Tin whisker growth mechanism in aerospace electronics and its mitigation

• Project/Area Number: 21246109
• Research Category: Grant-in-Aid for Scientific Research (A)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Material processing/treatments
• Research Institution: Osaka University
• Principal Investigator: SUGANUMA Katsuaki 大阪大学, 産業科学研究所, 教授 (10154444)
• Co-Investigator(Kenkyū-buntansha): KIM Keun-soo 大阪大学, 産業科学研究所, 助教 (90304857)
• Research Collaborator: NEMOTO Norio 独立行政法人宇宙航空研究開発機構, 安全信頼性推進部技術開発室, 技術領域リーダ ; NAKAGAWA Tsuyoshi 日本アビオニクス株式会社, 情報システム事業部第二技術部, エキスパート
• Project Period (FY): 2009-04-01 – 2013-03-31
• Project Status: Declined (Fiscal Year 2012)
• Budget Amount: ¥45,630,000 (Direct Cost: ¥35,100,000、Indirect Cost: ¥10,530,000); Fiscal Year 2012: ¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000); Fiscal Year 2011: ¥5,590,000 (Direct Cost: ¥4,300,000、Indirect Cost: ¥1,290,000); Fiscal Year 2010: ¥12,090,000 (Direct Cost: ¥9,300,000、Indirect Cost: ¥2,790,000); Fiscal Year 2009: ¥23,400,000 (Direct Cost: ¥18,000,000、Indirect Cost: ¥5,400,000)
• Keywords: 電気接続・配線 / ウィスカ / 温度サイクル / 真空 / 酸化 / 宇宙機器 / 信頼性 / 金属物性 / 微細接続 / 高密度実装

Research Abstract

Tin whiskers is one of the serious issues for aeronautics and the growth mechanism has not been understood yet. In the present work, the influence of vacuum environment on whisker formation in thermal cycling was examined. It was found that whiskers grow thinner and longer in vacuum than in air and that oxidation of tin has great influence. The whisker growth mechanism not only in vacuum but also in air was clearly clarified.

Research Products

• [Journal Article] Effect of crystal orientation on mechanically induced Sn whiskers on Sn-Cu plating (2012)
  • Author(s): Y. Mizuguchi, Y. Murakami, S. Tomiya, T. Asai, T. Kiga, K. Suganuma
  • Journal Title: J. Electron. Mater Volume: 53[12](in press)
  • Peer Reviewed
• [Journal Article] コンフォーマルコーティングによるウィスカ成長性抑制効果の評価 (2012)
  • Author(s): 中川 剛, 根本規生, 山田敏行, 菅沼克昭
  • Journal Title: 電子情報通信学会論文誌 Volume: J95-C [11](in press)
  • NAID: 110009543935
  • Peer Reviewed
• [Journal Article] 機械的応力により発生する Sn ウィスカにおける屈曲・湾曲部の形成と結晶方位の関係性 (2012)
  • Author(s): 水口由紀子, 村上洋介, 冨谷茂隆, 浅井正, 気賀智也, 菅沼克昭
  • Journal Title: 電子情報通信学会論文誌 Volume: J95-C [11](in press)
  • NAID: 110009543934
  • Peer Reviewed
• [Journal Article] Effect of crystal orientation on Sn whisker-free Sn-Ag-Cu plating (2012)
  • Author(s): Y . Mizuguchi, Y . Murakami, S. Tomiya, T .Asai, T . Kiga, K. Suganuma
  • Journal Title: Mater. Trans Volume: (in press)
  • NAID: 10031127211
  • Peer Reviewed
• [Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/ Cu ball joints (2012)
  • Author(s): K. Lee, K.-S. Kim, K. Suganuma, Y . Tsukada, K.Yamanaka, S. Kuritani, M. Ueshima
  • Journal Title: J.Mater.Res Volume: 26[3] Pages: 467-474
