Creation of the mobile working robot with variable shape and stiffness by using hot-ice phenomenon
Project/Area Number |
23656173
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Research Category |
Grant-in-Aid for Challenging Exploratory Research
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Allocation Type | Multi-year Fund |
Research Field |
Intelligent mechanics/Mechanical systems
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Research Institution | Yamagata University |
Principal Investigator |
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Co-Investigator(Kenkyū-buntansha) |
TADAKUMA Kenjiro 大阪大学, 大学院・工学研究科, 助教 (30508833)
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Project Period (FY) |
2011 – 2013
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Project Status |
Completed (Fiscal Year 2013)
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Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2013: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2012: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2011: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
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Keywords | ロボティクス / 知能ロボティックス / 知能機械 / 機械要素 |
Research Abstract |
We have been studying the hyper flexible morphing mobile robot that has flexible gel states and can change its shape via a magnetic field. It can also change its stiffness by using hot-ice phenomenon. The basic performances and characteristics, movements, and abilities to change shape and stiffness of the prototypes have been confirmed through experiments. To expand the gel robot's motion range, we manufactured the omnidirectional X-Y stage to move neodymium magnets in any direction for the dexterous control of the magnetic field. This omnidirectional X-Y stage is composed of multiple spur gears those rotating axes are perpendicular to each other and the planar omnidirectional driving gears to move neodymium magnets with them smoothly. We also fabricated and tested a novel gel material that can change its shape and stiffness without any magnetic fields. Many types of gel robotic actuators were tested including robotic grippers and flexible omnidirectional driving gears.
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Report
(4 results)
Research Products
(14 results)
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[Presentation] Experiments of a Variable Stiffness Robot Using Shape Memory Gel2013
Author(s)
Yamano, Mitsuhiro, Goto, Daisuke, Ujiie, Kenji, Akiba, Naoki, Gong, Jin, Furukawa, Hidemitsu, Tadakuma, Riichiro
Organizer
2013 IEEE/SICE International Symposium on System Integration
Place of Presentation
Kobe International Conference Center, Kobe, Japan
Related Report
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