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A Study of 3D Integration Based on Reconfigurable Bonding

Research Project

Project/Area Number 22360136
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionTohoku University

Principal Investigator

TAKAFUMI Fukushima  東北大学, 未来科学技術共同研究センター, 准教授 (10374969)

Project Period (FY) 2010 – 2012
Project Status Completed (Fiscal Year 2012)
Budget Amount *help
¥18,590,000 (Direct Cost: ¥14,300,000、Indirect Cost: ¥4,290,000)
Fiscal Year 2012: ¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2011: ¥6,240,000 (Direct Cost: ¥4,800,000、Indirect Cost: ¥1,440,000)
Fiscal Year 2010: ¥7,930,000 (Direct Cost: ¥6,100,000、Indirect Cost: ¥1,830,000)
Keywordsインターコネクト / パッケージのシステム化 / 応用 / 三次元集積回路 / セルフアセンブリ / 耐熱性高分子 / パッケージ / 接合
Research Abstract

A new reconfigurable bonding technologies has been studied for 3D stacked known good dies with TSV in order to increase throughput and yield. In the reconfigurable bonding, a large number of KGDs can be precisely and simultaneously self-assembled on wafers by surface tension of liquid and at the same time temporarily bonded on the wafers. After high temperature and high-vacuum processes, the KGDs can be removed from the wafers and transferred to the other corresponding wafers. By using the reconfigurable bonding with conventional 2D LSI chips, we showed high feasibility of TSV-based 3D and hetero agile integration.

Report

(4 results)
  • 2012 Annual Research Report   Final Research Report ( PDF )
  • 2011 Annual Research Report
  • 2010 Annual Research Report
  • Research Products

    (43 results)

All 2013 2012 2011 2010 Other

All Journal Article (9 results) (of which Peer Reviewed: 4 results) Presentation (30 results) (of which Invited: 3 results) Book (1 results) Remarks (1 results) Patent(Industrial Property Rights) (2 results)

  • [Journal Article] MultichipSelf-Assembly Technology for AdvancedDie-to-Wafer 3-D Integration toPrecisely Align Known Good Dies in Batch Processing2011

    • Author(s)
      Takafumi Fukushima, Eiji Iwata, YukiOhara, Mariappan Murugesan, JichoelBea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY

      Volume: Vol. 1 Pages: 1873-188

    • Related Report
      2012 Final Research Report
  • [Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011

    • Author(s)
      Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-ChelBea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      Micromachins

      Volume: vol.2 Pages: 49-68

    • Related Report
      2012 Final Research Report
  • [Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011

    • Author(s)
      Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON COMPONENTS, PAC KAGING AND MANUFACTURING TECHNOLOGY

      Volume: 1 Pages: 1873-1884

    • Related Report
      2011 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011

    • Author(s)
      Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
    • Journal Title

      Micromachins

      Volume: 2 Pages: 49-68

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わ せ技術2010

    • Author(s)
      岩田永司, 福島誉史 , 大原悠希, 李康旭, 田中徹, 小柳光正
    • Journal Title

      電子情報通信学会 和文誌C

      Volume: J93-C Pages: 493-502

    • Related Report
      2012 Final Research Report
  • [Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integratedcircuits2010

    • Author(s)
      T. Fukushima, E. Iwata, T. Konno, J.-C.Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Journal Title

      APL

      Volume: vol.96 Pages: 154105-154105

    • Related Report
      2012 Final Research Report
  • [Journal Article] Surface-tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits2010

    • Author(s)
      T.Fukushima, E.Iwata, T.Konno, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
    • Journal Title

      Applied Physics Letters

      Volume: 96

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 三次元積層型集積回路のための自己組織化チップ位置合わせ技術2010

    • Author(s)
      岩田永司、福島誉史、大原悠希、李康旭、田中徹、小柳光正
    • Journal Title

      電子情報通信学会論文誌C

      Volume: J93-C Pages: 493-502

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010

    • Author(s)
      福島誉史、李康旭、田中徹、小柳光正
    • Journal Title

      電子材料

      Volume: 49 Pages: 17-24

    • Related Report
      2010 Annual Research Report
  • [Presentation] 機能性液体を用いた自己組織化チップ実装技術2013

    • Author(s)
      伊藤有香,福島誉史,李康旭,長木浩司,田中徹,小柳光正
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      仙台
    • Year and Date
      2013-03-14
    • Related Report
      2012 Annual Research Report 2012 Final Research Report
  • [Presentation] Development of 3D Integration Technologies and Recent Challenges2012

    • Author(s)
      Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      ADMETA Plus 2012 Advanced MetallizationConference 2012
    • Place of Presentation
      東京
    • Year and Date
      2012-10-23
    • Related Report
      2012 Final Research Report
  • [Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assemblywith Cu/Sn Microbump2012

