| Project/Area Number |
23656095
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Saitama University |
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Principal Investigator |
IKENO Junichi 埼玉大学, 大学院・理工学研究科, 教授 (10184441)
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2012: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2011: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | (8)特殊加工 / (9)超精密加工 / (10)ナノマイクロ加工 / レーザ加工 / スライシング / シリコン / 硬脆材料 / シリコンウエハ / サファイアウエハ |
|---|
| Research Abstract |
Micro-crack occur in the inside by a laser penetrates (20%) silicon. If this principle is used, a crack would be made to develop in the flat-shaped inside silicon, and the silicon could be wafering by the crack. It is expected to reduce slicing waste by the new method.The new silicing method is called “Laser slicing". We found out some strong points, for example, forming 3D-structure on sliced surface, slicing waste can reduce to 1/10.
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