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Seeking innovative alloy elements for development of low-temperature and high-reliability Cu-alloy interconnects and electrodes with reducing process temperature

Research Project

Project/Area Number 24360307
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypePartial Multi-year Fund
Section一般
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

ITO KAZUHIRO  大阪大学, 接合科学研究所, 教授 (60303856)

Co-Investigator(Kenkyū-buntansha) KOHAMA Kazuyuki  大阪大学, 接合科学研究所, 助教 (00710287)
Project Period (FY) 2012-04-01 – 2015-03-31
Project Status Completed (Fiscal Year 2014)
Budget Amount *help
¥17,940,000 (Direct Cost: ¥13,800,000、Indirect Cost: ¥4,140,000)
Fiscal Year 2014: ¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Fiscal Year 2013: ¥2,990,000 (Direct Cost: ¥2,300,000、Indirect Cost: ¥690,000)
Fiscal Year 2012: ¥11,830,000 (Direct Cost: ¥9,100,000、Indirect Cost: ¥2,730,000)
KeywordsCu配線 / 熱処理 / Cu(Mg) / Cu(Ti) / 抵抗率 / 密着性 / 接触抵抗 / IGZO / Cu合金膜 / マグネシウム / チタン / ITO
Outline of Final Research Achievements

For development of high-performance electronic devices, not only seeking innovative semiconductors but also reduction of energy consumption at metal interconnects and electrode/TFT interfaces is essential. In LCDs and touch panels, copper is one of candidate materials for the purpose, but there is Cu-related issues to be overcome such as poor adhesion to glass substrates. We have successfully prepared low-resistivity and excellent-adhesion Cu interconnects on glass substrates using Cu(Mg) alloy films. Mg as the selected alloy element can reduce the process temperature and time to lower than 300°C within 30 min. In addition, for development of high-performance IGZO-TFT devices with ITO/Cu(M)/IGZO contact junctions, contact resistance of Cu(Ti)/ITO and Cu(Ti)/IGZO, and their interface microstructure were investigated. At the interface, Ti in the alloy elements could form the amorphous TiOx reaction layer which exhibited p-type semiconducting properties, leading low contact resistance.

Report

(4 results)
  • 2014 Annual Research Report   Final Research Report ( PDF )
  • 2013 Annual Research Report
  • 2012 Annual Research Report
  • Research Products

    (22 results)

All 2015 2014 2013 2012

All Journal Article (4 results) (of which Peer Reviewed: 3 results,  Acknowledgement Compliant: 1 results) Presentation (18 results) (of which Invited: 5 results)

  • [Journal Article] Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass Substrates2014

    • Author(s)
      K. Ito, K. Hamasaka, K. Kohama, Y. Shirai, and M. Murakami
    • Journal Title

      Journal of Electronic Materials

      Volume: 43 Issue: 7 Pages: 2540-2547

    • DOI

      10.1007/s11664-014-3224-0

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Synthesis using Cu(Ti) alloy films for self-forming functionality in electronic devices2014

    • Author(s)
      K. Ito and K. Kohama
    • Journal Title

      Transactions of JWRI

      Volume: 43 Pages: 37-43

    • NAID

      120005588197

    • Related Report
      2014 Annual Research Report
  • [Journal Article] Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass Substrates2014

    • Author(s)
      Kazuhiro Ito
    • Journal Title

      Journal of Electrnic Materials

      Volume: -

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 電子デバイス用Cu配線におけるCu合金膜を用いた複数機能一体形成2013

    • Author(s)
      伊藤和博
    • Journal Title

      まてりあ

      Volume: 52 Pages: 108-115

    • NAID

      10031155976

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Presentation] Contact-Resistance Reduction for Cu(Ti)/Conductive-Oxide-Film Junction2015

    • Author(s)
      伊藤 和博
    • Organizer
      The 6th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-6)
    • Place of Presentation
      早稲田大学, 東京都
    • Year and Date
      2015-06-09
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Reduction of Contact Resistance for Cu(Ti)/IGZO Junction2014

    • Author(s)
      K. Ito, K. Kohama, T. Sano, T. Nabatame and A. Ohi
    • Organizer
      The 5th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5) Conjunction with 6th IBB Frontier Symp.
    • Place of Presentation
      東京医科歯科大学, 東京都
    • Year and Date
      2014-11-19
    • Related Report
      2014 Annual Research Report
  • [Presentation] Synthesis using Cu(Ti) alloy films for self-forming functionality in electronic devices2014

    • Author(s)
      Kazuhiro ITO
    • Organizer
      AUN/SEED-NET Regional Conference on Materials Engineering 2014
    • Place of Presentation
      Kuala Lumpur, Malaysia
    • Year and Date
      2014-11-11 – 2014-11-12
    • Related Report
      2014 Annual Research Report
  • [Presentation] 電子デバイス用Cu配線におけるCu合金膜を用いた複数機能一体形成2014

    • Author(s)
      伊藤 和博
    • Organizer
      日本金属学会秋期講演大会
    • Place of Presentation
      名古屋大学, 愛知県
    • Year and Date
      2014-09-24 – 2014-09-26
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Cu(Ti)合金膜を用いたIGZO膜への低接触抵抗電極の作製2014

