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Suppression and Utilization of Migration Phenomena Based on Control of Passivation for Metallic Thin Film and Micro Ball

Research Project

Project/Area Number 26289001
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypePartial Multi-year Fund
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionTohoku University

Principal Investigator

SAKA Masumi  東北大学, 工学(系)研究科(研究院), 教授 (20158918)

Co-Investigator(Kenkyū-buntansha) 燈明 泰成  東北大学, 工学(系)研究科(研究院), 准教授 (50374955)
笹川 和彦  弘前大学, 理工学研究科, 教授 (50250676)
趙 旭  秋田大学, 工学(系)研究科(研究院), 助教 (20650790)
Project Period (FY) 2014-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥16,510,000 (Direct Cost: ¥12,700,000、Indirect Cost: ¥3,810,000)
Fiscal Year 2016: ¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2015: ¥6,500,000 (Direct Cost: ¥5,000,000、Indirect Cost: ¥1,500,000)
Fiscal Year 2014: ¥5,850,000 (Direct Cost: ¥4,500,000、Indirect Cost: ¥1,350,000)
Keywords金属薄膜配線 / はんだボール / エレクトロマイグレーション / ストレスマイグレーション / 金属マイクロ材料
Outline of Final Research Achievements

Suppression and utilization of electromigration (EM), which is a phenomenon of atomic diffusion due to electron flow in high density, and utilization of stress migration (SM) caused by a gradient of hydrostatic stress were studied by considering the effect of passivation on these migration phenomena. Regarding the suppression, EM damages of void and hillock in passivated metallic thin-film lines and solder balls covered with underfill material were treated. Here, the threshold current density, which is the critical value of current density for the initiation of damages, was characterized based on the distribution of atomic density in a material covered with passivation. Regarding the utilization, on the other hand, fabrication of metallic micro materials based on EM or SM with the controlled use of passivation was demonstrated.

Report

(4 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Annual Research Report
  • 2014 Annual Research Report

Research Products

(54 results)

All 2017 2016 2015 2014 Other

All Int'l Joint Research (1 results) Journal Article (14 results) (of which Int'l Joint Research: 2 results,  Peer Reviewed: 14 results,  Acknowledgement Compliant: 13 results,  Open Access: 2 results) Presentation (37 results) (of which Int'l Joint Research: 10 results,  Invited: 2 results) Remarks (2 results)

  • [Int'l Joint Research] 嘉興学院(中国)

    • Related Report
      2015 Annual Research Report
  • [Journal Article] Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder2017

    • Author(s)
      X. Zhao, S. Takaya, M. Muraoka
    • Journal Title

      Journal of Electronic Materials

      Volume: 印刷中 Pages: 4999-5006

    • DOI

      10.1007/s11664-017-5507-8

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Length-dependent Electromigration Behavior of Sn58Bi Solder and Critical Length of Electromigration2017

    • Author(s)
      X. Zhao, M. Muraoka, M. Saka
    • Journal Title

      Journal of Electronic Materials

      Volume: 46 Pages: 1287-1292

    • DOI

      10.1007/s11664-016-5093-1

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Evaluation of Threshold Current Density of Electromigration Damage Considering Passivation Thickness2016

    • Author(s)
      H. Kikuchi, K. Sasagawa, K. Fujisaki
    • Journal Title

      2016 International Conference on Advances in Electrical, Electronic and Systems Engineering (ICAEESE 2016), Conference Paper Collection

      Volume: -

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Theoretical Consideration of Electromigration Damage around a Right-angled Corner in a Passivated Line Composed of Dissimilar Metals2016

    • Author(s)
      M. Saka, Y. Kimura, X. Zhao
    • Journal Title

      Microsystem Technologies

      Volume: -

    • DOI

      10.1007/s00542-016-3178-7

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Damage of Single-wall Carbon Nanotube Network Structure under Electric Current Loading2016

    • Author(s)
      S. Sato, K. Fujisaki, K. Sasagawa
    • Journal Title

      Mechanical Engineering Journal

      Volume: 3

    • DOI

      10.1299/mej.16-00292

    • NAID

      130005250610

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Suitable Passivation Thickness on a Metal Line to Prevent Electromigration Damage2016

    • Author(s)
      Y. Kimura, H. Ikadai, T. Nakakura, M. Saka
    • Journal Title

      Materials Letters

      Volume: 184 Pages: 219-222

    • DOI

      10.1016/j.matlet.2016.08.059

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Influence of Local Thermal Dissipation on Electromigration in an Al Thin-film Line2016

