| Project/Area Number |
17560185
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Thermal engineering
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| Research Institution | KYOTO UNIVERSITY |
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Principal Investigator |
MATSUMOTO Mitsuhiro KYOTO UNIVERSITY, GRADUATE SCHOOL OF ENGINEERING, ASSOCIATE PROFESSOR, 工学研究科, 助教授 (10229578)
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| Co-Investigator(Kenkyū-buntansha) |
MORINO Toshiro KYOTO UNIVERSITY, GRADUATE SCHOOL OF ENGINEERING, PROFESSOR, 工学研究科, 教授 (30111941)
WAKABAYASHI Hidenobu KYOTO UNIVERSITY, GRADUATE SCHOOL OF ENGINEERING, RESEARCH ASSOCIATE, 工学研究科, 助手 (00273467)
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| Project Period (FY) |
2005 – 2006
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| Project Status |
Completed (Fiscal Year 2006)
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| Budget Amount *help |
¥3,500,000 (Direct Cost: ¥3,500,000)
Fiscal Year 2006: ¥1,100,000 (Direct Cost: ¥1,100,000)
Fiscal Year 2005: ¥2,400,000 (Direct Cost: ¥2,400,000)
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| Keywords | SOLID HEAT CONDUCTION / WIDE-GAP SEMICONDUCTOR / LATTICE VIBRATION ANALYSIS / THERMAL RESISTANCE / PHONON LIFETIME |
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| Research Abstract |
Wide-gap semiconductors, such as SiC and GaN, are prospective materials for their high electronic mobility. This project has aimed at nano-micro scale modeling of their thermal properties, especially heat transfer from the viewpoint of phonon propagation. Combined with large-scale molecular dynamics simulations, various phonon analysis technique based on statistical mechanics and Boltzmann transport equations, we have planned to develop a simulator to calculate thermal properties of solids with nano-scale structures.
In this project, we have done the following researches: (1) we developed alarge-scale efficient molecular dynamics (MD) simulation code for semiconducting materials and their interface. (2) we proposed a new technique of phonon analysis based on non-equilibrium MD simulations to estimate phonon relaxation time, with which technique we found that the relaxation time strongly depends on phonon frequency. (3) With this simulator, we investigated thermal transport properties of single crystals and various interfacial systems.
The main outcome of this project will be reported at ASME-JSME Thermal Engineering Summer Heat Transfer Conference (Vancouver, July, 2007) and also be published elsewhere.
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