    • Author(s)
      Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      2012International Conference on Solid StateDevices and Materials (SSDM 2012)
    • Place of Presentation
      京都
    • Year and Date
      2012-09-26
    • Related Report
      2012 Final Research Report
  • [Presentation] 先端三次元積層型 LSI の技 術動向と展望2012

    • Author(s)
      福島誉史
    • Organizer
      SEMI Forum Japan 2012
    • Place of Presentation
      大阪
    • Year and Date
      2012-06-13
    • Related Report
      2012 Final Research Report
  • [Presentation] Self-Assembly-Based 3D IntegrationTechnologies2012

    • Author(s)
      T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
    • Place of Presentation
      東京
    • Year and Date
      2012-05-22
    • Related Report
      2012 Final Research Report
  • [Presentation] Wafer-Level 3D Integration TechnologyUsing Self-Assembly2012

    • Author(s)
      Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      MSPNEX (International Micro System Packaging Forum)2012
    • Place of Presentation
      韓国
    • Year and Date
      2012-04-12
    • Related Report
      2012 Final Research Report
  • [Presentation] Temporary Bonding Strength Control forSelf-Assembly-Based 3D Integration2012

    • Author(s)
      Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      大阪
    • Year and Date
      2012-02-01
    • Related Report
      2012 Final Research Report
  • [Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012

    • Author(s)
      Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      千里ライフサイエンスセンター(大阪)
    • Year and Date
      2012-02-01
    • Related Report
      2011 Annual Research Report
  • [Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012

    • Author(s)
      Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      MSPNEX (International Micro System Packaging Forum)2012
    • Place of Presentation
      韓国ソウル
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Self-Assembly-Based 3D Integration Technologies2012

    • Author(s)
      T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
    • Place of Presentation
      東京
    • Related Report
      2012 Annual Research Report
  • [Presentation] 先端三次元積層型LSIの技術動向と展望2012

    • Author(s)
      福島誉史
    • Organizer
      SEMI Forum Japan 2012
    • Place of Presentation
      大阪
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012

    • Author(s)
      Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      2012 International Conference on Solid State Devices and Materials (SSDM 2012)
    • Place of Presentation
      京都
    • Related Report
      2012 Annual Research Report
  • [Presentation] Development of 3D Integration Technologies and Recent Challenges2012

    • Author(s)
      T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      ADMETA Plus 2012 Advanced Metallization Conference 2012
    • Place of Presentation
      東京
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] 3D Chip Stacking Technologies and Hetero System Integration2011

    • Author(s)
      福島誉史
    • Organizer
      SEMI テクノロジーシンポジ ウム(STS)2011
    • Place of Presentation
      千葉
    • Year and Date
      2011-12-08
    • Related Report
      2012 Final Research Report
  • [Presentation] 3D Chip Stacking Technologies and Hetero System Integration2011

    • Author(s)
      福島誉史
    • Organizer
      SEMIテクノロジーシンポジウム(STS)2011
    • Place of Presentation
      幕張メッセ(千葉)(招待講演)
    • Year and Date
      2011-12-08
    • Related Report
      2011 Annual Research Report
  • [Presentation] Development of Wafer-Level3D System Integration Technologies2011

    • Author(s)
      T. Fukushima, K.-W. Lee, T. Tanaka, andM. Koyanagi
    • Organizer
      International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
    • Place of Presentation
      台湾
    • Year and Date
      2011-09-20
    • Related Report
      2012 Final Research Report
  • [Presentation] Development of Wafer-Level 3D System Integration Technologies2011

    • Author(s)
      T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
    • Organizer
      International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
    • Place of Presentation
      Taipei (Taiwan)(招待講演)
    • Year and Date
      2011-09-20
    • Related Report
      2011 Annual Research Report
  • [Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011

    • Author(s)
      T. Fukushima, Y. Ohara, M. Murugesan, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      Electronic Components and Technology Conference(ECTC)
    • Place of Presentation
      USA
    • Year and Date
      2011-06-02
    • Related Report
      2012 Final Research Report
  • [Presentation] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration2011

    • Author(s)
      T.Fukushima, Y.Ohara, M.Murugesan, J.-C.Bea, K.-W.Lee, T.Tanaka, M.Koyanagi
    • Organizer
      Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Florida (USA)
    • Year and Date
      2011-06-02
    • Related Report
      2011 Annual Research Report
  • [Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011

    • Author(s)
      T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      Workshop ICRA (IEEE Int. Conf. on Robotics and Automation)
    • Place of Presentation
      中国
    • Year and Date
      2011-05-09
    • Related Report
      2012 Final Research Report
  • [Presentation] 3D and Hetero Integration Based on Chip-to-Wafer Bonding Using Self-Assembly Technologies2011

