Research of MEMS-based uncooled infrared array sensor with space signal processing functions
| Project/Area Number |
17510109
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Microdevices/Nanodevices
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| Research Institution | Ritsumeikan University |
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Principal Investigator |
KIMATA Masafumi Ritsumeikan University, College of Science and Technology, Professor, 理工学部, 教授 (60388121)
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| Project Period (FY) |
2005 – 2006
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| Project Status |
Completed (Fiscal Year 2006)
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| Budget Amount *help |
¥3,600,000 (Direct Cost: ¥3,600,000)
Fiscal Year 2006: ¥2,300,000 (Direct Cost: ¥2,300,000)
Fiscal Year 2005: ¥1,300,000 (Direct Cost: ¥1,300,000)
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| Keywords | infrared sensor / thermal detector / MEMS / integrated device / signal processing |
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| Research Abstract |
The objective of this research is to prove an idea of a thermal infrared array sensor that has some image processing functions. An infrared array sensor having 10 x 10 thermopile infrared detectors with a 500μm x 500μm pixel size has been designed. The thermopile consists of p-type polysilicon and aluminum, which are available in the CMOS LSI process. An infrared absorption membrane has an area of 90,000 μm^2 and is held by four support legs above a cavity formed in a silicon substrate. A key feature of this infrared array is that each pixel has two temperature sensors for row and column and temperature sensors in a row and column are connected serially to obtain a sum of outputs. Designing the infrared detector array in this way, we can identify the position of a hot object in the two-dimensional space from the row and column that yield maximum signals if the size of the hot object corresponds to nearly one pixel area or smaller. We can also measure the area of hot object from a sum of all rows or all columns if the image of the hot object on the array sensor is larger than the pixel size. Infrared array sensors have been fabricated by a standard CMOS LSI process and post silicon XeF_2 dry bulk micromachining technology. Evaluating the fabricated devices, we have confirmed that these two functions have successfully been accomplished with our new array architecture. This infrared array sensor is positioned in a new field between single-element infrared detectors and high-resolution infrared focal plane arrays, and is useful for many non-imaging infrared applications.
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Report
(3 results)
Research Products
(23 results)
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[Journal Article] Chip scale vacuum package for uncooled IRFPA2007
Author(s)
Munehisa takeda, Hisatoshi Hata, Yoshiyuki Nakaki, Hiromoto Inoue, Yasuhiro Kosasayama, Yasuaki Ohta, Hiroshi Fukumoto, Toshiki Seto, Keisuke Kama, Masafumi Kimata
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Journal Title
IEEJ Transactions on Fundamentals and Materials, accepted
NAID
Description
「研究成果報告書概要(欧文)」より
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[Book] 薄膜ハンドブック2007
Author(s)
木股雅章
Publisher
オーム社(印刷中)
Description
「研究成果報告書概要(和文)」より
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