  • Peer Reviewed
• [Journal Article] Effect of i ntermetallic growth rate on spontaneous whisker growth from a t in coating on copper (2011)
  • Author(s): A. Baated, K.-S. Kim, K. Suganuma
  • Journal Title: J. Mater. Sci.Mater. Electron. Volume: 22 Issue: 11 Pages: 1685-1693
  • DOI: 10.1007/s10854-011-0346-5
  • Peer Reviewed
• [Journal Article] Whiskergrowth behavior of Sn and Sn alloy lead-free finishes (2011)
  • Author(s): A. Baated, K.-S. Kim, K. Suganuma
  • Journal Title: J. Electron. Mater. Volume: 40[11] Pages: 2278-2289
  • Peer Reviewed
• [Journal Article] Sn whisker growth during thermal cycling (2011)
  • Author(s): K. Suganuma, A. Baated, K. -S. Kim, K.Hamasaki, N. Nemoto, T . Nakagawa, T . Yamada
  • Journal Title: Acta Materialia Volume: 59[1] Pages: 7255-7267
  • Peer Reviewed
• [Journal Article] Influence of crystallographic orientation of Sn-Ag- Cu on electromigration in flip-chip joint (2011)
  • Author(s): K. Lee, K.-S. Kim, K. Suganuma
  • Journal Title: Microelectron. Reliab. Volume: 51[12] Pages: 2290-2297
  • Peer Reviewed
• [Journal Article] Influence of indium addition on electromigration behavior of solder joint (2011)
  • Author(s): K. Lee, K.-S. Kim, K. Suganuma
  • Journal Title: J. Mater. Res. Volume: 26[20] Pages: 2624-2631
  • Peer Reviewed
• [Journal Article] 鉛フリーはんだ実装技術の高付加価値化、 (2011)
  • Author(s): 菅沼克昭
  • Journal Title: ロボット Volume: No.203 Pages: 34-37
  • Peer Reviewed
• [Journal Article] Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint (2011)
  • Author(s): K.Lee, K.-S.Kim, K.Suganuma
  • Journal Title: Microelectronics Reliability Volume: 51[12] Pages: 2290-2297
  • Peer Reviewed
• [Journal Article] Whisker growth behavior of Sn and Sn alloy lead-free finishes (2011)
  • Author(s): A.Baated, K.-S.Kim, K.Suganuma
  • Journal Title: J.Electron.Mater. Volume: 40[11] Issue: 11 Pages: 2278-2289
  • DOI: 10.1007/s11664-011-1712-z
  • Peer Reviewed
• [Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints (2011)
  • Author(s): K.Lee, K.-S.Kim, K.Suganuma, Y.Tsukada, K.Yamanaka, S.Kuritani, M.Ueshima
  • Journal Title: J.Mater.Res. Volume: 26[3] Pages: 467-474
  • Peer Reviewed
• [Journal Article] Whisker growth from an e lectroplated zinc coating (2010)
  • Author(s): A. Baated, K. -S. Kim, K. Suganuma
  • Journal Title: J. Mater. Res. Volume: 25[11] Pages: 2175-2182
  • Peer Reviewed
• [Journal Article] Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders (2010)
  • Author(s): A. Baated, K.- S. Kim, K. Suganuma, S. Huang, B.Ju rcik , S. Nozawa, M. Ueshima
  • Journal Title: J. Mater. Sci. Mater. Electron. Volume: 21 Pages: 1066-1075
  • Peer Reviewed
• [Journal Article] 錫ウィスカ成長に及ぼす端子材の影響 (2010)
  • Author(s): 金 槿銖,菅沼克昭,寄門雄飛,李奇柱,阿龍恒,辻本雅宣
  • Journal Title: 銅と銅合金 Volume: 49 Pages: 122-115
  • Peer Reviewed
