| Project/Area Number |
25289249
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (B)
|
| Allocation Type | Partial Multi-year Fund |
|---|
| Section | 一般 |
|---|
| Research Field |
Structural/Functional materials
|
|---|
| Research Institution | Kyushu Institute of Technology |
|---|
Principal Investigator |
ISHIMARU MANABU 九州工業大学, 大学院工学研究院, 教授 (00264086)
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
SATO Kazuhisa 大阪大学, 超高圧電子顕微鏡センター, 准教授 (70314424)
NAITO Muneyuki 甲南大学, 理工学部, 准教授 (10397721)
|
|---|
| Project Period (FY) |
2013-04-01 – 2016-03-31
|
| Project Status |
Completed (Fiscal Year 2015)
|
| Budget Amount *help |
¥19,110,000 (Direct Cost: ¥14,700,000、Indirect Cost: ¥4,410,000)
Fiscal Year 2015: ¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000)
Fiscal Year 2014: ¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2013: ¥10,920,000 (Direct Cost: ¥8,400,000、Indirect Cost: ¥2,520,000)
|
|---|
| Keywords | ナノ構造材料 / 照射効果 / アモルファス化 / 先端的電子顕微鏡技術 |
|---|
| Outline of Final Research Achievements |
Energetic particles emitted in the decay of radioactive elements induce atomic damage such as vacancies, interstitials, and cascades, in materials. Long-term operations under such extreme environments lead to damage accumulation, and consequently severe degradation of the mechanical properties of the materials can occur due to volume swelling, amorphization, and concomitant micro-cracking. Nuclear materials are often exposed under harsh radiation environments that induce atomic displacement in materials, and therefore it is of technological importance to enhance radiation tolerance. Introduction of a large amount of interfaces into materials is expected to enhance radiation tolerance, since they act as effective defect sinks. In the present study, we prepared nanostructures SiC in which numerous stacking faults and twins are included and examined its radiation-induced amorphization resistance. As a consequence, we found the improvement of radiation tolerance in the materials.
|
