| Budget Amount *help |
¥17,160,000 (Direct Cost: ¥13,200,000、Indirect Cost: ¥3,960,000)
Fiscal Year 2016: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2015: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Fiscal Year 2014: ¥12,740,000 (Direct Cost: ¥9,800,000、Indirect Cost: ¥2,940,000)
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| Outline of Final Research Achievements |
Single-crystal silicon is required as the substrates for complex-shaped infrared lenses which are used widely in car night-vision systems, security systems, and thermography systems. However, when cutting silicon using a single-crystal diamond tool, the tool wear is extremely severe, which causes the degradation of form accuracy and the increase in production cost. In this research, an electrically conductive diamond tool was used to cut silicon under electrical voltage and light irradiation in electromagnetic fields. By inducing a small electrical current between the tool and the workpiece, the back-bond electron flow from diamond was suppressed, and the life of the diamond tool was extended.
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