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Science of Hetero-Interface of Advanced Power Devises in Extreme Environments

Research Project

Project/Area Number 24226017
Research Category

Grant-in-Aid for Scientific Research (S)

Allocation TypeSingle-year Grants
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

Suganuma Katsuaki  大阪大学, 産業科学研究所, 教授 (10154444)

Co-Investigator(Kenkyū-buntansha) 長尾 至成  大阪大学, 産業科学研究所, 准教授 (10315054)
菅原 徹  大阪大学, 産業科学研究所, 助教 (20622038)
酒 金テイ  大阪大学, 産業科学研究所, 助教 (00467622)
Research Collaborator Lin Shih-kang  National Cheng Kung University, Assoc. Prof.
Project Period (FY) 2012-05-31 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥205,140,000 (Direct Cost: ¥157,800,000、Indirect Cost: ¥47,340,000)
Fiscal Year 2016: ¥17,160,000 (Direct Cost: ¥13,200,000、Indirect Cost: ¥3,960,000)
Fiscal Year 2015: ¥22,490,000 (Direct Cost: ¥17,300,000、Indirect Cost: ¥5,190,000)
Fiscal Year 2014: ¥42,250,000 (Direct Cost: ¥32,500,000、Indirect Cost: ¥9,750,000)
Fiscal Year 2013: ¥40,040,000 (Direct Cost: ¥30,800,000、Indirect Cost: ¥9,240,000)
Fiscal Year 2012: ¥83,200,000 (Direct Cost: ¥64,000,000、Indirect Cost: ¥19,200,000)
Keywords電気接続・配線 / パワー半導体 / 異相界面 / 焼結接合 / Nano-Volcanic Eruption / 超高耐熱実装技術 / 銀スパッタ膜接合 / メタル・ペースト焼結接合 / 光接合 / 次世代半導体 / ウィスカ― / ナノ構造制御 / エレクトロマイグレーション / 電子・電気材料 / 材料加工・処理 / 表面・界面物性 / ワイドバンドギャップ半導体 / ダイアタッチ / 高温耐熱 / 界面 / ウィスカー / エレクトロマイグレーショ ン / ウィスカ
Outline of Final Research Achievements

New Ag sinter joining technology was developed and the basic mechanism, which enables one to fabricate an excellent joint between two substances with Ag micron particles paste or with sputtering Ag films at low temperature and low pressure in air, was clarified by high resolution TEM with the aid both of the first principle simulation and of the phase diagram simulation. Oxygen was absorbed in the grain boundary of Ag, which becomes liquid, leading Ag-O liquid eruption under compression stress, which reaction was named as "Nano-Volcanic Eruption". The heat-resistance beyond 250 degree C was achieved by Ag sinter joining. The environmental reaction was applied to Cu sinter joining and the possibility of low temperature sinter joining with affordable Cu paste was discovered.

Assessment Rating
Verification Result (Rating)

A

Assessment Rating
Result (Rating)

A: Progress in the research is steadily towards the initial goal. Expected research results are expected.

Report

(9 results)
  • 2017 Research Progress Assessment (Verification Result) ( PDF )
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Annual Research Report   Abstract(Research Progress Assessment) ( PDF )   Research Progress Assessment (Result) ( PDF )
  • 2014 Annual Research Report
  • 2013 Annual Research Report
  • 2012 Annual Research Report
  • Research Products

    (131 results)

All 2017 2016 2015 2014 2013 2012 Other

All Int'l Joint Research (4 results) Journal Article (50 results) (of which Int'l Joint Research: 6 results,  Peer Reviewed: 49 results,  Acknowledgement Compliant: 28 results,  Open Access: 2 results) Presentation (59 results) (of which Int'l Joint Research: 20 results,  Invited: 17 results) Book (7 results) Remarks (4 results) Patent(Industrial Property Rights) (7 results)

  • [Int'l Joint Research] Siemens(ドイツ)

    • Related Report
      2016 Annual Research Report
  • [Int'l Joint Research] Siemens(ドイツ)

    • Related Report
      2015 Annual Research Report
  • [Int'l Joint Research] ハルピン工業大学(中国)

    • Related Report
      2015 Annual Research Report
  • [Int'l Joint Research] 成功大学(台湾)

    • Related Report
      2015 Annual Research Report
  • [Journal Article] In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste2017

    • Author(s)
      H. Zhang, Y. Gao, J. Jiu, K. Suganuma
    • Journal Title

      J. Alloys Compd.

      Volume: 696 Pages: 123-129

    • DOI

      10.1016/j.jallcom.2016.11.225

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices2017

    • Author(s)
      C. Chen, S. Nagao, K. Saganuma, J. Jiu, T. Sugahara, H. Zhang, T. Iwashige, K. Sugiura, T. Tsuruta
    • Journal Title

      Acta Mater.

      Volume: 129 Pages: 41-51

    • DOI

      10.1016/j.actamat.2017.02.065

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] High reliable and high conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement2017

    • Author(s)
      W. Li, H. Zhang, Y. Gao, J. Jiu, C.-F. Li, C. Chen, D. Hu, Y. Goya, Y. Wang, H. Koga, S. Nagao, K. Suganuma
    • Journal Title

      J. Mater. Chem

      Volume: 5 Issue: 5 Pages: 1155-1164

    • DOI

      10.1039/c6tc04892g

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Mechanical deformation of sintered porous Ag die-attach at high temperature and its effect size for wide-bandgap power devices design2017

    • Author(s)
      C. Chen, S. Nagao, K. Suganuma
    • Journal Title

      J. Electron. Mater.

      Volume: 46 Issue: 3 Pages: 1576-1586

    • DOI

      10.1007/s11664-016-5200-3

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Effects of intermetallic-forming element additions on microstructure and corrosion behavior of SnZn solder alloys2016

