| Project/Area Number |
23750260
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Polymer/Textile materials
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| Research Institution | Toho University |
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Principal Investigator |
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
|
| Budget Amount *help |
¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2012: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2011: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
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| Keywords | ポリイミド / 絶縁保護膜 / 低弾性率 / 難燃性 / 接着力 / モルフォロジー / 感光性 / ポジ / ポジ型 / シロキサン / 絶縁材料 / 接着性 |
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| Research Abstract |
Two types of ultra-low-modulus polyimides (PIs) with/without photosensitivity were developed as novel cover layer materials for applications to flexible printed circuit boards (FPC) in this work. Our photosensitive PI cast film exhibited an extremely low tensile modulus of 0.28 GPa, which is low enough for avoiding an undesirable FPC curling phenomenon, in addition to the highest level of non-flammability (UL-94, VTM-0), compatibility to the solder reflow process, good photosensitivity for fine pattern formation. We also developed novel screen-printable ultra-low-modulus copolyimides systems without photosensitivity. The copolyimides displayed an extremely low modulus of 0.015 GPa and an excellent adhesion strength with copper foil (2.3 kgf/cm)
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