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Development of Low Temperature Bonding Method by Formic Acid Treatment using Pt Catalyst

Research Project

Project/Area Number 26289247
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypePartial Multi-year Fund
Section一般
Research Field Composite materials/Surface and interface engineering
Research InstitutionThe University of Tokyo

Principal Investigator

Suga Tadatomo  東京大学, 工学(系)研究科(研究院), 教授 (40175401)

Co-Investigator(Renkei-kenkyūsha) FUJINO Masahisa  東京大学, 工学系研究科, 助教 (70532274)
AKAIKW Masatake  東京大学, 工学系研究科, 研究員 (50150959)
Project Period (FY) 2014-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥16,380,000 (Direct Cost: ¥12,600,000、Indirect Cost: ¥3,780,000)
Fiscal Year 2016: ¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2015: ¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2014: ¥8,580,000 (Direct Cost: ¥6,600,000、Indirect Cost: ¥1,980,000)
Keywordsギ酸 / 低温接合 / 接合界面 / 直接接合 / 還元 / 活性化接合 / 銅ー銅接合 / 実装 / ぎ酸 / プラチナ触媒 / ハイブリッド接合 / 水素ラジカル / 接合 / 集積化 / 表面活性化 / ナノ密着層 / 銅直接接合 / 酸化膜還元
Outline of Final Research Achievements

A new low temperature bonding process using formic acid pretreatment with Pt catalyst was proposed. The bonding mechanism was clarified and the process was applied to integration of various devices, demonstrating its efficiency. The low temperature bonding is based on activation of the bonded surfaces, the oxide layers of which are reduced in two step reactions by hydrogen radicals generated by Pt catalyst from the formic acid. The process parameters were optimized systematically, and the results were applied successfully to Cu-Cu low temperature bonding below 200 degree C, SnAg-Cu direct bonding, TSV stacking, Cu-resin hybrid bonding, and polymer films with nano-adhesion layer. It indicates that the proposed method can provide a new tool for integrating semiconductor devices, MEMS, and power devices as well as bonding of high temperature superconductors wires.

Report

(4 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Annual Research Report
  • 2014 Annual Research Report
  • Research Products

    (14 results)

All 2017 2016 2015 2014

All Journal Article (6 results) (of which Int'l Joint Research: 2 results,  Peer Reviewed: 6 results,  Open Access: 4 results) Presentation (8 results) (of which Int'l Joint Research: 1 results)

  • [Journal Article] Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid2017

    • Author(s)
      Masahisa Fujino, Masatake Akaike, Naoya Matsuoka, and Tadatomo Suga
    • Journal Title

      Japanese Journal of Applied Physics 56, 04CC01 (2017)

      Volume: 56 Issue: 4S Pages: 04CC01-04CC01

    • DOI

      10.7567/jjap.56.04cc01

    • NAID

      210000147553

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] The study of Cu-Cu low temperature bonding using formic acid treatment with/without Pt catalyst2016

    • Author(s)
      Wenhua Yang, Yangting Lu, Tadatomo Suga
    • Journal Title

      International Conference on Electronic Packaging Technology

      Volume: 17 Pages: 784-787

    • DOI

      10.1109/icept.2016.7583247

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Advances in Low-Temperature Bonding Technologies for 3D Integration2015

    • Author(s)
      T. Suga, N. Shigekawa, E. Higurashi, H. Takagi, and K. Shimomura
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 54 Issue: 3 Pages: 030200-030200

    • DOI

      10.7567/jjap.54.030200

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Direct bonding for dissimilar metals assisted by carboxylic acid vapor2015

    • Author(s)
      J.-M. Song, S.-K. Huang, M. Akaike, and T. Suga
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 54 Issue: 3 Pages: 030217-030217

    • DOI

      10.7567/jjap.54.030217

    • NAID

      210000144828

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Combined surface-activated bonding technique for low-temperature Cu/SiO2 hybrid bonding2015

    • Author(s)
      R. He, M. Fujino, A. Yamauchi, and T. Suga
    • Journal Title

      ECS Transactions

      Volume: 69 Issue: 6 Pages: 79-88

    • DOI

      10.1149/06906.0079ecst

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Effect of Formic Acid Vapor In Situ Treatment Process on Cu Low-Temperature Bonding2014

    • Author(s)
      Wenhua Yang, Masatake Akaike, Tadatomo Suga
    • Journal Title

      IEEE Transactions on Components, Packaging, and Manufacturing Technology

      Volume: 6 Issue: 6 Pages: 951-956

    • DOI

      10.1109/tcpmt.2014.2315761

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Presentation] 銅のギ酸還元反応に関する研究2016

    • Author(s)
      藤野真久、松岡直也、赤池正剛、佐藤健太、須賀唯知
    • Organizer
      エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京工業大学(東京都目黒区)
    • Year and Date
      2016-03-22
    • Related Report
      2015 Annual Research Report
  • [Presentation] Process parameters for formic acid treatment with Pt catalyst for Cu direct bonding2015

    • Author(s)
      N. Matsuoka, M. Fujino, M. Akaike, and T. Suga
    • Organizer
      ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
    • Place of Presentation
      Taipei(台湾)
    • Year and Date
      2015-10-21
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 白金触媒を用いたギ酸処理による銅の直接接合のプロセスパラメータ2015

    • Author(s)
      松岡直弥, 赤池正剛, 須賀唯知
    • Organizer
      第29回 エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学、東京都
    • Year and Date
      2015-03-16 – 2015-03-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature2014

    • Author(s)
      T. Suga
    • Organizer
      Thirteenth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications
    • Place of Presentation
      Cancun, Mexico
    • Year and Date
      2014-10-05 – 2014-10-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] ボイドフリー親水化接合のための拡張表面活性化接合プロセス2014

    • Author(s)
      Ran He, Masahisa Fujino, Akira Yamauch, Tadatomo Suga
    • Organizer
      第24回マイクロエレクトロニクスシンポジウム
    • Place of Presentation
      大阪大学、大阪府
    • Year and Date
      2014-09-04 – 2014-09-05
    • Related Report
      2014 Annual Research Report
  • [Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct and Hybrid Bonding at Low Temperature2014

    • Author(s)
      Tadatomo Suga, Masakate Akaike, Wenhua Yang
    • Organizer
      The 64th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Florida, USA
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature2014

    • Author(s)
      Tadatomo Suga, Masakate Akaike, Naoya Matsuoka
    • Organizer
      International Conferenceon Electronics Packaging (ICEP2014)
    • Place of Presentation
      富山国際会議場、富山県
    • Year and Date
      2014-04-23 – 2014-04-25
    • Related Report
      2014 Annual Research Report
  • [Presentation] Plasma Assisted Bonding of Bulk Copper and Silver Substrates2014

    • Author(s)
      Masahisa Fujino, Kentaro Abe, Tadatomo Suga
    • Organizer
      International Conferenceon Electronics Packaging  (ICEP2014)
    • Place of Presentation
      富山国際会議場、富山県
    • Year and Date
      2014-04-23 – 2014-04-25
    • Related Report
      2014 Annual Research Report

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Published: 2014-04-04   Modified: 2018-03-22  

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