    • Author(s)
      J.-C. Liu, Z.-H. Wang, J.-Y. Xie, J.-S. Ma, Q.-Y. Shi, G. Zhang, K. Suganuma
    • Journal Title

      Corrosion Science

      Volume: 112 Pages: 150-159

    • DOI

      10.1016/j.corsci.2016.07.004

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Understanding corrosion mechanism of Sn-Zn alloys in NaCl solution via corrosion products characterization2016

    • Author(s)
      J.-C. Liu, Z.-H. Wang, J.-Y. Xie, J.-S. Ma, G. Zhang, K. Suganuma
    • Journal Title

      Materials and Corrosion

      Volume: 67 Pages: 522-530

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Self-healing of cracks in Ag joining layer for die-attachment in power devices2016

    • Author(s)
      C. Chen, S. Nagao, K. Suganuma, J. Jiu, H. Zhang, T. Sugahara, T. Iwashige, K. Sugiura, K. Tsuruta
    • Journal Title

      Appl. Phys. Lett.

      Volume: 109 Issue: 9

    • DOI

      10.1063/1.4962333

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Nano-volcanic eruption of silver2016

    • Author(s)
      S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-G. Lin, K. Suganuma
    • Journal Title

      Scientific Report

      Volume: 6 Issue: 1

    • DOI

      10.1038/srep34769

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Thermostable Ag die-attach structure for high-temperature power devices2016

    • Author(s)
      H. Zhang, S. Nagao, K. Suganuma, H.-J. Albrecht, K. Wilke
    • Journal Title

      J. Mater. Sci.: Mater. Electron.

      Volume: 27 Issue: 2 Pages: 1337-1344

    • DOI

      10.1007/s10854-015-3894-2

    • Related Report
      2016 Annual Research Report 2015 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Die-attaching silver paste based on a novel solvent for high-power semiconductor devices2016

    • Author(s)
      J. Jiu, H. Zhang, S. Nagao, T. Sugahara, N. Kagami, Y. Suzuki, Y. Akai, K. Suganuma
    • Journal Title

      J. Mater. Sci.

      Volume: 51 Issue: 7 Pages: 3422-3430

    • DOI

      10.1007/s10853-015-9659-8

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Ti addition to enhance corrosion resistance of Sn-Zn solder alloy by tailoring microstructure2015

    • Author(s)
      J.-C. Liu, S.W. Park, S. Nagao, J.-S. Ma, G. Zhang, K. Suganuma
    • Journal Title

      J. Alloys Compd.

      Volume: 644 Pages: 113-118

    • DOI

      10.1016/j.jallcom.2015.04.168

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] The effect of light and humidity on the stability of silver nanowire transparent electrodes2015

    • Author(s)
      J. Jiu, J. Wang, T. Sugahara, S. Nagao, M. Nogi, H. Koga, K. Suganuma, M. Hara, E. Nakazawa, H. Uchida
    • Journal Title

      RSC Adv.

      Volume: 15 Issue: 35 Pages: 27657-27664

    • DOI

      10.1039/c5ra02722e

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics2015

    • Author(s)
      S. W. Park, S. Nagao, Y. Kato, H. Ishino, K. Sugiura, K. Tsuruta, K. Suganuma
    • Journal Title

      IEEE Trans. CPMT.

      Volume: 5 Issue: 7 Pages: 902-909

    • DOI

      10.1109/tcpmt.2015.2443058

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment2015

    • Author(s)
      S. Park, S. Nagao, T. Sugahara, K. Suganuma
    • Journal Title

      J. Mater. Sci.: Mater. Electron.

      Volume: 26 Issue: 9 Pages: 7277-7289

    • DOI

      10.1007/s10854-015-3355-y

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Simultaneous synthesis of nano and micro-Ag particle particles and their as a die -attach material2015

    • Author(s)
      J. Jiu, H. Zhang, S. Koga, S. Nagao, Y. Izumi, K. Suganuma
    • Journal Title

      J. Mater. Sci.: Mater. Electron.

      Volume: 55 Issue: 9 Pages: 7183-7191

    • DOI

      10.1007/s10854-015-3343-2

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density2015

    • Author(s)
      T. Kadoguchi, K. Gotou, K. Yamanaka, S. Nagao, K. Suganuma
    • Journal Title

      Microelectronics Reliability

      Volume: 55 Issue: 12 Pages: 2554-2559

    • DOI

      10.1016/j.microrel.2015.10.003

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag2015

    • Author(s)
      H. Zhang, S. Nagao, K. Suganuma
    • Journal Title

      J. Electron. Mater.

      Volume: 44 Issue: 10 Pages: 3896-3903

    • DOI

      10.1007/s11664-015-3919-x

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air2015

    • Author(s)
      Su Ding, Jinting Jiu, Yanhong Tian, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma
    • Journal Title

      Physical Chemistry Chemical Physics

      Volume: 17 Issue: 46 Pages: 31110-31116

    • DOI

      10.1039/c5cp04582g

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Fabrication of flexible copper pattern based on sub-micro copper paste by low temperature plasma technique2015

    • Author(s)
      Y. Gao, H. Zhang, J. Jiu, S. Nagao, T. Sugahara, K. Suganuma
    • Journal Title

      RSC Advances

      Volume: 5 Issue: 109 Pages: 90202-90208

    • DOI

      10.1039/c5ra18583a

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] ワイドバンドギャップパワー半導体のダイアタッチ技術2015

    • Author(s)
      菅沼克昭
    • Journal Title

      工業材料

      Volume: 63 Pages: 40-49

    • NAID

      130007502800

    • Related Report
      2015 Annual Research Report
  • [Journal Article] Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature2015

    • Author(s)
      T. Kunimune, M. Kuramoto, S. Ogawa, T. Sugahara, S. Nagao*, K. Suganuma
    • Journal Title