• [Journal Article] 宇宙分野におけるすずウィスカの影響 (2010)
  • Author(s): 根本規生、鈴木浩一、 中川 剛、山田敏行、菅沼克昭
  • Journal Title: 第23回秋季信頼性シンポジウム発表報文集、東京 Pages: 15-18
  • Peer Reviewed
• [Journal Article] 錫ウィスカ抑制技術 (2010)
  • Author(s): 金 槿銖、 菅沼克昭
  • Journal Title: 生産と技術 Volume: Vol.62、No.3 Pages: 16-19
  • NAID: 40017219420
  • Peer Reviewed
• [Journal Article] Whisker growth from an electroplated zinc coating (2010)
  • Author(s): A.Baated, K.S.Kim, K.Suganuma
  • Journal Title: J.Mater.Res. Volume: 25[11] Pages: 2175-2182
  • Peer Reviewed
• [Journal Article] 錫ウィスカ成長に及ぼす端子材の影響 (2010)
  • Author(s): 金槿銖, 菅沼克昭, 寄門雄飛, 李奇柱, 阿龍恒, 辻本雅宣
  • Journal Title: 銅と銅合金 Volume: 49 Pages: 112-115
  • Peer Reviewed
• [Journal Article] 錫ウィスカ抑制技術 (2010)
  • Author(s): 金槿銖, 菅沼克昭
  • Journal Title: 生産と技術 Volume: 62[3] Pages: 16-19
  • NAID: 40017219420
• [Presentation] Effect of Crystal Orientation on Mechanically Induced Sn Whiskers of Sn-Cu Platings (2012)
  • Author(s): Y.Mizuguchi, Y.Murakami, S.Tomiya, T.Asai, T.Kiga, K.Suganuma
  • Organizer: 2012 TMS Annual Meeting & Exhibition
  • Place of Presentation: 米国フロリダ(招待講演)
  • Year and Date: 2012-03-12
• [Presentation] Effect of crystal orientation on mechanically induced Sn whiskers of Sn-Cu platings (2012)
  • Author(s): Y. Mizuguchi, Y. Murakami, S Tomiya, T. Asai, T. Kiga, K. Suganuma
  • Organizer: 2012TMS Annual Meeting & Exhibition
  • Place of Presentation: Orlando, FL, USA
• [Presentation] Behaviors of Sn surface with whisker generation after thermal cycle (2011)
  • Author(s): J.-L.Jo, K.Lee, K.Suganuma
  • Organizer: International Symposium on materials Science and Innovaytion for Sustainable Society, Eco-Materials and Eco-innovation for Global Sustainability
  • Place of Presentation: 大阪
  • Year and Date: 2011-11-30
• [Presentation] Pb 微量添加による室温 Sn ウィスカ発生の抑制と組織的特徴 (2011)
  • Author(s): 趙 亭來, 濱崎 恭子, 菅沼克昭, 辻本 雅宣
  • Organizer: 日本金属学会2011 年秋季大会
  • Place of Presentation: 沖縄コンベンションセンター(沖縄)
  • Year and Date: 2011-11-07
• [Presentation] Pb微量添加による室温Snウィスカ発生の抑制と組織的特徴 (2011)
  • Author(s): 趙亭來, 濱崎恭子, 菅沼克昭, 辻本雅宣
  • Organizer: 日本金属学会2011年秋季大会
  • Place of Presentation: 沖縄
  • Year and Date: 2011-11-07
• [Presentation] Behaviors of Sn surface with whisker generation after thermal cycle (2011)
  • Author(s): J.-L. Jo, K. Lee, K. Suganuma
  • Organizer: International Symposium on materials Science and Innovation for Sustainable Society, Eco-Materials and Eco-innovation for Global Sustainability
  • Place of Presentation: Osaka
• [Presentation] Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling (2011)
  • Author(s): J.-L. Jo, K.-S. Kim, K. Suganuma
  • Organizer: MS&T 2011, Ohio USA
  • Place of Presentation: Ohio, USA
• [Presentation] Electromigration behavior of Sn-In lead-free solder alloy under high current stress (2011)
  • Author(s): K. Lee, K.-S. Kim, K. Suganuma
