Budget Amount *help |
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2014: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2013: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
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Outline of Final Research Achievements |
Low-resistivity contact formation by band potential control with a high-impurity contained amorphous Si insertion layer was investigated for Silicon carbide (SiC) devices. Using a proposed method, effective contact property of 2x10-6Ωcm2 was achieved without annealing process of metal electrode. XPS measurement revealed that defect controlled a-Si insertion layer reduces potential energy offset. From these results, band offset alignment was controlled by proposed defect-controlled a-Si layer insertion. These results expected to increase SiC device reliability and properties.
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