      Acta Materialia

      Volume: 89 Pages: 133-140

    • DOI

      10.1016/j.actamat.2015.02.011

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Silver Stress Migration Bonding Driven by Thermomechanical Stress with Various Substrates,2015

    • Author(s)
      C. Oh*, S. Nagao, K. Suganuma
    • Journal Title

      J. Mater. Sci. Mater. Electron

      Volume: N/A Issue: 4 Pages: 2525-2530

    • DOI

      10.1007/s10854-015-2717-9

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment2015

    • Author(s)
      S.W. Park*, S. Nagao, K. Suganuma
    • Journal Title

      J. Alloys Compd.

      Volume: N/A Pages: 143-148

    • DOI

      10.1016/j.jallcom.2015.02.223

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] High performance heat curing copper-silver powders filled electrically conductive adhesives2015

    • Author(s)
      H.-W. Cui, J.-T. Jiu, T. Sugahara, S. Nagao, K. Suganuma, H. Uchida
    • Journal Title

      Electronic Materials Letters

      Volume: N/A Issue: 2 Pages: 315-322

    • DOI

      10.1007/s13391-014-4292-2

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] The role of Zn precipitates and Cl- anions in pitting corrosion of Sn-Zn solder alloys2015

    • Author(s)
      S.W. Park, S. Nagao, M. Nogi, H. Koga, J.-S. Ma, G. Zhang, K. Suganuma
    • Journal Title

      Corrosion Science

      Volume: N/A Pages: 263-271

    • DOI

      10.1016/j.corsci.2014.12.014

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding2015

    • Author(s)
      S.W. Park*, S. Nagao, K. Suganuma
    • Journal Title

      Materials Letters

      Volume: N/A Pages: 68-71

    • DOI

      10.1016/j.matlet.2015.03.054

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films2015

    • Author(s)
      C. Oh*, S. Nagao, T. Kunimune, K. Suganuma
    • Journal Title

      Appl.Phys.Letters

      Volume: 104 Issue: 16 Pages: 161603-161603

    • DOI

      10.1063/1.4872320

    • Related Report
      2014 Annual Research Report 2013 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates2014

    • Author(s)
      S. Park*, S. Nagao, T. Sugahara, K. Suganuma
    • Journal Title

      JJAP

      Volume: 53 Issue: 4S Pages: 04EP06-04EP06

    • DOI

      10.7567/jjap.53.04ep06

    • NAID

      210000143698

    • Related Report
      2014 Annual Research Report 2013 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components2014

    • Author(s)
      Y. Kim, S. Nagao, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke
    • Journal Title

      JJAP

      Volume: 53 Issue: 4S Pages: 04EB02-04EB02

    • DOI

      10.7567/jjap.53.04eb02

    • NAID

      210000143550

    • Related Report
      2014 Annual Research Report 2013 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements2014

    • Author(s)
      Y. Kim, S. Nagao*, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke, J. Strogies
    • Journal Title

      J. Mater. Sci.: Mater. Electron.

      Volume: 25 Issue: 7 Pages: 3090-3095

    • DOI

      10.1007/s10854-014-1988-x

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Hillock growth dynamics for Ag stress migration bonding2014

    • Author(s)
      S. Nagao*, C. Oh, T. Sugahara, K. Suganuma
    • Journal Title

      Materials Letters

      Volume: 137 Pages: 170-173

    • DOI

      10.1016/j.matlet.2014.09.006

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Refinement of the microstructure of Sn-Ag-Bi-In solder, by addition of SiC nanoparticles, to reduce electromigration damage under high electric current2014

    • Author(s)
      Y. Kim, S. Nagao*, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke, J. Strogies
    • Journal Title

      J. Electron.Mater.

      Volume: 43 Issue: 12 Pages: 4428-4434

    • DOI

      10.1007/s11664-014-3377-x

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Mitigation of Sn Whisker Growth by Small Bi Additions2014

    • Author(s)
      Jung-Lae Jo, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto, Tohru Sugahara, Katsuaki Suganuma
    • Journal Title

      Journal of Electronic Materials

      Volume: 43 Issue: 1 Pages: 1-8

    • DOI

      10.1007/s11664-013-2706-9

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Microstructural stability of Ag sinter joining in thermal cycling2013

    • Author(s)
      Soichi Sakamoto, Tohru Sugahara, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 4 Pages: 1332-1340

    • DOI

      10.1007/s10854-012-0929-9

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] LEAST LEAD ADDITION TO MITIGATE TIN WHISKER FOR AMBIENT STORAGE2013

    • Author(s)
      Jung-Lae Jo, Keun-Soo Kim, Tohru Sugahara, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto and Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 8 Pages: 3108-3115

    • DOI

      10.1007/s10854-013-1218-y

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Thermal stress driven Sn whisker growth: in air and in vacuum2013

    • Author(s)
      Jung-Lae Jo, Shijo Nagao, Tohru Sugahara, Masanobu Tsujimoto, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 10 Pages: 3897-3904

    • DOI

      10.1007/s10854-013-1336-6

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition2013

    • Author(s)
      S.W.Park, Shijo Nagao, Tohru Sugahara, Keun-Soo Kim, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Issue: 12 Pages: 4704-4712

    • DOI

      10.1007/s10854-013-1463-0

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] High-strength Si wafer bonding by self-regulated eutectic reaction with pure Zn2013

    • Author(s)
      S. W. Park
    • Journal Title

      Scripta Materialia

      Volume: 68 Issue: 8 Pages: 591-594

    • DOI

      10.1016/j.scriptamat.2012.12.013

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Low-temperature low-pressure die attach with hybrid silver particle paste2012

