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A digital temperature and voltage sensor that can reduce effects of degradation in VLSIs

Research Project

Project/Area Number 19K20236
Research Category

Grant-in-Aid for Early-Career Scientists

Allocation TypeMulti-year Fund
Review Section Basic Section 60040:Computer system-related
Research InstitutionKyushu Institute of Technology

Principal Investigator

Miyake Yousuke  九州工業大学, 大学院情報工学研究院, 研究職員 (60793403)

Project Period (FY) 2019-04-01 – 2022-03-31
Project Status Completed (Fiscal Year 2021)
Budget Amount *help
¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2020: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2019: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Keywords温度センサ / 電圧センサ / 劣化 / リングオシレータ / LSIテスト / フィールドテスト / VLSI設計技術 / ディペンダブル・コンピューティング / デジタルセンサ / NBTI劣化 / 信頼性試験 / 計算機システム / 情報工学
Outline of Research at the Start

VLSIはチップ内の温度や電圧により性能が変動するため,システムの高性能化・高信頼化にはチップの発熱状況や電圧変動の監視が重要である.センサをフィールド上で長期間運用し続けるためには劣化現象への対策が必要不可欠である.特に,最先端VLSIでは経年劣化に起因する故障の増加が懸念されている.しかしながら,従来センサの多くは劣化現象への対策が施されていない.本研究では,VLSIにおける劣化影響を低減可能なデジタル温度電圧センサ技術の開発するため,耐劣化構造を有するセンサや劣化影響の低減手法,劣化シミュレーション評価などを実施し,劣化が生じた場合でもセンサの測定精度を維持する技術について研究を行う.

Outline of Final Research Achievements

Since the performance of LSIs varies depending on the temperature and voltage inside the chip, monitoring the heat generation status and voltage fluctuation of the chip can be used to improve system performance and reliability. In order to continue to operate sensors in the field for a long period of time, it is indispensable to take measures against the degradation phenomenon.
The purpose of this work is to develop a digital temperature voltage sensor technology that can reduce the effects of degradation in VLSIs. A test chip with an aging-tolerant structure was designed using 65nm CMOS technology. Deterioration evaluation was proposed by a long-term reliability test that actually gives high stress conditions such as high temperature and high voltage to the chips. Using the obtained degradation data, we proposed a prediction model that reflecting changes in degradation trends due to the operating environment of chips in the field, and evaluated its effectiveness.

Academic Significance and Societal Importance of the Research Achievements

本研究ではセンサに劣化が生じた場合でも測定精度を維持するために,実チップでの劣化評価やフィールドでの運用状況に合わせて劣化予測のモデルを更新する手法などについての開発を行った.センサの劣化予測技術はVLSIのフィールド高信頼化が期待でき,予知保全に寄与するため,社会への波及効果は大きい.さらに,製品寿命を考慮したライフエンド設計への適用等,幅広い用途を見込むことができる.

Report

(4 results)
  • 2021 Annual Research Report   Final Research Report ( PDF )
  • 2020 Research-status Report
  • 2019 Research-status Report
  • Research Products

    (17 results)

All 2022 2021 2020 2019 Other

All Int'l Joint Research (3 results) Journal Article (8 results) (of which Int'l Joint Research: 4 results,  Peer Reviewed: 7 results) Presentation (6 results)

  • [Int'l Joint Research] 国立台湾科技大学(その他の国・地域:台湾)

    • Related Report
      2021 Annual Research Report
  • [Int'l Joint Research] 国立台湾科技大学(台湾)

    • Related Report
      2020 Research-status Report
  • [Int'l Joint Research] 国立台湾科技大学(その他の国・地域(台湾))

    • Related Report
      2019 Research-status Report
  • [Journal Article] High Precision PLL Delay Matrix with Overclocking and Double Data Rate for Accurate FPGA Time-to-Digital Converter2020

    • Author(s)
      Poki Chen, Jian-Ting Lan, Ray-Ting Wang, Nguyen My Qui, Yousuke Miyake and Seiji Kajihara
    • Journal Title

      IEEE Transactions on Very Large Scale Integration Systems

      Volume: Volume: 28, Issue: 4 Issue: 4 Pages: 904-913

    • DOI

      10.1109/tvlsi.2019.2962606

    • Related Report
      2020 Research-status Report 2019 Research-status Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] On-Chip Delay Measurement for Degradation Detection And Its Evaluation under Accelerated Life Test2020

    • Author(s)
      Yousuke Miyake, Takaaki Kato, Seiji KAJIHARA, Masao ASO, Haruji FUTAMI, Satoshi MATSUNAGA, Yukiya MIURA,
    • Journal Title

      IEEE International Symposium on On-Line Testing and Robust System Design, On-line symposium

      Volume: - Pages: 1-6

    • DOI

      10.1109/iolts50870.2020.9159717

    • NAID

      120007006773

    • Related Report
      2020 Research-status Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] Path Delay Measurement with Correction for Temperature and Voltage Variations2020

