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Low-temperature sintering bonding process of ceramics using reduction reaction of metal oxide

Research Project

Project/Area Number 26289248
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypePartial Multi-year Fund
Section一般
Research Field Composite materials/Surface and interface engineering
Research InstitutionOsaka University

Principal Investigator

HIROSE Akio  大阪大学, 工学(系)研究科(研究院), 教授 (70144433)

Co-Investigator(Kenkyū-buntansha) 佐野 智一  大阪大学, 工学(系)研究科(研究院), 准教授 (30314371)
松田 朋己  大阪大学, 工学(系)研究科(研究院), 助教 (30756333)
小椋 智  大阪大学, 工学(系)研究科(研究院), 助教 (90505984)
Project Period (FY) 2014-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥15,470,000 (Direct Cost: ¥11,900,000、Indirect Cost: ¥3,570,000)
Fiscal Year 2016: ¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2015: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2014: ¥6,110,000 (Direct Cost: ¥4,700,000、Indirect Cost: ¥1,410,000)
Keywords接合 / 焼結 / 酸化銀 / 還元反応 / ナノ粒子 / セラミックス / 酸化還元 / 分子動力学シミュレーション / 酸化物還元 / 信頼性
Outline of Final Research Achievements

A novel low temperature direct bonding process of ceramics-to-metal without any surface metallization using a reduction reaction of silver oxide has been developed.
Typical fine ceramics of alumina, silica, aluminum nitride, silicon carbide and single crystal silicon have been successfully bonded to gold coated copper by means of the reduction reaction of silver oxide particles with diethylene glycol at bonding temperature ranging from 400℃ to 500℃. The bonding layer between ceramics and gold coated copper consisted of sintered silver derived from reduction of silver oxide.
Transmission electron microscopic observations at the bonded interfaces reveled that sintered silver layer was directly bonded to the ceramics without any interlayers. Silver ions and silver nanoparticles formed during the reduction process of silver oxide were found to contribute the interfacial bonding to ceramics. Such bonding behavior was confirmed by molecular dynamics simulation.

Report

(4 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Annual Research Report
  • 2014 Annual Research Report

Research Products

(37 results)

All 2017 2016 2015 2014

All Journal Article (10 results) (of which Peer Reviewed: 10 results,  Acknowledgement Compliant: 9 results,  Open Access: 5 results) Presentation (26 results) (of which Int'l Joint Research: 13 results,  Invited: 3 results) Book (1 results)

  • [Journal Article] elf-heating bonding of A5056 aluminum alloys using exothermic heat of combustion synthesis2017

    • Author(s)
      Tomoki Matsuda, Takaaki Maruko, Tomo Ogura, Tomokazu Sano, Akio Hirose
    • Journal Title

      Materials & Design

      Volume: 113 Pages: 109-115

    • DOI

      10.1016/j.matdes.2016.10.017

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Decrease in Process Pressure for Forming Au-to-Au Joints via Reduction Reaction of Ag<sub>2</sub>O2017

    • Author(s)
      Taro Inoue, Tomo Ogura, and Akio Hirose
    • Journal Title

      MATERIALS TRANSACTIONS

      Volume: 58 Issue: 2 Pages: 127-130

    • DOI

      10.2320/matertrans.ma201602

      10.2320/matertrans.MA201602

    • NAID

      130005297207

    • ISSN
      1345-9678, 1347-5320
    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] CuO還元反応を用いたCu-Cu接合2017

    • Author(s)
      八尾 崇史,松田 朋己,石井 克典,佐野 智一,森川 千晶,大渕 敦司,屋代 亘,廣瀬 明夫
    • Journal Title

      第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2017) 論文集

      Volume: 23 Pages: 53-56

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] その場生成Agナノ粒子の焼結による金属-セラミックス接合2016

    • Author(s)
      本山 啓太, 佐野 智一, 廣瀬 明夫
    • Journal Title

      第22回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2016) 論文集

      Volume: 22 Pages: 93-96

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste2015

    • Author(s)
      Tomoyuki Fujimoto, Tomo Ogura, Tomokazu Sano, Makoto Takahashi and Akio Hirose
    • Journal Title