    • Author(s)
      伊藤 和博, 小濱 和之, 佐野 貴之, 生田目 俊秀, 大井 暁彦
    • Organizer
      (公社)日本金属学会 2014年秋期大会
    • Place of Presentation
      名古屋大学, 愛知県
    • Year and Date
      2014-09-24 – 2014-09-26
    • Related Report
      2014 Annual Research Report
  • [Presentation] 接合界面での反応を利用したp型Ti基酸化物導電膜の作製2014

    • Author(s)
      伊藤 和博, 林 徳樺, 小濱 和之, 白井 泰治, 村上 正紀
    • Organizer
      (一社)溶接学会 平成26年度秋季全国大会
    • Place of Presentation
      黒部市宇奈月国際会館セレネ,富山県
    • Year and Date
      2014-09-10 – 2014-09-12
    • Related Report
      2014 Annual Research Report
  • [Presentation] Low-temperature synthesis of Cu interconnects on glass using Cu(Mg) alloy films2014

    • Author(s)
      Kazuyuki Kohama
    • Organizer
      TMS2014 Annual Meeting & Exhibition
    • Place of Presentation
      San Diego Convention Center (California, USA)
    • Related Report
      2013 Annual Research Report
  • [Presentation] Synthesis of low contact-resistance Cu(Ti)/ITO junctions2014

    • Author(s)
      Kazuhiro Ito
    • Organizer
      TMS2014 Annual Meeting & Exhibition
    • Place of Presentation
      San Diego Convention Center (California, USA)
    • Related Report
      2013 Annual Research Report
  • [Presentation] 低抵抗・高密着Cu配線形成のためのCu(Mg)合金膜を用いた低温プロセス開発2013

    • Author(s)
      伊藤和博
    • Organizer
      日本金属学会
    • Place of Presentation
      東京理科大学(東京都)
    • Year and Date
      2013-03-27
    • Related Report
      2012 Annual Research Report
  • [Presentation] Cu-interconnect synthesis on glass using Cu(Mg) alloy2013

    • Author(s)
      Kazuyuki Kohama
    • Organizer
      International Symposium on Interfacial Joining and Surface Technology
    • Place of Presentation
      大阪大学銀杏会館 (大阪府)
    • Related Report
      2013 Annual Research Report
  • [Presentation] Integration of various functions using Ti as an alloy element for Cu interconnects in electronic devices2013

    • Author(s)
      Kazuhiro Ito
    • Organizer
      韓国金属材料学会2013春期大会(招待講演)
    • Place of Presentation
      済州島 (韓国)
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] ガラス基板上への高密着Cu膜の低温接合2013

    • Author(s)
      小濱和之
    • Organizer
      溶接学会 平成25年度秋季全国大会
    • Place of Presentation
      岡山理科大学 (岡山県)
    • Related Report
      2013 Annual Research Report
  • [Presentation] 電子デバイス用Cu配線におけるCu合金膜を用いた複数機能一体形成2013

    • Author(s)
      伊藤和博
    • Organizer
      京都大学工学研究科附属量子理工学教育研究センター 第14回公開シンポジウム(招待講演)
    • Place of Presentation
      量子理工学教育研究センター(京都府)
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] 子デバイスへのCu配線形成のための金属材料学的アプローチ2013

    • Author(s)
      伊藤和博
    • Organizer
      日本金属学会 第1回エレクトロニクス薄膜材料研究会(招待講演)
    • Place of Presentation
      大阪大学中ノ島センター(大阪府)
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] Reduction of Process Temperature and Time for Producing Low-Resistivity and excellent-Adhesion Cu Interconnects on Glass Substrates Using Cu(Mg) Alloy Films2012

    • Author(s)
      Keiji Hamasaka
    • Organizer
      Visualization in Joining & Welding Science through Adv. Measurements and Simulation (Visual-JW2012)
    • Place of Presentation
      ホテル阪急エキスポパーク(大阪府)
    • Year and Date
      2012-11-29
    • Related Report
      2012 Annual Research Report
  • [Presentation] Reduction of Contact Resistance for Cu(Ti)/ITO Junction2012

    • Author(s)
      Kazuhiro ITO
    • Organizer
      Visualization in Joining & Welding Science through Adv. Measurements and Simulation (Visual-JW2012)
    • Place of Presentation
      ホテル阪急エキスポパーク(大阪府)
    • Year and Date
      2012-11-29
    • Related Report
      2012 Annual Research Report
  • [Presentation] Reduction of Process Temperature and Time for Producing Low-Resistivity and excellent-Adhesion Cu Interconnects on Glass Substrates Using Cu(Mg) Alloy Films2012

    • Author(s)
      Kazuhiro ITO
    • Organizer
      The 3rd Int. Symp. on Adv. Materials Development and Integrati on of Novel Structural Metallic and Inorganic Materials (AMDI3)
    • Place of Presentation
      ロワジールホテル豊橋(愛知県)
    • Year and Date
      2012-11-06
    • Related Report
      2012 Annual Research Report
  • [Presentation] Cu(M)/ガラス試料の低抵抗fb7)ためのMg合金元素による熱処理湿度・時間の低温・短時間化2012

    • Author(s)
      浜坂啓司
    • Organizer
      日本金属学会
    • Place of Presentation
      愛媛大学(愛媛県)
    • Year and Date
      2012-09-18
    • Related Report
      2012 Annual Research Report

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Published: 2012-04-24   Modified: 2019-07-29  

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