    • Author(s)
      Yousuke Miyake,Takaaki Kato, Seiji KAJIHARA
    • Journal Title

      IEEE International Test Conference in Asia

      Volume: - Pages: 112-117

    • DOI

      10.1109/itc-asia51099.2020.00031

    • NAID

      120007006757

    • Related Report
      2020 Research-status Report
    • Peer Reviewed
  • [Journal Article] On Evaluation for Aging-Tolerant Ring Oscillators with Accelerated Life Test And Its Application to A Digital Sensor2020

    • Author(s)
      Masayuki Gondo, Yousuke Miyake, Takaaki Kato, Seiji Kajihara
    • Journal Title

      Proc. IEEE Asian Test Symposium

      Volume: - Pages: 1-6

    • DOI

      10.1109/ats49688.2020.9301588

    • NAID

      120007006769

    • Related Report
      2020 Research-status Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] Innovative Test Practices in Asia2020

    • Author(s)
      Takeshi Iwasaki, Masao Aso, Haruji Futami, Satoshi Matsunaga, Yousuke Miyake, Takaaki Kato, Seiji Kajihara, Yukiya Miura, Smith Lai, Gavin Hung, Harry H. Chen, Haruo Kobayashi, Kazumi Hatayama
    • Journal Title

      Proc. IEEE VLSI Test Symposium

      Volume: - Pages: 1-1

    • DOI

      10.1109/vts48691.2020.9107640

    • Related Report
      2020 Research-status Report
  • [Journal Article] A Selection Method of Ring Oscillators for An On-Chip Digital Temperature And Voltage Sensor2019

    • Author(s)
      Miyake Yousuke、Sato Yasuo、Kajihara Seiji
    • Journal Title

      IEEE International Test Conference in Asia

      Volume: - Pages: 13-18

    • DOI

      10.1109/itc-asia.2019.00016

    • NAID

      120006777000

    • Related Report
      2019 Research-status Report
    • Peer Reviewed
  • [Journal Article] On-Chip Test Clock Validation Using A Time-to-Digital Converter in FPGAs2019

    • Author(s)
      Yousuke Miyake, Seiji Kajihara, Poki Chen
    • Journal Title

      IEEE International Test Conference in Asia

      Volume: - Pages: 57-162

    • DOI

      10.1109/itc-asia.2019.00040

    • NAID

      120006777001

    • Related Report
      2019 Research-status Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] On-Chip Delay Measurement for In-Field Test of FPGAs2019

    • Author(s)
      Yousuke Miyake, Yasuo Sato, Seiji Kajihara
    • Journal Title

      Proc. IEEE Pacific Rim International Symposium on Dependable Computing (PRDC)

      Volume: - Pages: 130-137

    • DOI

      10.1109/prdc47002.2019.00043

    • NAID

      120007006775

    • Related Report
      2019 Research-status Report
    • Peer Reviewed
  • [Presentation] オンチップ遅延測定における温度電圧の影響補正について2022

    • Author(s)
      加藤隆明, 三宅庸資, 梶原誠司
    • Organizer
      電子情報通信学会技術研究報告
    • Related Report
      2021 Annual Research Report
  • [Presentation] 回路の動作状況の違いに伴う劣化予測モデル更新の有効性について2021

    • Author(s)
      権藤昌之, 三宅庸資, 加藤隆明, 梶原誠司
    • Organizer
      電子情報通信学会2021年総合大会
    • Related Report
      2020 Research-status Report
  • [Presentation] 勾配降下法を用いた回路遅延の劣化予測について2020

    • Author(s)
      森誠一郎, 権藤昌之, 三宅庸資, 加藤隆明, 梶原誠司
    • Organizer
      電子情報通信学会ディペンダブルコンピューティング研究会
    • Related Report
      2020 Research-status Report
  • [Presentation] 機械学習を用いたデジタル温度電圧センサの精度向上について2020

    • Author(s)
      権藤昌之, 三宅庸資, 梶原誠司
    • Organizer
      電子情報通信学会技術研究報告,DC研究会
    • Related Report
      2019 Research-status Report
  • [Presentation] フィールドテスト向けオンチップ遅延測定回路のIoT適用2020

    • Author(s)
      三宅庸資, 梶原誠司
    • Organizer
      電子情報通信学会2020年総合大会
    • Related Report
      2019 Research-status Report
  • [Presentation] 長期信頼性試験におけるオンチップ遅延測定による劣化観測2019

    • Author(s)
      三宅庸資, 加藤隆明, 梶原誠司, 麻生正雄, 二見治司, 松永恵士, 三浦幸也
    • Organizer
      電子情報通信学会技術研究報告,DC研究会
    • Related Report
      2019 Research-status Report

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Published: 2019-04-18   Modified: 2023-01-30  

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