A Study on education system for packaging reliability of next generation Sic power device.

• Project/Area Number: 22360047
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Materials/Mechanics of materials
• Research Institution: Yokohama National University
• Principal Investigator: YU Qiang 横浜国立大学, 大学院・工学研究院, 教授 (80242379)
• Co-Investigator(Kenkyū-buntansha): SHIBUTANI Tadahiro 横浜国立大学, 環境情報研究院, 准教授 (10332644) ; SHIRATORI Masaki 横浜国立大学, 安心・安全の科学教育センター, 特任教授 (60017986)
• Project Period (FY): 2010 – 2012
• Project Status: Completed (Fiscal Year 2012)
• Budget Amount: ¥18,850,000 (Direct Cost: ¥14,500,000、Indirect Cost: ¥4,350,000); Fiscal Year 2012: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000); Fiscal Year 2011: ¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000); Fiscal Year 2010: ¥10,010,000 (Direct Cost: ¥7,700,000、Indirect Cost: ¥2,310,000)
• Keywords: 疲労 / 接合技術 / 信頼性 / 計算力学

Research Abstract

A new evaluation system for next generation SiC power device was established. The new experimental measurement method and the reliability evaluation approach have been proposed for the new Ag nano joints. And a new simulation system considering the fatigue process has been developed to assess the reliability behavior of the power modules.