    • Author(s)
      Y. Li, H.-T. Lee, M. Saka
    • Journal Title

      Microelectronics Reliability

      Volume: 65 Pages: 178-183

    • DOI

      10.1016/j.microrel.2016.08.002

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Effect of temperature on preventing electromigration damage based on increasing threshold current density in a thin metal passivated line2016

    • Author(s)
      H. Ikadai, Y. Kimura, M. Saka
    • Journal Title

      Mechanical Engineering Letters

      Volume: 2 Issue: 0 Pages: 15-00714-15-00714

    • DOI

      10.1299/mel.15-00714

    • NAID

      130005156954

    • ISSN
      2189-5236
    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Forming Long Ag Thin Wires by Using Stress Migration2016

    • Author(s)
      Y. Lu, Y. Li, M. Saka
    • Journal Title

      Materials Letters

      Volume: 171 Pages: 72-74

    • DOI

      10.1016/j.matlet.2016.02.064

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure with Reservoir2015

    • Author(s)
      K. Fujisaki, H. Narita, K. Sasagawa
    • Journal Title

      Proceedings of ASME 2015 InterPACK/ICNMM

      Volume: 2

    • DOI

      10.1115/ipack2015-48744

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Growth of Ag Micro/Nanoparticles Using Stress Migration from Multilayered Metallic Structure2015

    • Author(s)
      Y. Lu, Y. Li, M. Saka
    • Journal Title

      Applied Surface Science

      Volume: 351 Pages: 1011-1015

    • DOI

      10.1016/j.apsusc.2015.06.037

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] A Parameter Governing the Melting Induced at the Micrometer Level in a Dissimilar Metal Wire System by Joule Heating2015

    • Author(s)
      H. Tohmyoh, T. Sunagawa
    • Journal Title

      Journal of Applied Physics

      Volume: 117

    • DOI

      10.1063/1.4922633

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Fast and Uniform Heating of Cu Microwires Using Electrical Current2015

    • Author(s)
      H. Tohmyoh, Y. Matsudo
    • Journal Title

      Appl. Phys. Express

      Volume: 8 Issue: 4 Pages: 045503-045503

    • DOI

      10.7567/apex.8.045503

    • NAID

      210000137478

    • ISSN
      1882-0778, 1882-0786
    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Welding Dissimilar Metal Microwires by Joule Heating2015

    • Author(s)
      T. Sunagawa, H. Tohmyoh
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 印刷中

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Presentation] リザーバ形状が微細構造配線のエレクトロマイグレーションしきい電流密度に及ぼす影響2017

    • Author(s)
      高谷隆司,水科拓己,笹川和彦,藤﨑和弘,森脇健司
    • Organizer
      日本機械学会東北学生会 第 47 回学生員卒業研究発表講演会
    • Place of Presentation
      東北学院大学(多賀城市)
    • Year and Date
      2017-03-08
    • Related Report
      2016 Annual Research Report
  • [Presentation] ストレスマイグレーションによる微小材料創製の制御2016

    • Author(s)
      李 心慈,坂 真澄
    • Organizer
      日本機械学会 第24回機械材料・材料加工技術講演会(M&P 2016)
    • Place of Presentation
      早稲田大学(新宿区)
    • Year and Date
      2016-11-25
    • Related Report
      2016 Annual Research Report
  • [Presentation] 異種金属のマイクロ細線をジュール熱により接合するのに必要な電流について2016

    • Author(s)
      燈明泰成
    • Organizer
      日本機械学会 第24回機械材料・材料加工技術講演会(M&P 2016)
    • Place of Presentation
      早稲田大学(新宿区)
    • Year and Date
      2016-11-25
    • Related Report
      2016 Annual Research Report
  • [Presentation] 折れ曲がりサブミクロン電子配線におけるエレクトロマイグレーション損傷しきい電流密度の評価2016

    • Author(s)
      水科拓己,菊池大樹,笹川和彦,藤﨑和弘
    • Organizer
      日本機械学会 第29回計算力学講演会
    • Place of Presentation
      名古屋大学(名古屋市)
    • Year and Date
      2016-09-22
    • Related Report
      2016 Annual Research Report
  • [Presentation] Effect of Taper Shape of IC Line on Threshold Current Density of Electromigration Damage2016