    • Author(s)
      Katsuaki Suganuma
    • Journal Title

      Microelectronics Reliability

      Volume: 52 Issue: 2 Pages: 375-380

    • DOI

      10.1016/j.microrel.2011.07.088

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Enhanced ductility and oxidation resistance of Zn through the addition of minor elements for use in wide-gap semiconductor die-bonding materials2012

    • Author(s)
      S.W. Park
    • Journal Title

      Journal of Alloys and Compounds

      Volume: 542 Pages: 236-240

    • DOI

      10.1016/j.jallcom.2012.07.040

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Effect of crystal orientation on mechanically induced Sn whiskers on Sn-Cu plating2012

    • Author(s)
      Yukiko Mizuguchi
    • Journal Title

      J. Electron. Mater.

      Volume: 41 Issue: 7 Pages: 1859-1867

    • DOI

      10.1007/s11664-012-1962-4

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Low-Temperature and pressureless Ag-Ag Direct Bonding for Light Emitting Diode Die-Attachment2012

    • Author(s)
      M. Kuramoto
    • Journal Title

      IEEE T. Compon. Pack. T

      Volume: 2 Issue: 4 Pages: 548-552

    • DOI

      10.1109/tcpmt.2011.2180385

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles2012

    • Author(s)
      T. Kunimune
    • Journal Title

      IEEE T. Compon. Pack. T

      Volume: 2 Issue: 6 Pages: 909-915

    • DOI

      10.1109/tcpmt.2012.2188292

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Effects of Cu Contents in Flux on Microstructure and Joint Strength of Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish2012

    • Author(s)
      Hitoshi Sakurai
    • Journal Title

      Microelectronics Reliability

      Volume: 52 Issue: 11 Pages: 2716-2722

    • DOI

      10.1016/j.microrel.2012.05.005

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Strongly adhesive and flexible transparent silver nanowire conductive film fabricated with high-intensity pulsed light technique2012

    • Author(s)
      Jinting Jiu, Masaya Nogi, Tohru Sugahara, Takehiro Tokuno, Teppei Araki, Natsuki Komoda, Katsuaki Suganuma, Hiroshi Uchida, Kenji Shinozaki
    • Journal Title

      Journal of Materials Chemistry

      Volume: 22 Issue: 44 Pages: 23561-23567

    • DOI

      10.1039/c2jm35545k

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Cu化合物添加型フラックスを用いたSn-3.5Ag/無電解Au/Ni電極接合部2012

    • Author(s)
      櫻井 均
    • Journal Title

      電子情報通信学会論文誌

      Volume: J-95C Pages: 317-323

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 機械的応力により発生するSn ウィスカにおける屈曲・湾曲部の形成と結晶方位の関係性2012

    • Author(s)
      水口由紀子
    • Journal Title

      電子情報通信学会論文誌

      Volume: J-95C Pages: 333-342

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] コンフォーマルコーティングによるウィスカ成長性抑制効果の評価2012

    • Author(s)
      中川 剛
    • Journal Title

      電子情報通信学会論文誌

      Volume: J-95C Pages: 343-350

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] β-ケトカルボン酸銀塩インクを利用した低温配線形成技術2012

    • Author(s)
      廣瀬久美
    • Journal Title

      電子情報通信学会論文誌

      Volume: J-95C Pages: 394-399

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] The effect of micro via-in pad design on surface-mount assembly defects: Part II – voiding and flux spattering2012

    • Author(s)
      Y.-W. Lee
    • Journal Title

      Soldering & Surface Mount Technology

      Volume: 25 Issue: 1 Pages: 4-14

    • DOI

      10.1108/09540911311294551

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Presentation] Heat-resistant Ag sinter joining wiring for wide band gap power semiconductors2017

    • Author(s)
      K. Suganuma
    • Organizer
      International Welding & Joining Conference - Korea 2017 (IWJC2017)
    • Place of Presentation
      Gyeongju
    • Year and Date
      2017-04-12
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Metal-paste sintering die-attach for high temperature power devices2017

    • Author(s)
      S. Nagao, H. Zhang, C. Chen, A. Shimoyama, K. Suganuma
    • Organizer
      International Welding & Joining Conference - Korea 2017 (IWJC2017)
    • Place of Presentation
      Gyeongju
    • Year and Date
      2017-04-12
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Bonding technology for large area by silver stress migration bonding2017

    • Author(s)
      S. Noh, C. Chen, T. Ishina, S. Nagao, K. Suganuma
    • Organizer
      International Welding & Joining Conference - Korea 2017 (IWJC2017)
    • Place of Presentation
      Gyeongju
    • Year and Date
      2017-04-12
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Interconnection Technology for WBG Power Devices2016

    • Author(s)
      K. Suganuma
    • Organizer
      15th International Symposium on Microelectronics and Packaging (ISMP 2016)
    • Place of Presentation
      Seoul
    • Year and Date
      2016-10-24
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Nano-ink development for wearable printed electronics2016

    • Author(s)
      K. Suganuma, M. Nogi, H. Koga, J. Jiu, and T. Sugahara
    • Organizer
      International Conference on Radiation Curing in Asia
    • Place of Presentation
      Tokyo
    • Year and Date
      2016-10-24
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Polyol synthesis of metallic nanomaterials for wiring and interconnection of advance electronics2016

    • Author(s)
      K. Suganuma
    • Organizer
      2nd International Conference on Polyol Mediated Synthesi(ICPMS2016)
    • Place of Presentation
      Hikone
    • Year and Date
      2016-07-11
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Silver nanowires sensor prepared with polyol process2016

    • Author(s)
      Chunhui Wu, J.Jiu, K.Suganuma
    • Organizer
      2nd International Conference on Polyol Mediated Synthesi(ICPMS2016)
    • Place of Presentation
      Hikone
    • Year and Date
      2016-07-11
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Ag Sinter Joining and Stress Migration Bonding for WBG Die Attach2016