      MATERIALS TRANSACTIONS

      Volume: 56 Issue: 7 Pages: 992-996

    • DOI

      10.2320/matertrans.mi201410

      10.2320/matertrans.MI201410

    • NAID

      130005083559

    • ISSN
      1345-9678, 1347-5320
    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Effects of Reducing Solvent on Copper, Nickel, and Aluminum Joining Using Silver Nanoparticles Derived from a Silver Oxide Paste2015

    • Author(s)
      Tomo Ogura, Shinya Takata, Makoto Takahashi and Akio Hirose
    • Journal Title

      MATERIALS TRANSACTIONS

      Volume: 56 Issue: 7 Pages: 1030-1036

    • DOI

      10.2320/matertrans.mi201411

      10.2320/matertrans.MI201411

    • NAID

      130005083558

    • ISSN
      1345-9678, 1347-5320
    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] マイクロ接合とスモールスケール接合2015

    • Author(s)
      廣瀬 明夫
    • Journal Title

      溶接学会誌

      Volume: Vol.84,No.3 Pages: 179-185

    • NAID

      130005118502

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] 酸化銀ペーストを用いた金-アルミナ接合の継手特性評価2015

    • Author(s)
      浅間 晃司, 小椋 智, 佐野 智一, 廣瀬 明夫
    • Journal Title

      第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate2015) 論文集 21巻

      Volume: 21 Pages: 69-74

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] Low-current resistance spot welding of pure copper using silver oxide paste2014

    • Author(s)
      Y. Suzuki, T. Ogura, M. Takahashi, and A. Hirose
    • Journal Title

      Materials Characterization

      Volume: 98 Pages: 186-192

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] 低温焼結接合のための酸化銀および酸化銅混合ペーストを用いた銅継手の接合性評価2014

    • Author(s)
      小椋 智,柳下 朋大,高田 慎也,藤本 智之,廣瀬 明夫
    • Journal Title

      日本金属学会誌

      Volume: 78 Pages: 280-285

    • NAID

      130004786466

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Presentation] CuO還元反応を用いたCu-Cu接合2017

    • Author(s)
      八尾崇史, 松田朋己, 石井克典, 佐野智一, 廣瀬明夫, 森川千晶, 大渕敦司, 屋代恒
    • Organizer
      第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
    • Place of Presentation
      パシフィコ横浜 (神奈川県横浜市)
    • Year and Date
      2017-01-31
    • Related Report
      2016 Annual Research Report
  • [Presentation] Direct Bonding of AlN-to-metal Utilizing Sintering of Ag Nanoparticles Derived from Ag2O Microparticles2016

    • Author(s)
      Keita Motoyama, Tomokazu Sano, and Akio Hirose
    • Organizer
      MATERIALS SCIENCE & TECHNOLOGY 2016 Conference and Exhibition (MS&T16)
    • Place of Presentation
      Salt Lake City, USA
    • Year and Date
      2016-10-23
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Reduction Behavior of CuO Paste during Cu-to-Cu Bonding2016

    • Author(s)
      Takafumi Yao, Tomokazu Sano, Tomoki Matsuda, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
    • Organizer
      MATERIALS SCIENCE & TECHNOLOGY 2016 Conference and Exhibition (MS&T16)
    • Place of Presentation
      Salt Lake City, USA
    • Year and Date
      2016-10-23
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] AlN-to-metal Direct Bonding Utilizing Sintering of In-situ Generated Ag Nanoparticles through Redox Reaction2016

    • Author(s)
      Keita Motoyama, Tomoki Matsuda, Tomokazu Sano, and Akio Hirose
    • Organizer
      International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
    • Place of Presentation
      Hotel Hankyu Expo Park, Suita, Osaka, Japan
    • Year and Date
      2016-10-17
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Clarification of Reduction Process of CuO in Cu-to-Cu Bonding using CuO Paste2016

    • Author(s)
      Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
    • Organizer
      International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
    • Place of Presentation
      Hotel Hankyu Expo Park, Suita, Osaka, Japan
    • Year and Date
      2016-10-17
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Metal-to-Ceramic Direct Joining Using Reduction Reaction of Ag2O2016