    • Author(s)
      H. Kikuchi, K. Sasagawa, K. Fujisaki
    • Organizer
      Asia-Pacific Conference on Fracture and Strength 2016 (APCFS2016)
    • Place of Presentation
      Toyama International Conference Center (Toyama, Japan)
    • Year and Date
      2016-09-19
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Influence of Breaking Edges on Whisker Growth on Passivated Al Film through Stress Migration2016

    • Author(s)
      T. H. Ludwig, H.-T. Lee, M. Saka
    • Organizer
      日本機械学会東北支部 第52期秋期講演会
    • Place of Presentation
      秋田県民会館ジョイナス(秋田市)
    • Year and Date
      2016-09-17
    • Related Report
      2016 Annual Research Report
  • [Presentation] Effect of Passivation on Suppression or Utilization of Atomic Migration Phenomena in Metallic Thin-film Materials2016

    • Author(s)
      M. Saka
    • Organizer
      6th Int.Conf. and Exhibition on Materials Science and Engineering (Materials Science 2016)
    • Place of Presentation
      Hilton Atlanta Airport (Atlanta, USA)
    • Year and Date
      2016-09-12
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Electromigration in Eutectic Sn58Bi Solder Strips2016

    • Author(s)
      X. Zhao, S. Takaya, M. Muraoka
    • Organizer
      2016 M&M International Symposium for Young Researchers
    • Place of Presentation
      State University of New York at Stony Brook (New York, USA)
    • Year and Date
      2016-08-10
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 折れ曲がり形状を有する微細電子配線の損傷しきい電流密度の評価2016

    • Author(s)
      水科拓己,菊池大樹,笹川和彦,藤﨑和弘
    • Organizer
      日本非破壊検査協会 平成28年度東北支部講演会
    • Place of Presentation
      エル・パーク仙台(仙台市)
    • Year and Date
      2016-04-22
    • Related Report
      2016 Annual Research Report
  • [Presentation] A Trial of Fabricating Micro Material Utilizing Controlled Stress Migration in a Passivated Metallic Film2016

    • Author(s)
      H.-T. Lee, M. Saka
    • Organizer
      日本機械学会東北支部 第51期総会・講演会
    • Place of Presentation
      東北大学(仙台市)
    • Year and Date
      2016-03-11
    • Related Report
      2015 Annual Research Report
  • [Presentation] 次世代低温はんだにおけるエレクトロマイグレーション損傷発生の臨界条件2016

    • Author(s)
      高屋理志,趙 旭,村岡幹夫
    • Organizer
      日本機械学会東北支部 第51期総会・講演会
    • Place of Presentation
      東北大学(仙台市)
    • Year and Date
      2016-03-11
    • Related Report
      2015 Annual Research Report
  • [Presentation] しきい電流密度の向上を目指した金属薄膜配線におけるエレクトロマイグレーション抑制に関する考察2016

    • Author(s)
      中倉輝紀,筏井大斗,木村康裕,坂 真澄
    • Organizer
      日本機械学会東北学生会 第46回卒業研究発表講演会
    • Place of Presentation
      福島大学(福島市)
    • Year and Date
      2016-03-04
    • Related Report
      2015 Annual Research Report
  • [Presentation] エレクトロマイグレーションによるマイクロ・ナノ材料創製のための新規構造の提案2016

    • Author(s)
      菊地博昭,木村康裕,坂 真澄
    • Organizer
      日本機械学会東北学生会 第46回卒業研究発表講演会
    • Place of Presentation
      福島大学(福島市)
    • Year and Date
      2016-03-04
    • Related Report
      2015 Annual Research Report
  • [Presentation] 配線形状の異なるバンブー構造配線におけるエレクトロマイグレーション損傷しきい電流密度2016

    • Author(s)
      水科拓己, 笹川和彦, 藤﨑和弘
    • Organizer
      日本機械学会東北学生会 第46回卒業研究発表講演会
    • Place of Presentation
      福島大学(福島市)
    • Year and Date
      2016-03-04
    • Related Report
      2015 Annual Research Report
  • [Presentation] 異なる長さを有する極微小はんだ接合における高密度電流下の損傷の同時評価2015

    • Author(s)
      趙 旭,村岡幹夫
    • Organizer
      日本機械学会 M&M2015材料力学カンファレンス
    • Place of Presentation
      慶應義塾大学(横浜市)
    • Year and Date
      2015-11-21
    • Related Report
      2015 Annual Research Report
  • [Presentation] 金属薄膜内マイグレーションの抑制と活用における保護膜の役割り2015