    • Author(s)
      K. Suganuma
    • Organizer
      International Symposium on 3D Power Electronics Integration and Manufacturing
    • Place of Presentation
      Raleigh
    • Year and Date
      2016-06-13
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] パワーデバイスダイアタッチに向けた低温低圧銅粒子焼結接合を実現するためのPEG溶媒分子量最適化の実現2016

    • Author(s)
      吉川弘起,長尾至成,加賀美宗子,菅沼克昭,坂上貴彦,上郡山洋一,佐々木隆史
    • Organizer
      第30回 エレクトロニクス実装学会 春季講演大会
    • Place of Presentation
      神奈川
    • Year and Date
      2016-03-22
    • Related Report
      2015 Annual Research Report
  • [Presentation] Low Temperature Interconnection for Two PE; Printed and Power Electronics2016

    • Author(s)
      K. Suganuma
    • Organizer
      China Semiconductor Technology International Conference (CSTIC) 2016
    • Place of Presentation
      Shanghai
    • Year and Date
      2016-03-13
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] WBG Die-attach Ceramic Substrate for Severe Thermal Cycling2016

    • Author(s)
      K. Suganuma, H. Zhang, S. Nagao, T. Sugahara. M. Ueshima, Y. Furukawa, K. Minami, H.-J. Albrecht, K. Wilke, Y. Shirakawa, S. Kurosaka. M. Tsujimoto, M. Kiso
    • Organizer
      TMS 2016 145th Annual Meeting & Exhibition
    • Place of Presentation
      Nashville
    • Year and Date
      2016-02-14
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Die-attach Structure Using SiC Particle Added Ag Paste for Ultra High Thermal Stability Usage2016

    • Author(s)
      H. Zhang, S. Nagao, T. Sugahara, E. Yokoi, K. Suganuma
    • Organizer
      TMS 2016 145th Annual Meeting & Exhibition
    • Place of Presentation
      Nashville
    • Year and Date
      2016-02-14
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part I-Experimental Study2016

    • Author(s)
      S. Nagao, C. Oh, S.-K. Lin, H. Zhang, E. Yokoi, T. Ishibashi, K. Suganuma
    • Organizer
      TMS 2016 145th Annual Meeting & Exhibition
    • Place of Presentation
      Nashville
    • Year and Date
      2016-02-14
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part II-Mechanistic Study2016

    • Author(s)
      S.-K. Lin, S. Nagao, C. Oh, H. Zhang, Y.-C. Liu, S.-G. Lin, K. Suganuma
    • Organizer
      TMS 2016 145th Annual Meeting & Exhibition
    • Place of Presentation
      Nashville
    • Year and Date
      2016-02-14
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Silver Sinter Joining for WBG Die-Attach2016

    • Author(s)
      K. Suganuma
    • Organizer
      2016 MRS Spring Meeting & Exhibit
    • Place of Presentation
      Phoenix
    • Related Report
      2016 Annual Research Report 2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Silver Sinter Joining and Stress Migration Bonding for Wbg Die-Attach2015

    • Author(s)
      K. Suganuma, T. Sugahara, J. Jiu, S. Nagao, E. Yokoi, and H. Zhang
    • Organizer
      228th ECS Meeting
    • Place of Presentation
      Phoenix
    • Year and Date
      2015-10-11
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Ultra-Heat Resistant Interconnection for Wide Band Gap Semiconductors2015

    • Author(s)
      K. Suganuma, S. Nagao, T. Sugahara, J. Jiu
    • Organizer
      2015 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Sapporo
    • Year and Date
      2015-09-27
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Nanoparticle or Microparticle sintering for 3D/Power Assembly2015

    • Author(s)
      K.Suganuma
    • Organizer
      2015 IEEE Nanotechnology Materials and Devices Conference Sunday
    • Place of Presentation
      Anchorage
    • Year and Date
      2015-09-13
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] 極限環境パワー半導体の異相界面制御2015

    • Author(s)
      菅沼克昭,長尾至成,菅原 徹,酒 金婷,横井絵美
    • Organizer
      第25回 マイクロエレクトロニクスシンポジウム 秋季大会
    • Place of Presentation
      大阪
    • Year and Date
      2015-09-03
    • Related Report
      2015 Annual Research Report
    • Invited
  • [Presentation] WBG 半導体パワーデバイス用Cu/Al クラッドリボン配線の高温信頼性2015

    • Author(s)
      朴 世珉,長尾至成,菅原 徹,横井絵美, 菅沼克昭
    • Organizer
      第25回 マイクロエレクトロニクスシンポジウム 秋季大会
    • Place of Presentation
      大阪
    • Year and Date
      2015-09-03
    • Related Report
      2015 Annual Research Report
  • [Presentation] Recent advances of nanomaterials for printed electronics2015

    • Author(s)
      K. Suganuma, M. Nogi, J. Jiu, H. Koga, T. Sugahara and S. Nagao
    • Organizer
      2015 JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment
    • Place of Presentation
      Kobe
    • Year and Date
      2015-06-14
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Diffusional Hillock Growth in Ag Stress Migration Bonding for Power Device Interconnections2015

    • Author(s)
      Chulmin Oh, Shijo Nagao, and Katsuaki Suganuma
    • Organizer
      65th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      San Diego
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Low Temperature Die Attach Based on Submicrometer Ag Particles and the High Temperature Reliability of Sintered Joints2015

    • Author(s)
      Hao Zhang, Shunsuke Koga, Jinting Jiu, Shijo Nagao, Yasuha Izumi, Emi Yokoi, and Katsuaki Suganuma
    • Organizer
      65th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      San Diego
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Silver sinter joining and new thin film bonding for WBG die-attach2014