Research Products

• [Journal Article] PWB Micro-Structural Influences over Drop Reliability in Mobile Devices (2010)
  • Author(s): Takayoshi Katahira, Masato, Fujita, Qiang Yu
  • Journal Title: Journal of Solid Mechanics and Materials Engineering Volume: Vo1.4 Pages: 24-28
  • Peer Reviewed
• [Journal Article] Reliability Evaluation on Deterioration of Power Device Using Coupled Electrica1- Therma1-Mechanical Analysis (2010)
  • Author(s): Takashi Anzawa, Qiang Yu, Masanori Yamagiwa Tadahiro Shibutani, Masaki Shiratori
  • Journal Title: Journal of Electronic Packaging(ASME JEP) Volume: 132
  • Peer Reviewed
• [Journal Article] PWB Micro-Structural Influences over Drop Reliability in MobileDevices (2010)
  • Author(s): Takayoshi Katahira, MasatoFujita, Qiang Yu
  • Journal Title: Journal of Solid Mechanics and MaterialsEngineering Volume: Vol.4 Pages: 24-28
  • Peer Reviewed
• [Journal Article] Reliability Evaluation on Deterioration of Power Device Using CoupledElectrical-Thermal-Mechanical Analysis (2010)
  • Author(s): Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, TadahiroShibutani, Masaki Shiratori
  • Journal Title: Journal of Electronic Packaging(ASME JEP), 132, Iss.3 Selected Paper(ThETA2) Volume: v6.132, N.3 Pages: 1-6
  • Peer Reviewed
• [Presentation] Measurement Methods for Curing Properties of Resin Considering Process Condition (2012)
  • Author(s): Tomohiko Takeda, Qiang Yu, Hiroyuki Sato
  • Organizer: Itherm2012
  • Place of Presentation: San Diego(USA)
• [Presentation] Reliable Evaluation Method for Solder Joints in Vehicle Electronics Devices Considering the Actual Use Conditions (2012)
  • Author(s): Satoru Okuyama, Qiang Yu, Ttakahiro Akutsu
  • Organizer: Itherm2012
  • Place of Presentation: SanDiego(USA)
• [Presentation] Study on Thermal Design due to Downsizing of Power Module Using Coupled Electrica1-Therma1-Mechanical Analysis (2012)
  • Author(s): Yasutaka Yamada, Qiang Yu, Tomohiro, Takahashi, Yusuke Takagi
  • Organizer: EMAP2012
  • Place of Presentation: HongKong(China)
• [Presentation] A Study on Evaluation Method of new Packaging Structure for High-Temperature Power Device (2012)
  • Author(s): Akihiro Higuchi, Qiang Yu, Toshikazu Oshidari, Mingliang Cui
  • Organizer: EMAP2012
  • Place of Presentation: HongKong(China)
• [Presentation] Investigation of Thermal Fatigue Life Scatter of IVH in PWB (2012)
  • Author(s): Kunihiro Takenaka, Qiang Yu
  • Organizer: Itherm2012
  • Place of Presentation: San Diego(USA)
• [Presentation] Effect of crystal grain size on fatigue characteristics of lead free solder joints (2012)
  • Author(s): T,Akutsu, Q. Yu
  • Organizer: Proc. of New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: Ostrava(Czech)
• [Presentation] Precision Evaluation for Thermal Fatigue Life in Power Cycling Using Coupled Electrica1-Therma1-Structural Analysis (2012)
  • Author(s): T,Takahashi, Q. Yu
  • Organizer: Proc. of New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: 0strava(Czech)
• [Presentation] A Study on the Thermal Fatigue Evaluation of Ni Plating in SiC (2012)
  • Author(s): A. Hirose, Q Yu, T. Ishikawa
  • Organizer: Proc. of New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: Ostrava(Czech)
• [Presentation] Evaluation of Thermal Deformation of the Sealing Resin Considering the Effect of Curing Process on Mechanical Property (2012)
  • Author(s): Y. Yoshida, Q. Yu
  • Organizer: Proc. of New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: Ostrava(Czech)
• [Presentation] A Study on Reliability of Nano-Metal Pastes in High Temperature Resistant of Power Devices (2012)
  • Author(s): M,Cui, T. Oshidari, Q. Yu
  • Organizer: Proc. of New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: 0strava(Czech)
• [Presentation] Study on Thermal Design due to Downsizing of Power Module Using Coupled Electrical-Thermal-Mechanical Analysis (2012)
  • Author(s): Yasutaka Yamada, Qiang Yu, Tomohiro Takahashi, Yusuke Takagi
  • Organizer: EMAP2012
  • Place of Presentation: 香港（中国）
• [Presentation] A study on Evaluation Method of New Packaging Structure for High-Temperature Power Device (2012)
  • Author(s): Akihiro Higuchi, Qiang Yu, Toshikaza Oshidari, Mingliang Cui
  • Organizer: EMAP2012
  • Place of Presentation: 香港（中国）
• [Presentation] Investigation of Thermal Fatigue Life Scatter of IVH in PWB (2012)
  • Author(s): Kunihiro Takenaka, Qiang Yu
  • Organizer: Itherm2012
  • Place of Presentation: サンディエゴ（米国）
• [Presentation] Measurement Methods for Curing Properties of Resin Considering Process Condition (2012)
  • Author(s): Tomohiko Takeda, Qiang Yu, Hiroyuki Sato
  • Organizer: Itherm2012
  • Place of Presentation: サンディエゴ（米国）
• [Presentation] Reliable Evaluation Method for Solder Joints in Vehicle Electronics Devices Considering the Actual Use Conditions (2012)
  • Author(s): Satoru Okuyama, Qiang Yu, Takahiro Akutsu
  • Organizer: Itherm2012
  • Place of Presentation: サンディエゴ（米国）
• [Presentation] Effect of crystal grain size on fatigue characteristics of lead free solder joints (2012)
  • Author(s): T. Akutsu, Q. Yu
  • Organizer: New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: オストラバ（チェコ）
• [Presentation] Precision Evaluation for Thermal Fatigue Life in Power Cycling Using Coupled Electrical-Thermal-Structural Analysis (2012)
  • Author(s): T. Takahashi, Q. Yu
  • Organizer: New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: オストラバ（チェコ）
• [Presentation] A Study on the Thermal Fatigue Evaluation of Ni Plating in SiC (2012)
  • Author(s): A. Hirose, Q Yu, T. Ishikawa
  • Organizer: New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: オストラバ（チェコ）
• [Presentation] Evaluation of Thermal Deformation of the Sealing Resin Considering the Effect of Curing Process on Mechanical Property (2012)
  • Author(s): Y. Yoshida, Q. Yu