    • Author(s)
      Akio Hirose, Koji Asama, Tomo Ogura, and Tomokazu Sano
    • Organizer
      International Conference on Nanojoining and Microjoining 2016 (NMJ2016)
    • Place of Presentation
      Niagara Falls, Canada
    • Year and Date
      2016-09-25
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Reduction behavior of CuO particles during Cu-to-Cu bonding2016

    • Author(s)
      Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
    • Organizer
      International Conference on Nanojoining and Microjoining 2016 (NMJ2016)
    • Place of Presentation
      Niagara Falls, Canada
    • Year and Date
      2016-09-25
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 酸化銀還元によりその場生成した銀ナノ粒子の焼結を利用した金属-AlN接合2016

    • Author(s)
      本山啓太, 松田朋己, 佐野智一, 廣瀬明夫
    • Organizer
      溶接学会平成28年度秋季全国大会
    • Place of Presentation
      伊香保温泉ホテル天坊(群馬県渋川市)
    • Year and Date
      2016-09-14
    • Related Report
      2016 Annual Research Report
  • [Presentation] AlN-to-Metal Direct Bonding by Sintering of In-Situ Generated Ag Nanoparticles2016

    • Author(s)
      Keita Motoyama, Tomokazu Sano, and Akio Hirose
    • Organizer
      9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9)
    • Place of Presentation
      Kyoto International Conference Center, Kyoto, Japan
    • Year and Date
      2016-08-01
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Reduction Process of CuO in Cu-to-Cu Bonding Using CuO Paste2016

    • Author(s)
      Takafumi Yao, Tomoki. Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
    • Organizer
      9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9)
    • Place of Presentation
      Kyoto International Conference Center, Kyoto, Japan
    • Year and Date
      2016-08-01
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Joining Techniques by Sintering of Nanoparticles Derived from Metal Oxides2016

    • Author(s)
      Akio Hirose, Tomokazu Sano, and Tomo Ogura
    • Organizer
      International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS Processing, Fabrication, Properties, Applications (Thermec’2016)
    • Place of Presentation
      Graz, Austria
    • Year and Date
      2016-05-29
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] その場生成Agナノ粒子の焼結による金属-セラミックス接合2016

    • Author(s)
      本山 啓太, 佐野 智一, 廣瀬 明夫
    • Organizer
      第22回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
    • Place of Presentation
      パシフィコ横浜, 横浜市
    • Year and Date
      2016-02-02
    • Related Report
      2015 Annual Research Report
  • [Presentation] Low-Temperature Sintering Joining Techniques using Nano-Scale Particles2015

    • Author(s)
      Akio Hirose, Tomokazu Sano and Tomo Ogura
    • Organizer
      14th International Symposium on Microelectronics and Packaging (ISMP 2015)
    • Place of Presentation
      Seoul, Korea
    • Year and Date
      2015-10-13
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Direct Bonding of Metal-to-Alumina Using Silver Oxide Paste2015

    • Author(s)
      Koji Asama, Tomo Ogura, Tomokazu Sano and Akio Hirose
    • Organizer
      Material Science &Technology 2015 Conference and Exhibition (MS&T’15)
    • Place of Presentation
      Columbus, USA
    • Year and Date
      2015-10-04
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Metal-to-metal Joining using Nanoparticles Derived from Metal Oxides2015

    • Author(s)
      Akio Hirose, Tomokazu Sano and Tomo Ogura
    • Organizer
      European Congress and Exhibition on Advanced Materials and Processes 2015 (EUROMAT 2015)
    • Place of Presentation
      Warsaw, Poland
    • Year and Date
      2015-09-20
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 酸化銀ペーストを用いた金属-アルミナ接合2015

    • Author(s)
      浅間晃司, 小椋智, 佐野智一, 廣瀬明夫
    • Organizer
      溶接学会平成27年度秋季全国大会
    • Place of Presentation
      北海道科学大学, 札幌市
    • Year and Date
      2015-09-02
    • Related Report
      2015 Annual Research Report
  • [Presentation] Bonding Process through Sintering of Nanoparticles Derived from Reduction of Metal Oxides2015