    • Author(s)
      K. Suganuma, S. Nagao, T. Sugahara, C. Oh, H. Zhang, S. Koga, S. Park
    • Organizer
      2nd International Conference on Nanojoining and Microjoining
    • Place of Presentation
      Emmetten
    • Year and Date
      2014-12-07 – 2014-12-10
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] 2.SiC die-attch on DBA substrate with ceramic nano-particles added hybrid Ag particle paste2014

    • Author(s)
      H. Zhang, S. Nagao, K. Suganuma
    • Organizer
      Materials Science & Technology 2014,
    • Place of Presentation
      Pittsburgh
    • Year and Date
      2014-10-12 – 2014-10-16
    • Related Report
      2014 Annual Research Report
  • [Presentation] 6.Pressureless Ag thin-film die-attach for SiC devices C. Oh2014

    • Author(s)
      S. Nagao, S. Koga , T. Sugahara, K. Suganuma
    • Organizer
      European Conference of Silicon Carbide & Repated Materials (ECSCRM)
    • Place of Presentation
      Grenoble
    • Year and Date
      2014-09-21 – 2014-09-25
    • Related Report
      2014 Annual Research Report
  • [Presentation] 7.Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging2014

    • Author(s)
      S. Nagao, N. Fujisawa , T. Sugioka, S. Ogawa, T. Fujibayashi, T. Wada, T. Sugahara, K. Suganuma
    • Organizer
      European Conference of Silicon Carbide & Repated Materials (ECSCRM)
    • Place of Presentation
      Grenoble
    • Year and Date
      2014-09-21 – 2014-09-25
    • Related Report
      2014 Annual Research Report
  • [Presentation] SiC 粒子を添加した銀ペーストの焼結特性の改善2014

    • Author(s)
      張昊, 長尾至成, 朴聖源, 菅原徹, 菅沼克昭
    • Organizer
      第24回マイクロエレクトロニクスシンポジウム(MES2014)
    • Place of Presentation
      大阪
    • Year and Date
      2014-09-04 – 2014-09-05
    • Related Report
      2014 Annual Research Report
  • [Presentation] Towards high reliability interconnections for advanced electronics2014

    • Author(s)
      K. Suganuma, S. Nagao, T. Sugahara
    • Organizer
      67th IIW Annual Assembly & International Conference (IIW2014)
    • Place of Presentation
      Soul
    • Year and Date
      2014-07-17 – 2014-07-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] 7.Ultrasonic bonding of Cu/Al clad ribbon interconnections in power electronic modules2014

    • Author(s)
      S. Park, S. Nagao, T. Sugahara, E. Yokoi, O. Iizuka, K. Suganuma
    • Organizer
      67th IIW Annual Assembly & International Conference
    • Place of Presentation
      Seoul
    • Year and Date
      2014-07-13 – 2014-07-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] Interconnection materials for high-temperature electronics applications2014

    • Author(s)
      K. Suganuma,
    • Organizer
      International Conference on Electronic Materials 2014 (IUMRS)
    • Place of Presentation
      Taipei
    • Year and Date
      2014-06-10 – 2014-06-14
    • Related Report
      2014 Annual Research Report
  • [Presentation] From lead-free soldering to new interconnections for advanced electronics2014

    • Author(s)
      K. Suganuma
    • Organizer
      Chinese Welding Society
    • Place of Presentation
      Beijing
    • Year and Date
      2014-06-09 – 2014-06-13
    • Related Report
      2014 Annual Research Report
  • [Presentation] 8.Microimpact testing for miniaturized electronic component packaging2014

    • Author(s)
      S. Nagao, Y.-S. Kim, T. Sugahara, Y. Onishi, K. Suganuma
    • Organizer
      The 64th IEEE Electronic Components and Technology Conference (ECTC2014)
    • Place of Presentation
      Lake Buena Vista
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] 9.Low-pressure sintering bonding with Cu and CuO flake paste for power devices2014

    • Author(s)
      S.W. Park, R. Uwataki, S. Nagao, T. Sugahara, Y. Katoh, H.Ishino, K. Sugiura, K. Tsuruta, K. Suganuma
    • Organizer
      The 64th IEEE Electronic Components and Technology Conference (ECTC2014)
    • Place of Presentation
      Lake Buena Vist
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] 10.Pressure-Less Plasma Sintering of Cu Paste for SiC Die-Attach of High-Temperature Power Device Manufacturing2014

    • Author(s)
      S. Nagao, K. Kodani, S. Sakamoto, S. W. Park, T. Sugahara, K. Suganuma
    • Organizer
      The 64th IEEE Electronic Components and Technology Conference (ECTC2014)
    • Place of Presentation
      Lake Buena Vista
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] Pressure-less Si Wafer Bonding Using Sputtered Ag Thin Films2014

    • Author(s)
      Chulmin Oh, Shijo Nagao, Katsuaki Suganuma
    • Organizer
      TMS 2014 143rd Annual Meeting & Exhibition
    • Place of Presentation
      San Diego, CA, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Microstructure Refinement in Sn-Ag-Bi-In Solder by Adding SiC Nanoparticles to Reduce Electromigration under High Electric Current2014

    • Author(s)
      Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke, Joerg Stogies
    • Organizer
      TMS 2014 143rd Annual Meeting & Exhibition
    • Place of Presentation
      San Diego, CA, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Partial transient liquid phase bonding for hightemperature power electronics using Sn/Zn/Sn sandwich structure solder2014

    • Author(s)
      Sungwon Park1, Shijo Nagao1, Tohru Sugahara1, Yoshitaka Katoh2, Hiroshi Ishino2, Kazuhiko Sugiura2, Katsuaki Suganuma
    • Organizer
      CIPS 2014 8th Meeting & Exhibition
    • Place of Presentation
      Nuremberg, Germany
    • Related Report
      2013 Annual Research Report
  • [Presentation] High Temperature Compatibility of Interface between Al Ribbon and Au finished DBC Substrate2014