    • Author(s)
      坂 真澄
    • Organizer
      日本機械学会 第23回機械材料・材料加工技術講演会(M&P2015)
    • Place of Presentation
      広島大学(東広島市)
    • Year and Date
      2015-11-13
    • Related Report
      2015 Annual Research Report
    • Invited
  • [Presentation] 電流付与下における金属極細線の微細結晶粒の成長について2015

    • Author(s)
      燈明泰成,松土陽平
    • Organizer
      日本機械学会 第23回機械材料・材料加工技術講演会(M&P2015)
    • Place of Presentation
      広島大学(東広島市)
    • Year and Date
      2015-11-13
    • Related Report
      2015 Annual Research Report
  • [Presentation] エレクトロマイグレーションによるしきい電流密度評価のためのドリフト速度についての考察2015

    • Author(s)
      筏井大斗,木村康裕,坂 真澄
    • Organizer
      日本機械学会 第23回機械材料・材料加工技術講演会(M&P2015)
    • Place of Presentation
      広島大学(東広島市)
    • Year and Date
      2015-11-13
    • Related Report
      2015 Annual Research Report
  • [Presentation] 高密度電流下Sn58Biはんだのエレクトロマイグレーション発生の臨界長さ2015

    • Author(s)
      趙 旭,村岡幹夫
    • Organizer
      日本機械学会 第23回機械材料・材料加工技術講演会(M&P2015)
    • Place of Presentation
      広島大学(東広島市)
    • Year and Date
      2015-11-13
    • Related Report
      2015 Annual Research Report
  • [Presentation] き裂の進展現象と細線接触部の溶融現象との類似性に関して2015

    • Author(s)
      燈明泰成
    • Organizer
      第17回破壊力学シンポジウム
    • Place of Presentation
      京都テルサ(京都市)
    • Year and Date
      2015-10-13
    • Related Report
      2015 Annual Research Report
  • [Presentation] Structural Modification of Cu Microwires Having Nanosized Grains Using Joule Heat2015

    • Author(s)
      H. Tohmyoh, Y. Matsudo
    • Organizer
      International Conference on Advanced Technology in Experimental Mechanics 2015 (ATEM’15)
    • Place of Presentation
      Loisir Hotel Toyohashi (Toyohashi, Japan)
    • Year and Date
      2015-10-04
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Damage of CNT Network Structure under Accelerated Condition2015

    • Author(s)
      S. Sato, K. Fujisaki, K. Sasagawa, T. Katabira
    • Organizer
      International Conference on Advanced Technology in Experimental Mechanics 2015 (ATEM 2015)
    • Place of Presentation
      Loisir Hotel Toyohashi (Toyohashi, Japan)
    • Year and Date
      2015-10-04
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Evaluation of Allowable Current Density for Electromigration Damage in Via-connected Interconnect2015

    • Author(s)
      K. Fujisaki, K. Sasagawa, H. Narita
    • Organizer
      17th International Conference on Electronics Materials and Packaging (EMAP2015)
    • Place of Presentation
      Portland State University (Portland, USA)
    • Year and Date
      2015-09-01
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Damage Observation of CNT Networked Structure under High Current Density2015

    • Author(s)
      K. Fujisaki, K. Sasagawa, D. Narita
    • Organizer
      ASME 2015 InterPACK/ICNMM
    • Place of Presentation
      The Fairmont San Francisco Hotel (San Francisco, USA)
    • Year and Date
      2015-07-06
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] An Effective Way to Increase Threshold Current Density against Electromigration of a Metal Line2015

    • Author(s)
      Y. Kimura, H. Ikadai, M. Saka, K. Sasagawa, H. Tohmyoh
    • Organizer
      11th Int. Conf. Diffusion in Solids and Liquids
    • Place of Presentation
      NH Munchen Messe (Munich, Germany)
    • Year and Date
      2015-06-22
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Growth of Stress-induced Ag Micro/Nanomaterials in Conductive Structure2015

    • Author(s)
      Y. Lu, Y. Li, M. Saka
    • Organizer
      11th Int. Conf. Diffusion in Solids and Liquids
    • Place of Presentation
      NH Munchen Messe (Munich, Germany)
    • Year and Date
      2015-06-22
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] A Buried Structure for Fabrication of Micro Materials by Electromigration2015

    • Author(s)
      Y. Kimura, M. Saka
    • Organizer
      11th Int. Conf. Diffusion in Solids and Liquids
    • Place of Presentation
      NH Munchen Messe (Munich, Germany)
    • Year and Date
      2015-06-22
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] カーボンナノチューブネットワーク配線の電流による疲労損傷特性2015