  • Organizer: 2011 TMS Annual Meeting & Exhibition
  • Place of Presentation: San Diego, CA, USA
• [Presentation] Whisker growth behavior in a high vacuum with thermal cycling (2011)
  • Author(s): K.-S. Kim, J.-L. Jo, K.-J. Lee, A. Baated, K.Suganuma, N. Nemoto, T. Nakagawa, Toshiyuki Yamada
  • Organizer: 2011 TMS Annual Meeting & Exhibition
  • Place of Presentation: San Diego, CA, USA
• [Presentation] Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling (2011)
  • Author(s): J.-L.Jo, K.-S.Kim, K.Suganuma
  • Organizer: MS&T 2011, TMS
  • Place of Presentation: 米国オハイオ
• [Presentation] Whisker growth behavior in a high vacuum with thermal cycling (2011)
  • Author(s): K.S.Kim, J.L.Jo, K.Lee, A.Baated, K.Suganuma
  • Organizer: 2011 TMS Annual Meeting
  • Place of Presentation: San Diego, USA(招待)
• [Presentation] 錫ウィスカ発生メカニズムと抑制策(招待講演) (2010)
  • Author(s): 菅沼克昭
  • Organizer: 日本航空宇宙工業会素材専門委員会
  • Place of Presentation: 日本航空宇宙工業会(東京)
  • Year and Date: 2010-09-30
• [Presentation] 錫ウィスカ発生メカニズムと抑制策 (2010)
  • Author(s): 菅沼克昭
  • Organizer: 日本航空宇宙工業会素材専門委員会
  • Place of Presentation: 東京(招待)
  • Year and Date: 2010-09-30
• [Presentation] 鉛フリー実装は新たなステージへ～高信頼化のためのキーワード:ウィスカ、耐熱、更に高温/低温化へ～(招待講演) (2010)
  • Author(s): 菅沼克昭
  • Organizer: 京都実装技術・信頼性研究会第五回例会
  • Place of Presentation: 京都府産業支援センター(京都)
  • Year and Date: 2010-03-16
• [Presentation] 亜鉛ウィスカの発生及びそのメカニズム (2010)
  • Author(s): 阿龍恒, 金槿銖, 菅沼克昭
  • Organizer: エレクトロニクス実装学会
  • Place of Presentation: 芝浦工業大学(東京都)
  • Year and Date: 2010-03-10
• [Presentation] めっき膜と界面の微細構造とウィスカ発生の関連、 電子実装ウィスカ防止技術フォーラム (2010)
  • Author(s): 菅沼克昭
  • Organizer: 電子情報技術産業協会
  • Place of Presentation: 芝浦工業大学豊洲キャンパス(東京)
  • Year and Date: 2010-03-02
• [Presentation] めっき膜と界面の微細構造とウィスカ発生の関連 (2010)
  • Author(s): 菅沼克昭
  • Organizer: 電子実装ウィスカ防止技術フォーラム
  • Place of Presentation: 芝浦工業大学(東京都)
  • Year and Date: 2010-03-02
• [Presentation] Tin Whisker Growth in Vacuum Thermal Cycling (2010)
  • Author(s): K.Suganuma, A.Baated, S.Kim, K.S.Kim, N.Nemoto, T.Nakagawa, T.Yamada
  • Organizer: 139th TMS Annual Meeting & Exhibition
  • Place of Presentation: シアトル(アメリカ)
  • Year and Date: 2010-02-15
• [Presentation] Effects of alloying on tin whisker growth and some finding on fatigue mechanism (2010)
  • Author(s): K. Suganuma
  • Organizer: 6th Lead-Free Solder and Technology Workshop:139th Annual Meeting & Exhibition
  • Place of Presentation: Seattle
  • Year and Date: 2010-02-14
• [Presentation] whisker evaluation status for space applicatio (2010)
  • Author(s): T. Nakagawa, T. Yamada, N. Nemoto, K.Suganuma
  • Organizer: 4th International Symposium on Tin Whiskers
  • Place of Presentation: Maryland
• [Presentation] Tin whisker evaluation status for space application (2010)
  • Author(s): N. Nemoto, T. Nakagawa, T. Yamada, K.Suganuma