    • Author(s)
      Semin Park, Shijo Nagao, Katsuaki Suganuma
    • Organizer
      CIPS 2014 8th Meeting & Exhibition
    • Place of Presentation
      Nuremberg, Germany
    • Related Report
      2013 Annual Research Report
  • [Presentation] Oxidation Resistance and Joining Properties of Cr-Doped Zn Bonding for SiC Die-Attachment2013

    • Author(s)
      S.-W. Park, T. Sugahara, S. Nagao, K. Suganuma
    • Organizer
      63rd IEEE Electronic Components and Technology Conference 2013
    • Place of Presentation
      Las Vegas, NV, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Thermomechanical Reliability of Ag Flake Paste for Die-Attached Power Devices in Thermal Cycling2013

    • Author(s)
      S. Sakamoto, S. Nagao, K. Suganuma
    • Organizer
      63rd IEEE Electronic Components and Technology Conference 2013
    • Place of Presentation
      Las Vegas, NV, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Thermo-mechanical Stress-driven Ag Direct Bonding2013

    • Author(s)
      Chulmin Oh; Shijo Nagao; Katsuaki Suganuma
    • Organizer
      8th Pacific Rim International Congress on Advanced Materials and Processing
    • Place of Presentation
      Hawaii, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Silver Nanowires Transparent Conductive Films: Fabrication Using Different Sintering Techniques2013

    • Author(s)
      Jiu, Jinting, Tohru Sugahara, Masaya Nogi, Shijo Nagao, Suganuma Katsuaki
    • Organizer
      13th IEEE International Conference on Nanotechnology
    • Place of Presentation
      Shangri-La Hotel, Beijing, China
    • Related Report
      2013 Annual Research Report
  • [Presentation] Photo-sintering of Ag nanowires for Wiring on Transparent Films2013

    • Author(s)
      Katsuaki Suganuma
    • Organizer
      International conference on Flexible and Printed Electronics)
    • Place of Presentation
      The Shilla Hotel, Jeju Island, Korea
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] 銀ダイレクトボンディングにおける接合条件の最適化2013

    • Author(s)
      呉 哲旼,長尾 至成,菅原 徹,菅沼 克昭
    • Organizer
      第23回マイクロエレクトロニクスシンポジウム MES2013
    • Place of Presentation
      大阪大学
    • Related Report
      2013 Annual Research Report
  • [Presentation] 超耐熱 Zn-0.1Cr はんだと Cu 及び Ni 基板の界面反応2013

    • Author(s)
      朴 聖源,長尾 至成,菅原 徹,菅沼 克昭
    • Organizer
      第23回マイクロエレクトロニクスシンポジウム MES2013
    • Place of Presentation
      大阪大学
    • Related Report
      2013 Annual Research Report
  • [Presentation] 銅および酸化銅フレークを用いた低温焼結接合2013

    • Author(s)
      上瀧 領二, 朴 聖源, 菅原 徹, 長尾 至成, 菅沼 克昭
    • Organizer
      日本金属学会 2013秋季講演大会(第153回)
    • Place of Presentation
      金沢大学
    • Related Report
      2013 Annual Research Report
  • [Presentation] Heavy Ribbon Wire Bonding for Advanced Power Module Packages2013

    • Author(s)
      Semin Park, Shijo Nagao, Tohru Sugahara, and Katsuaki Suganuma
    • Organizer
      Solid State Devices and Materials 2013
    • Place of Presentation
      Hilton Fukuoka Sea Hawk, Fukuoka, Japan
    • Related Report
      2013 Annual Research Report
  • [Presentation] Electromigration effect on mechanical shock behavior of Sn-Ag-Bi-In + Co solder joints for surface-mounted chip components2013

    • Author(s)
      Youngseok Kim, Shijo Nagao, Tohru Sugahara and Katsuaki Suganuma
    • Organizer
      Solid State Devices and Materials 2013
    • Place of Presentation
      Hilton Fukuoka Sea Hawk, Fukuoka, Japan
    • Related Report
      2013 Annual Research Report
  • [Presentation] Effect of Sn Whisker Mitigation by Addition of a Small Amount of Bi2013

    • Author(s)
      Jung-Lae Jo
    • Organizer
      TMS2013 142nd Annual Meeting & Exhibition
    • Place of Presentation
      San Antonio, Texas, USA
    • Related Report
      2012 Annual Research Report
  • [Presentation] Application of pure Zn for void-free Si wafer bonding without metallization layer2013

    • Author(s)
      S.W. Park
    • Organizer
      The 16th SANKEN International Symposium 2013/ The 11th SANKEN Nanotechnology Symposium
    • Place of Presentation
      ISIR, Osaka University, Osaka, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Film thickness effect on tin whisker growth by thermal cycling2013

    • Author(s)
      Jung-Lae Jo
    • Organizer
      The 16th SANKEN International Symposium 2013/ The 11th SANKEN Nanotechnology Symposium
    • Place of Presentation
      ISIR, Osaka University, Osaka, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Interface nanomechanics and dynamics2013

    • Author(s)
      S. Nagao
    • Organizer
      The 16th SANKEN International Symposium 2013/ The 11th SANKEN Nanotechnology Symposium
    • Place of Presentation
      ISIR, Osaka University, Osaka, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing2012

    • Author(s)
      Youngseok Kim
    • Organizer
      IEEE CPMT Symposium Japan 2012
    • Place of Presentation
      Kyoto, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Effect of Ag Film Deposition Temperature on Ag Direct Bonding2012

    • Author(s)
      Chulmin Oh
    • Organizer
      8th Handai Nanoscience and Nanotechnology International Symposium
    • Place of Presentation
      Osaka, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Thermomechanical Reliability of Ag Sinter Joining in Thermal Cycling2012