  • Organizer: New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: オストラバ（チェコ）
• [Presentation] A Study on Reliability of Nano-Metal Pastes in High Temperature Resistant of Power Devices (2012)
  • Author(s): M.Cui, T. Oshidari, Q. Yu
  • Organizer: New Methods of Damage and Failure Analysis of Structural Parts
  • Place of Presentation: オストラバ（チェコ）
• [Presentation] Measurement Methods for Curing Properties of Resin Considering Process Condition and Effects on Package (2011)
  • Author(s): Tomohiko Takeda, Qiang Yu
  • Organizer: EPTC2011
  • Place of Presentation: シンガポール
  • Year and Date: 2011-12-07
• [Presentation] Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties (2011)
  • Author(s): Yuji Nishimura, Qiang Yu
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-08
• [Presentation] A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin (2011)
  • Author(s): Sato Hiroyuki, Qiang Yu, Sone Ryusuke
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-08
• [Presentation] The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue life of Solder Joint in Power-Devices (2011)
  • Author(s): Shiqiang Zhao, Qiang Yu, Akaeda Hiroki
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-08
• [Presentation] Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis (2011)
  • Author(s): Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-08
• [Presentation] A Study on Reliability of High-Temperature Joint in Packaging Structure (2011)
  • Author(s): Takayuki Ishikawa, Qiang Yu, Toshikazu Oshidari, Hiromi Sugihara
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-07
• [Presentation] Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions (2011)
  • Author(s): Liu Shilin, Qiang Yu, Michael Pecht
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-07
• [Presentation] Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints (2011)
  • Author(s): Takahiro Akutsu, Qiang Yu
  • Organizer: InterPACK2011
  • Place of Presentation: ポートランド・アメリカ
  • Year and Date: 2011-07-06
• [Presentation] Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties (2011)
  • Author(s): Yuji Nishimura, Qiang Yu
  • Organizer: InterPACK2011
  • Place of Presentation: San Francisco(USA)
• [Presentation] A Study on the Thermal Defo rmation and the Mechanical Propertie s due to Curing Process Of the Encap sulation Resin (2011)
  • Author(s): Sato Hiroyuki, Qiang Yu, Sone, Ryusuke
  • Organizer: InterPACK2011
  • Place of Presentation: San Francisco(USA)
• [Presentation] Toshikazu Oshidari, Hiromi Sugihara, A Study on Reliability of High-Temperature Joint in Pack aging Structure (2011)
  • Author(s): Takayuki lshikawa, Qiang Yu
  • Organizer: InterPACK2011
  • Place of Presentation: San Francisco(USA)
• [Presentation] Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions (2011)
  • Author(s): Liu Shilin, Qiang Yu, Michae1 Pecht
  • Organizer: InterPAC K2011
  • Place of Presentation: San Francisco(USA)
• [Presentation] Masahi ro Kobayashi, Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrica1- Therma1-Structural Analysis (2011)
  • Author(s): Tomohiro Takahashi, Qiang Yu
  • Organizer: InterPA CK2011
  • Place of Presentation: San Francisco(USA)
• [Presentation] Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints (2011)
  • Author(s): Takahiro Akutsu, Qiang Yu
  • Organizer: InterPACK2011
  • Place of Presentation: San Francisco(USA)
• [Presentation] Measureme nt Methods for Curing Properties of Resin Considering Process Condition and Effects on Package (2011)
  • Author(s): Tomohiko Takeda, Qiang Yu
  • Organizer: EPTC2011
  • Place of Presentation: Singapore
• [Presentation] Reliability Evaluation for Specifying Fatigue Mode in Power Device (2010)
  • Author(s): M.Kobayashi, Q.Yu
  • Organizer: THERMINIC2010
  • Place of Presentation: バルセロナ・スペイン
  • Year and Date: 2010-10-08
• [Presentation] Reliability Evaluation for Specifying Fatigue Mode in Power Device (2010)
  • Author(s): M,Kobayashi, Q. Yu
  • Organizer: THERMINIC2010
  • Place of Presentation: Macao
• [Presentation] Astudy on reliability of NI plating in a high temperature power device (2010)
  • Author(s): Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, QiangYu
  • Organizer: ITherm2010
  • Place of Presentation: ラスベガス・アメリカ
• [Presentation] Characteristics and mechanism of surface roughness generated insubstrate used for vehicle power device (2010)
  • Author(s): H.AKAEDA, Q.Yu
  • Organizer: New Methods of damage and Failure Analysis ofStructural Parts
  • Place of Presentation: オストラバ・.チェコ
• [Presentation] Effect of Micro Structure on Fatigue Characteristics of Lead FreeSolder Joints (2010)
  • Author(s): Takahiro AKUTSU, Qiang YU, Yuji
  • Organizer: EPTC2010
  • Place of Presentation: シンガポール
• [Presentation] Precision Evaluation for Thermal Fatigue Life of Power Module using Coupled Electrical-Thermal-Mechanical Analysis (2010)
  • Author(s): Tomohiro TAKAHASHI, Qiang YU
  • Organizer: EPTC2010
  • Place of Presentation: シンガポール
• [Book] パワーデバイスの実装技術の研究動向 (2010)
  • Author(s): 于強、山際正憲、安澤貴志
  • Publisher: 株式会社エヌ・ティー・エス
• [Book] パワーデバイスの実装技術の研究動向 (2010)
  • Author(s): 干強、山際正憲、安澤貴志
  • Publisher: 株式会社エヌ・ティー・エス
• [Patent(Industrial Property Rights)] 熱疲労寿命検知センサー (2011)
  • Inventor(s): 于強、高木寛二
  • Industrial Property Rights Holder: 共有
  • Industrial Property Number: 2011-281467
  • Filing Date: 2011-12-22
• [Patent(Industrial Property Rights)] 製品熱疲労寿命検知センサー (2011)
  • Inventor(s): 于強, 高木寛二
  • Industrial Property Rights Holder: 于強, 高木寛二
  • Industrial Property Number: 2011-281467
  • Filing Date: 2011-12-22
• [Patent(Industrial Property Rights)] 小型熱衝撃試験機 (2010)
  • Inventor(s): 于強、臼井重徳、篠原俊朗、八坂慎一、篠原主勲
  • Industrial Property Rights Holder: 共有
  • Filing Date: 2010-07-28
• [Patent(Industrial Property Rights)] 小型熱衝撃試験機 (2010)
  • Inventor(s): 干強、臼井重徳、篠原俊朗、八坂慎一、篠原主勲
  • Industrial Property Rights Holder: 共有
  • Filing Date: 2010-07-28