  • Organizer: 4th International Symposium on Tin Whiskers
  • Place of Presentation: Maryland
• [Presentation] Prevention technologies of whisker growth for reliable electronic products (2010)
  • Author(s): K. Suganuma
  • Organizer: 11thJIC meeting (Jisso International Council)
  • Place of Presentation: Kyoto Japan
• [Presentation] Intermetallic growth rate effects on spontaneous whisker growth from Tin coating on Copper (2010)
  • Author(s): A.Baated, K.S.Kim, K.Suganuma
  • Organizer: International Conference on Electronics Packaging
  • Place of Presentation: 札幌
• [Presentation] Prevention technologies of whisker growth for reliable electronic products (2010)
  • Author(s): K.Suganuma
  • Organizer: 11^<th> JIC meeting (JEITA)
  • Place of Presentation: Kyoto(招待)
• [Presentation] Evaluation of Conformal Coating for Mitigation of Tin Whisker Growth (Part II) (2010)
  • Author(s): T.Nakagawa, T Yamada, N.Nemoto, K.Suganuma
  • Organizer: 4th International Symposium on Tin Whiskers
  • Place of Presentation: Maryland, USA
• [Presentation] Tin Whisker Evaluation Status for Space Application (2010)
  • Author(s): N.Nemoto, T.Nakagawa, T.Yamada, K. Suganuma
  • Organizer: 4th International Symposium on Tin Whiskers
  • Place of Presentation: Maryland, USA
• [Presentation] 錫ウィスカ成長に及ぼす端子材の影響 (2009)
  • Author(s): 金槿銖, 李奇柱, アローハン, 濱崎恭子, 菅沼克昭, 辻本雅宣, 寄門雄飛
  • Organizer: 第49回銅及び銅合金技術研究会講演大会
  • Place of Presentation: 京都テルサ(京都府)
  • Year and Date: 2009-11-11
• [Presentation] Snウィスカ成長に及ぼすSnめっき構造と表面コート層の影響 (2009)
  • Author(s): 金槿銖, 濱崎恭子, 李奇柱, アローハン, 菅沼克昭, 辻本雅宣
  • Organizer: マイクロエレクトロニクスシンポジウム(MES2009)
  • Place of Presentation: 福岡大学(福岡県)
  • Year and Date: 2009-09-10
• [Presentation] Room temperature whiskers, thermal cycling whiskers and alloying effects (2009)
  • Author(s): K. Suganuma, K.S. Kim, Y. Shimada, K. Yamamoto, T. Kudoh, N. Nakamura, H. Oshima, S. Hayashi
  • Organizer: 3rd International Symposium on Tin Whiskers
  • Place of Presentation: Lyngby
  • Year and Date: 2009-06-23
• [Presentation] Room Temperature Whiskers, Thermal cycling Whiskers and Alloying Effects (2009)
  • Author(s): K.Suganuma, K.S.Kim, Y.Shimada, K.Yamamoto, T.Kudoh, N.Nakamura, H.Oshima, S.Hayashi
  • Organizer: 3^<rd> International Symposium on Tin Whiskers
  • Place of Presentation: リンビー(デンマーク)
  • Year and Date: 2009-06-23
• [Book] Lead-Free Solders; Materials Reliability for Electronics, ed.by K. N. Subramanian (2012)
  • Author(s): K. Suganuma, Tin whiskers
  • Publisher: John Wiley and Sons Ltd
• [Book] Sn ウィスカによる機器故障の歴史、フレキシブルプリント配線板の最新応用技術 (2009)
  • Author(s): 菅沼克昭
  • Publisher: CMC 出版
• [Book] 環境調和型エレクトロニクスの信頼性向上 (2009)
  • Author(s): 菅沼克昭(監修)
  • Total Pages: 344
  • Publisher: シーエムシー出版
• [Remarks] ホームページ「鉛フリー相談室」において、ウィスカ現象など様々な技術相談を実施している。
  • URL: http://www.eco.sanken.osaka-u.ac.jp/PbFree/