    • Author(s)
      笹川和彦, 藤﨑和弘, 佐藤俊介, 帷子拓也
    • Organizer
      日本材料学会 第64期通常総会・学術講演会
    • Place of Presentation
      山形大学(米沢市)
    • Year and Date
      2015-05-22
    • Related Report
      2015 Annual Research Report
  • [Presentation] エレクトロマイグレーション抑制に関する知見の微細材料創製への応用2015

    • Author(s)
      木村康裕,坂 真澄
    • Organizer
      第29回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学本郷キャンパス(東京都)
    • Year and Date
      2015-03-16 – 2015-03-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] ストレスマイグレーションによる導電性構造体を用いたAgナノワイヤの創製2015

    • Author(s)
      鹿業波,李 渊,坂 真澄
    • Organizer
      日本機械学会東北支部 第50期総会・講演会
    • Place of Presentation
      東北大学工学研究科・工学部機械系講義棟(宮城県仙台市)
    • Year and Date
      2015-03-13
    • Related Report
      2014 Annual Research Report
  • [Presentation] 高密度電流の流れる金属配線の許容電流予測と信頼性向上2015

    • Author(s)
      笹川和彦
    • Organizer
      大学連携新技術説明会
    • Place of Presentation
      JST東京本部別館ホール(東京・市ヶ谷)
    • Year and Date
      2015-03-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] しきい電流密度に着目した金属薄膜配線におけるエレクトロマイグレーション抑制に関する考察2015

    • Author(s)
      筏井大斗,木村康裕,坂 真澄,笹川和彦,燈明泰成
    • Organizer
      日本機械学会東北学生会 第45回卒業研究発表講演会
    • Place of Presentation
      八戸工業高等専門学校(青森県八戸市)
    • Year and Date
      2015-03-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] Evaluation of Electromigration Near a Corner Composed of Dissimilar Metals by Analyzing Atomic Flux at the Interface2014

    • Author(s)
      Y. Kimura, X. Zhao, M. Saka
    • Organizer
      Recent Advances in Structural Integrity Analysis: Proceedings of the International Congress (APCF/SIF-2014)
    • Place of Presentation
      University of Sydney (Australia)
    • Year and Date
      2014-12-09 – 2014-12-12
    • Related Report
      2014 Annual Research Report
  • [Presentation] Trial Fabrication of Al Micro-Materials by Electromigration Using Buildup Structure2014

    • Author(s)
      Y. Kimura, M. Saka
    • Organizer
      Recent Advances in Structural Integrity Analysis: Proceedings of the International Congress (APCF/SIF-2014)
    • Place of Presentation
      University of Sydney (Australia)
    • Year and Date
      2014-12-09 – 2014-12-12
    • Related Report
      2014 Annual Research Report
  • [Presentation] 電子デバイス配線におけるエレクトロマイグレーション損傷の強度信頼性評価2014

    • Author(s)
      笹川和彦
    • Organizer
      日本機械学会RC265「高密度エレクトロニクス実装における信頼性評価と熱制御に関する研究分科会」
    • Place of Presentation
      日本機械学会会議室(東京)
    • Year and Date
      2014-09-24
    • Related Report
      2014 Annual Research Report
  • [Presentation] 電子デバイス配線CNTの強度信頼性評価法の構築2014

    • Author(s)
      笹川和彦
    • Organizer
      半導体理工学研究センターSTARCワークショップ2014
    • Place of Presentation
      新横浜国際ホテル(横浜)
    • Year and Date
      2014-09-03
    • Related Report
      2014 Annual Research Report
  • [Presentation] エレクトロマイグレーションによる微細材料大量創製へ向けたサンプル構造改良に関する研究2014

    • Author(s)
      木村康裕,佐々木崇紘,坂 真澄
    • Organizer
      日本機械学会 M&M2014 材料力学カンファレンス
    • Place of Presentation
      福島大学(福島県福島市)
    • Year and Date
      2014-07-19 – 2014-07-21
    • Related Report
      2014 Annual Research Report
  • [Remarks] 東北大学大学院工学研究科 坂/燈明研究室Webページの学術論文リスト

    • URL

      http://king.mech.tohoku.ac.jp/saka/index.htm

    • Related Report
      2016 Annual Research Report
  • [Remarks] 東北大学大学院工学研究科 坂・李/燈明研究室

    • URL

      http://king.mech.tohoku.ac.jp/saka/index.htm

    • Related Report
      2015 Annual Research Report

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Published: 2014-04-04   Modified: 2018-03-22  

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