    • Author(s)
      T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
    • Organizer
      Workshop ICRA (IEEE Int.Conf.on Robotics and Automation)
    • Place of Presentation
      Shanghai (China)(招待講演)
    • Year and Date
      2011-05-09
    • Related Report
      2011 Annual Research Report
  • [Presentation] 三次元集積のための高精度チップ位置合わせと常温直接接合技術2011

    • Author(s)
      岩田永司,福島誉史,李康旭,田中徹,小柳光正
    • Organizer
      2011年春季第58回応用物理学関係連合講演会
    • Place of Presentation
      神奈川
    • Year and Date
      2011-03-24
    • Related Report
      2012 Final Research Report 2010 Annual Research Report
  • [Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011

    • Author(s)
      福島誉史,岩田永司,李康旭,田中徹,小柳光正
    • Organizer
      第25回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京
    • Year and Date
      2011-03-08
    • Related Report
      2012 Final Research Report
  • [Presentation] 狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術2011

    • Author(s)
      福島誉史, 岩田永司, 李康旭, 田中徹, 小柳光正
    • Organizer
      第25回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      神奈川
    • Year and Date
      2011-03-08
    • Related Report
      2010 Annual Research Report
  • [Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010

    • Author(s)
      T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M.Koyanagi
    • Organizer
      IEEE International3D System Integration Conference (3DIC)
    • Place of Presentation
      ドイツ
    • Year and Date
      2010-11-17
    • Related Report
      2012 Final Research Report
  • [Presentation] Evaluation of Alignment Accuracy on Chip-to-Wafer Self-Assembly and Mechanism on the Direct Chip Bonding at Room Temperature2010

    • Author(s)
      T.Fukushima, E.Iwata, J.Bea, M.Murugesan, K.-W.Lee, T.Tanaka, M.Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC)
    • Place of Presentation
      ドイツ(ミュンヘン)
    • Year and Date
      2010-11-17
    • Related Report
      2010 Annual Research Report
  • [Presentation] 機能性高分子を用いた次世代集積回路の作製技術と人工網膜への応用2010

    • Author(s)
      福島誉史,小柳光正
    • Organizer
      第55回高分子夏季大学
    • Place of Presentation
      仙台
    • Year and Date
      2010-07-14
    • Related Report
      2012 Final Research Report 2010 Annual Research Report
  • [Presentation] 東北大学における三次元積層技術とヘテロインテグレーション2010

    • Author(s)
      李康旭,福島誉史,田中徹,小柳光正
    • Organizer
      JPCA Show 2010アカデミックプラザ
    • Place of Presentation
      東京
    • Year and Date
      2010-06-04
    • Related Report
      2012 Final Research Report 2010 Annual Research Report
  • [Presentation] Self-Assembly Technology for ReconfiguredWafer-to-Wafer 3D Integration2010

    • Author(s)
      T. Fukushima, E. Iwata, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      60th Electronic Components and TechnologyConference (ECTC)
    • Place of Presentation
      USA
    • Year and Date
      2010-06-03
    • Related Report
      2012 Final Research Report
  • [Presentation] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration2010

    • Author(s)
      T.Fukushima, E.Iwata, K.-W.Lee, T.Tanaka, M.Koyanagi
    • Organizer
      60^<th> Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      米国(ラスベガス)
    • Year and Date
      2010-06-03
    • Related Report
      2010 Annual Research Report
  • [Book] 3次元積層型集積回路に向けた自己組織化チップ実装技術2010

    • Author(s)
      福島誉史、李康旭、田中徹、小柳光正
    • Publisher
      電子材料
    • Related Report
      2012 Final Research Report
  • [Remarks] 2012年3月第25回エレクトロニクス実装学術講演大会研究奨励賞受賞講演題目:「狭ピッチ金属マイクロバンプを有するチップの自己組織化実装技術」受賞

    • Related Report
      2012 Final Research Report
  • [Patent(Industrial Property Rights)] チップ支持基板、それを用いた三次元集積回路及びそれらの製造方法並びにアセンブリ装置2012

    • Inventor(s)
      小柳光正、福島誉史、田中徹
    • Industrial Property Rights Holder
      国立大学法人東北大学
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2012-209003
    • Filing Date
      2012-09-23
    • Related Report
      2012 Annual Research Report
  • [Patent(Industrial Property Rights)] 素子の実装方法および光モジュール2012

    • Inventor(s)
      小柳光正、田中徹、福島誉史、伊藤有香
    • Industrial Property Rights Holder
      国立大学法人東北大学、住友ベークライト株式会社
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2012-202275
    • Filing Date
      2012-09-14
    • Related Report
      2012 Annual Research Report

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Published: 2010-08-23   Modified: 2019-07-29  

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