    • Author(s)
      Soichi Sakamoto
    • Organizer
      8th Handai Nanoscience and Nanotechnology International Symposium
    • Place of Presentation
      Osaka, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Fabrication of Copper Electrodes by Intense Pulsed Light Sintering Technique2012

    • Author(s)
      Teppei Araki
    • Organizer
      8th Handai Nanoscience and Nanotechnology International Symposium
    • Place of Presentation
      Osaka, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] SiC Die-attachment with Minor Elements Added Pure Zn under Formic Acid Reflow2012

    • Author(s)
      S.W. Park
    • Organizer
      4th Electronics System-Integration Technology Conference (ESTC 2012)
    • Place of Presentation
      Amsterdam, Netherlands
    • Related Report
      2012 Annual Research Report
  • [Presentation] Influence of tin plating thickness on whisker growth during thermal cycling2012

    • Author(s)
      Jung-Lae Jo
    • Organizer
      2012 Electronics System Integration Technologies Conference (ESTC2012)
    • Place of Presentation
      Amsterdam, Netherlands
    • Related Report
      2012 Annual Research Report
  • [Book] シーエムシー2016

    • Author(s)
      菅沼克昭
    • Total Pages
      278
    • Publisher
      次世代パワー半導体実装の要素技術と信頼性
    • Related Report
      2016 Annual Research Report
  • [Book] SiC/GaNパワー半導体の実装と信頼性評価技術2014

    • Author(s)
      菅沼克昭
    • Total Pages
      256
    • Publisher
      日刊工業新聞社
    • Related Report
      2014 Annual Research Report
  • [Book] 導電性接着剤入門2014

    • Author(s)
      菅沼克昭
    • Total Pages
      144
    • Publisher
      科学技術出版社
    • Related Report
      2014 Annual Research Report
  • [Book] 最新材料の性能・評価技術 第8章編著2014

    • Author(s)
      菅沼克昭
    • Total Pages
      44
    • Publisher
      産業技術サービスセンター
    • Related Report
      2014 Annual Research Report
  • [Book] 車載機器実装の接続信頼性向上2014

    • Author(s)
      菅沼克昭
    • Total Pages
      13
    • Publisher
      シーエムシー出版
    • Related Report
      2014 Annual Research Report
  • [Book] Snウィスカによる機器故障の歴史2014

    • Author(s)
      菅沼克昭
    • Total Pages
      10
    • Publisher
      シーエムシー出版
    • Related Report
      2014 Annual Research Report
  • [Book] 鉛フリーはんだ付け入門2013

    • Author(s)
      菅沼克昭
    • Total Pages
      208
    • Publisher
      大阪大学出版会
    • Related Report
      2013 Annual Research Report
  • [Remarks] 菅沼研究室

    • URL

      http://www.eco.sanken.osaka-u.ac.jp/about/research/

    • Related Report
      2014 Annual Research Report
  • [Remarks] WBGi実装コンソーシアム

    • URL

      http://wbg-i.jp/

    • Related Report
      2014 Annual Research Report
  • [Remarks] 新世代パワー半導体実装技術開発コンソーシアム

    • URL

      http://wbg-i.jp/

    • Related Report
      2013 Annual Research Report
  • [Remarks] 菅沼研究室ホームページ

    • URL

      http://www.eco.sanken.osaka-u.ac.jp/

    • Related Report
      2013 Annual Research Report
  • [Patent(Industrial Property Rights)] 銀ナノ粒子および銀ナノシート2015

    • Inventor(s)
      菅沼克昭、酒金キンテイ
    • Industrial Property Rights Holder
      大阪大学
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2015-146958
    • Filing Date
      2015-07-24
    • Related Report
      2015 Annual Research Report
  • [Patent(Industrial Property Rights)] 銅粒子の製造方法2015

    • Inventor(s)
      菅沼克昭, 酒 金テイ
    • Industrial Property Rights Holder
      菅沼克昭, 酒 金テイ
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2015-043640
    • Filing Date
      2015-03-05
    • Related Report
      2014 Annual Research Report
  • [Patent(Industrial Property Rights)] 複合構造体および接合構造体の製造方法2015

    • Inventor(s)
      菅沼克昭, 酒 金テイ
    • Industrial Property Rights Holder
      菅沼克昭, 酒 金テイ
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2015-041268
    • Filing Date
      2015-03-03
    • Related Report
      2014 Annual Research Report
  • [Patent(Industrial Property Rights)] 接合構造体、及び、接合構造体の製造方法2014

    • Inventor(s)
      菅沼克昭、長尾至城、呉 哲ミン
    • Industrial Property Rights Holder
      菅沼克昭、長尾至城、呉 哲ミン
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2014-248918
    • Filing Date
      2014-12-09
    • Related Report
      2014 Annual Research Report
  • [Patent(Industrial Property Rights)] 接合構造体の製造方法、構造体および装置2013

    • Inventor(s)
      菅沼 克昭、菅原 徹、長尾 至成
    • Industrial Property Rights Holder
      大阪大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-04-01
    • Related Report
      2013 Annual Research Report
  • [Patent(Industrial Property Rights)] 接合構造体、及び接合構造体の製造方法2013

    • Inventor(s)
      菅沼 克昭、長尾 至成、呉 哲ミン
    • Industrial Property Rights Holder
      大阪大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-04-01
    • Related Report
      2013 Annual Research Report
  • [Patent(Industrial Property Rights)] 接合方法2013

    • Inventor(s)
      菅沼 克昭、長尾 至成、菅原 徹 他
    • Industrial Property Rights Holder
      大阪大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-04-01
    • Related Report
      2013 Annual Research Report

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Published: 2012-11-27   Modified: 2022-03-01  

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