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Development of vertical wavy structured stretchable microscale interconnects fabricated by micro-corrugation process

Research Project

Project/Area Number 22K20425
Research Category

Grant-in-Aid for Research Activity Start-up

Allocation TypeMulti-year Fund
Review Section 0302:Electrical and electronic engineering and related fields
Research InstitutionThe University of Tokyo

Principal Investigator

Yamamoto Michitaka  東京大学, 大学院工学系研究科(工学部), 助教 (10963225)

Project Period (FY) 2022-08-31 – 2024-03-31
Project Status Completed (Fiscal Year 2023)
Budget Amount *help
¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000)
Fiscal Year 2023: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2022: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Keywordsストレッチャブルエレクトロニクス / ストレッチャブル配線 / コルゲート加工 / センサ集積化 / 伸縮性配線 / 実装技術
Outline of Research at the Start

本研究では,高密度に配線できる微細なストレッチャブル配線の実現のため,垂直方向に波状に加工した金属箔の上に,絶縁層を介して微細な電気配線を形成した新規構造を提案する.従来の金属伸縮性配線では,金属部分に伸縮性と電気配線という2つの役割を担わせてきたため,配線の微細化が難しかった.提案構造であれば金属箔部分に伸縮性の実現という役割のみを負わせ,配線部分を別途形成することが可能になるため,微細な伸縮性配線が実現できると期待される.提案構造の実現のため,パターン付き積層膜へのマイクロコルゲーションプロセスの力学的メカニズムの解明,ならびに波状構造を有する配線上への新規チップ実装方法の開発を行う.

Outline of Final Research Achievements

To realize high-density stretchable interconnects, a new structure of stretchable microscale patterned interconnect, which is formed on a vertical wavy structured metal substrate with an insulating layer, was proposed. To realize the proposed structure, the insulating layer and microscale patterned interconnects were formed on the metal substrate and then micro-corrugated to fabricate a vertical wavy structure. Our proposed process succeeded in fabricating vertical wavy structured interconnects with 100 μm width, and fabricated microscale interconnects sustained a strain of over 50%, and further discussion about the sensor integration was performed.

Academic Significance and Societal Importance of the Research Achievements

本研究では,微細なパターンの形成・パターンのコントロールが難しかった縦波構造型のストレッチャブル配線に対して,数10~数100μm程度の任意形状パターンの形成が可能な新たなプロセスを提案した.今回確立した作製プロセスは,今後のストレッチャブルデバイスにおける高密度集積化に資する期待される.

Report

(3 results)
  • 2023 Annual Research Report   Final Research Report ( PDF )
  • 2022 Research-status Report
  • Research Products

    (6 results)

All 2024 2023

All Journal Article (1 results) (of which Peer Reviewed: 1 results,  Open Access: 1 results) Presentation (5 results) (of which Int'l Joint Research: 3 results,  Invited: 1 results)

  • [Journal Article] Piezoelectric Stretchable Sensor with a Vertical Wavy Structure Fabricated by Combining Dip Coating and Micro-corrugation Process2024

    • Author(s)
      Yamamoto Michitaka、Tomita Naoto、Takamatsu Seiichi、Itoh Toshihiro
    • Journal Title

      International Journal of Precision Engineering and Manufacturing

      Volume: - Issue: 6 Pages: 1-8

    • DOI

      10.1007/s12541-024-00980-2

    • Related Report
      2023 Annual Research Report
    • Peer Reviewed / Open Access
  • [Presentation] マイクロコルゲート加工による縦波型ストレッチャブル微細配線の開発2024

    • Author(s)
      山本道貴,高松誠一,伊藤寿浩
    • Organizer
      第38回エレクトロニクス実装学会春季講演大会
    • Related Report
      2023 Annual Research Report
  • [Presentation] Piezoelectric Stretchable Sensor with a Vertical-wavy Structure Fabricated by Combining Dip Coating and Micro-corrugation process2023

    • Author(s)
      Michitaka Yamamoto, Naoto Tomita, Seiichi Takamatsu, Toshihiro Itoh
    • Organizer
      International Conference on Precision Engineering and Sustainable Manufacturing (PRESM2023)
    • Related Report
      2023 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Vertical-wavy Structured Stretchable Device Fabricated by Micro-corrugation Process2023

    • Author(s)
      Michitaka Yamamoto
    • Organizer
      JCK MEMS/NEMS 2023
    • Related Report
      2023 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Stretchable Microscale Patterned Interconnects Formed on Micro-corrugated Vertical Wavy Structured Substrate2023

    • Author(s)
      Michitaka Yamamoto, Seiichi Takamatsu, Toshihiro Itoh
    • Organizer
      2023 IEEE Sensors
    • Related Report
      2023 Annual Research Report
    • Int'l Joint Research
  • [Presentation] マイクロコルゲート加工による縦波型圧電ストレッチャブルセンサの開発2023

    • Author(s)
      山本道貴, 高松誠一, 伊藤寿浩
    • Organizer
      第37回エレクトロニクス実装学会 春季講演大会
    • Related Report
      2022 Research-status Report

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Published: 2022-09-01   Modified: 2025-01-30  

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