    • Author(s)
      Akio Hirose, Tomokazu Sano and Tomo Ogura
    • Organizer
      68th Annual Assembly and International Conference
    • Place of Presentation
      Helsinki, Finland
    • Year and Date
      2015-06-28
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Recent Achievements in Nano/Micro Joining Researches -Intelligent Manufacturing Process Group of Osaka University-2014

    • Author(s)
      A. Hirose, T. Sano, and T. Ogura
    • Organizer
      2nd International Conference on Nanojoining and Microjoining
    • Place of Presentation
      Emmetten, Switzerland
    • Year and Date
      2014-12-07 – 2014-12-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] Joining Technology through Sintering of Silver Nanoparticles Derived from Silver Oxide Paste2014

    • Author(s)
      T. Ogura, and A. Hirose
    • Organizer
      2nd International Conference on Nanojoining and Microjoining
    • Place of Presentation
      Emmetten, Switzerland
    • Year and Date
      2014-12-07 – 2014-12-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] Properties of Au-to-Al2O3 Joint Bonded Using Silver Oxide Paste2014

    • Author(s)
      K. Asama, T. Ogura, T. Sano, and A. Hirose
    • Organizer
      The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW).
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2014-11-26 – 2014-11-28
    • Related Report
      2014 Annual Research Report
  • [Presentation] Evaluation of Joint Properties of Bonding Using Metal Nanoparticles Derived from Metal Oxides2014

    • Author(s)
      T. Fujimoto, T. Ogura, and A. Hirose
    • Organizer
      Materials Science & Technology 2014 Conference and Exhibition (MS&T'14)
    • Place of Presentation
      Pittsburgh, USA
    • Year and Date
      2014-10-12 – 2014-10-16
    • Related Report
      2014 Annual Research Report
  • [Presentation] 酸化銅ペーストを用いた接合の継手特性評価2014

    • Author(s)
      藤本 智之, 小椋 智, 佐野 智一, 廣瀬 明夫
    • Organizer
      溶接学会平成26年度秋季全国大会
    • Place of Presentation
      黒部市宇奈月国際会館, 富山県黒部市
    • Year and Date
      2014-09-10 – 2014-09-12
    • Related Report
      2014 Annual Research Report
  • [Presentation] 酸化銀還元反応を利用した金属-セラミックス接合2014

    • Author(s)
      浅間 晃司, 小椋 智, 佐野 智一, 廣瀬 明夫
    • Organizer
      溶接学会平成26年度秋季全国大会
    • Place of Presentation
      黒部市宇奈月国際会館, 富山県黒部市
    • Year and Date
      2014-09-10 – 2014-09-12
    • Related Report
      2014 Annual Research Report
  • [Presentation] 酸化銅ペースト接合における接合パラメータが接合性に及ぼす影響2014

    • Author(s)
      藤本 智之, 小椋 智, 佐野 智一, 廣瀬 明夫
    • Organizer
      一般社団法人エレクトロニクス実装学会秋季大会 第24回マイクロエレクトロニクスシンポジウム (MES2014)
    • Place of Presentation
      大阪大学吹田キャンパス, 大阪府吹田市
    • Year and Date
      2014-09-04 – 2014-09-05
    • Related Report
      2014 Annual Research Report
  • [Presentation] Low-current resistance spot welding of pure copper using silver oxide paste2014

    • Author(s)
      T. Ogura, Y. Suzuki, and A. Hirose
    • Organizer
      67th Annual Assembly of International Institute of Welding (IIW2014)
    • Place of Presentation
      Seoul, Korea
    • Year and Date
      2014-07-13 – 2014-07-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] Bonding Process by Sintering of Ag Nanoparticles Derived from Reduction of Ag2O2014

    • Author(s)
      Akio Hirose, Shinya Takata, Kohji Asama and Tomo Ogura
    • Organizer
      13th International Conference on Modern Materials and Technologies (CIMTEC2014)
    • Place of Presentation
      Terme, Tuscany, Italy
    • Year and Date
      2014-06-08 – 2014-06-13
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Book] 放熱・高耐熱材料の 特性向上と熱対策技術2017

    • Author(s)
      廣瀬明夫
    • Total Pages
      682
    • Publisher
      株式会社技術情報協会
    • Related Report
      2016 Annual Research Report

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Published: 2014-04-04   Modified: 2018-03-22  

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