Development of 3D-shape measurement technique of an electronic substrate with electronic parts
Project/Area Number |
24560289
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Multi-year Fund |
Section | 一般 |
Research Field |
Intelligent mechanics/Mechanical systems
|
Research Institution | Kanazawa University |
Principal Investigator |
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Project Period (FY) |
2012-04-01 – 2015-03-31
|
Project Status |
Completed (Fiscal Year 2014)
|
Budget Amount *help |
¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2014: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2013: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2012: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
|
Keywords | 3次元形状計測 / スペックル干渉計 / 位相抽出 / ランダム振動 / 波長可変レーザー / 位相シフト / 干渉計測 / 空気擾乱 / 振動 / 波長走査 / スペックル / 位相差マップ / 距離計測 / スペックル干渉 / 計測工学 / 3次元形状 / 半導体レーザ |
Outline of Final Research Achievements |
We have developed a 3D-shape measurement technique of an electronic substrate with electronic parts using a wavelength variable laser. In the technique many speckle interferograms are captured under small random vibrations in environment. These vibrations would make phase shifts between the captured interferograms random. Amounts of these shifts are calculated through Max & Min light intensities searchings at two different pixels in frames and twin normalizations of their intensity changes. The calculated shifts and light-intensity changes at pixels are used to extract phase distribution with the Least-Squares Algorithm. During the laser wavelength is varied from 778.20nm to 780.28nm, 140 specklegrams are captured, and phase distributions are extracted regarding 7 different wavelengths. The ratios of phase change against wavelength change are extracted at all pixels of the frame. 3D shape is then calculated from the obtained ratios.
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Report
(4 results)
Research Products
(6 results)