Study of s 40dBi gain waveguide-type planar antenna of simple structure with 90% efficiency at 100GHz
| Project/Area Number |
17360175
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Communication/Network engineering
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
HIROKAWA Jiro Tokyo Institute of Technology, Graduate School of Science and Engineering, Associate Professor (00228826)
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| Co-Investigator(Kenkyū-buntansha) |
ANDO Makoto Tokyo Institute of Technology, Graduate School of Science and Engineering, Professor (90159533)
HIRANO Takuichi Tokyo Institute of Technology, Graduate School of Science and Engineering, Assistant professor (60345361)
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| Project Period (FY) |
2005 – 2007
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| Project Status |
Completed (Fiscal Year 2007)
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| Budget Amount *help |
¥12,250,000 (Direct Cost: ¥11,800,000、Indirect Cost: ¥450,000)
Fiscal Year 2007: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2006: ¥3,100,000 (Direct Cost: ¥3,100,000)
Fiscal Year 2005: ¥7,200,000 (Direct Cost: ¥7,200,000)
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| Keywords | information communication technology / advanced communication / injection molding / precision component fabrication / algorithm / antenna / center feed / alternating-phase feed |
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| Research Abstract |
We fabricate the single-layer slotted waveguide array antenna by diffusion bonding of laminated thin metal plates at 94GHz. We expect to reduce the fabrication cost in comparison with conventional die-casting because we etch only three patterns for the slotted plate, the groove feeding structure and the base plate with an input aperture. This fabrication method can be applied to conventional complicated structures of double layers. We achieve 45% efficiency for 30dBi gain in the first fabrication. Unfortunately we have no time to expand this method to a 40dBi gain antenna.
We fabricate a 25mm-long straight waveguide at 94GHz by laser-hardening epoxy resin and by plating nickel. We expect to fabricate a complicated three-dimensional structure by one body seamlessly for reducing the connecting loss. We achieve 0.8dB transmission loss which is comparable to a conventional standard metal waveguide.
We put a 45mm-square-wide 0.4mm-thickness air layer in a 0.9mm-thickness copper-clad PTFE substrate. We expect to reduce the transmission loss by 40% in comparison with a conventional dielectric full-filled substrate. We also design the circuit to excite a TEM wave in the partially-filled substrate.
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Report
(4 results)
Research Products
(21 results)
