing characteristics using the new type of double side surface polishing machine
To clear the polishing characteristics using the new type of polishing machine, the experiment is carried out by the various kinds of polishing conditions. The influence of polishing conditions on the removal rate and smoothness is cleared experimentally. Less
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