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A Study on Physical Interconnect Design in 3D ICs Using Through Silicon Vias

Research Project

Project/Area Number 26330057
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Computer system
Research InstitutionHirosaki University

Principal Investigator

Kurokawa Atsushi  弘前大学, 理工学研究科, 教授 (80610592)

Project Period (FY) 2014-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2016: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2015: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2014: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Keywords三次元集積回路 / 貫通シリコンビア / クロック分配 / 熱解析 / 電源分配 / 容量抽出
Outline of Final Research Achievements

The summaries of research results are as follows. 1) Interconnect resistance, inductance and capacitance under various conditions in 3D ICs were analyzed by an electromagnetic solver, values of each RLC were clarified, and several capacitance equations were developed. 2) The propagation delay and crosstalk noise were analyzed with a circuit simulator, effect of substrate contacts on delay was clarified, and equations to easily get the delay and noise were developed. 3) A method to reduce clock skew among stacked chips by a clock distribution network with multiple source buffers was developed. 4) The power distribution network was modelled and the voltage drops were clarified by circuit simulations. 5) The thermal distribution in 3D ICs was clarified by a thermal conductivity analyzer and new cooling architectures using thermal sidewalls, interchip plates, and a bottom plate (thermal-SIB architectures) were developed.

Report

(4 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Research-status Report
  • 2014 Research-status Report
  • Research Products

    (21 results)

All 2017 2016 2015 2014

All Journal Article (2 results) (of which Int'l Joint Research: 1 results,  Peer Reviewed: 2 results,  Acknowledgement Compliant: 2 results) Presentation (19 results) (of which Int'l Joint Research: 2 results)

  • [Journal Article] Signal Propagation Delay Model in Vertically Stacked Chips2015

    • Author(s)
      Nanako Niioka, Masayuki Watanabe, Masaaki Fukase, Masashi Imai, and Atsushi Kurokawa
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences

      Volume: E98.A Issue: 12 Pages: 2614-2624

    • DOI

      10.1587/transfun.E98.A.2614

    • NAID

      130005111976

    • ISSN
      0916-8508, 1745-1337
    • Related Report
      2015 Research-status Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] インダクタンス逆行列を用いた三次元集積回路の貫通シリコンビア間結合容量抽出2015

    • Author(s)
      小林徹哉, 新岡七奈子, 深瀬政秋, 黒川敦
    • Journal Title

      電気学会 論文誌C

      Volume: ?

    • NAID

      130005086250

    • Related Report
      2014 Research-status Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Presentation] Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs2017

    • Author(s)
      Kaoru Furumi, Masashi Imai, and Atsushi Kurokawa
    • Organizer
      Proc. of the International Symposium on Quality Electronic Design
    • Place of Presentation
      Santa Clara Convention Center, CA, USA
    • Year and Date
      2017-03-14
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 数百層積層メモリにおける各パラメータの温度への影響2017

    • Author(s)
      岡本慎太郎, 黒川敦
    • Organizer
      情報処理学会 東北支部研究会
    • Place of Presentation
      弘前大学
    • Related Report
      2016 Annual Research Report
  • [Presentation] チップ外周熱伝導壁による三次元集積回路の温度低減2016

    • Author(s)
      古見薫, 新岡七奈子, 岡本慎太郎, 今井雅, 黒川敦
    • Organizer
      電子情報通信学会 ソサエティ大会
    • Place of Presentation
      北海道大学
    • Year and Date
      2016-09-20
    • Related Report
      2016 Annual Research Report
  • [Presentation] 三次元集積回路の熱解析2016

    • Author(s)
      古見薫, 今井雅, 新岡七奈子, 黒川敦
    • Organizer
      電子情報通信学会 VLSI設計技術研究会
    • Place of Presentation
      青森県弘前市(弘前市立観光館)
    • Year and Date
      2016-06-16
    • Related Report
      2015 Research-status Report
  • [Presentation] マルチソースバッファを用いた積層チップのクロック分配方法2016

    • Author(s)
      新岡七奈子, 今井雅, 古見薫, 黒川敦
    • Organizer
      電子情報通信学会 VLSI設計技術研究会
    • Place of Presentation
      青森県弘前市(弘前市立観光館)
    • Year and Date
      2016-06-16
    • Related Report
      2015 Research-status Report
  • [Presentation] 積層チップの電源分配のモデリングと電圧降下の解析2016

    • Author(s)
      古見薫, 深瀬政秋, 新岡七奈子, 黒川敦
    • Organizer
      電子情報通信学会 総合大会
    • Place of Presentation
      福岡県福岡市(九州大学 伊都キャンパス)
    • Year and Date
      2016-03-16
    • Related Report
      2015 Research-status Report
  • [Presentation] TSVベース3D-ICの垂直方向配線間結合容量の効率的な抽出方法2016

    • Author(s)
      小林徹哉, 新岡七奈子, 古見薫, 黒川敦
    • Organizer
      情報処理学会 東北支部研究会
    • Place of Presentation
      青森県弘前市(弘前大学)
    • Year and Date
      2016-02-19
    • Related Report
      2015 Research-status Report
  • [Presentation] 3次元積層チップの熱解析と温度上昇抑制方法2016

    • Author(s)
      古見薫, 新岡七奈子, 黒川敦
    • Organizer
      情報処理学会 東北支部研究会
    • Place of Presentation
      青森県弘前市(弘前大学)
    • Year and Date
      2016-02-19
    • Related Report
      2015 Research-status Report
  • [Presentation] Clock skew reduction for stacked chips using multiple source buffers2015

    • Author(s)
      Nanako Niioka, Masashi Imai, Masa-aki Fukase, Yuuki Miura, Kaoru Furumi, and Atsushi Kurokawa
    • Organizer
      IEEE International Symposium on Communications and Information Technologies (ISCIT)
    • Place of Presentation
      奈良県奈良市(奈良県新公会堂)
    • Year and Date
      2015-10-09
    • Related Report
      2015 Research-status Report
    • Int'l Joint Research
  • [Presentation] Thermal analysis with varying physical parameters in 3D ICs2015

    • Author(s)
      Kaoru Furumi, Masa-aki Fukase, Masashi Imai, Yuuki Miura, Nanako Niioka, and Atsushi Kurokawa
    • Organizer
      電気学会 電子・情報・システム部門大会
    • Place of Presentation
      長崎県長崎市(長崎大学)
    • Year and Date
      2015-08-26
    • Related Report
      2015 Research-status Report
  • [Presentation] 三次元集積回路の伝搬遅延とクロストークノイズのモデリング2015

    • Author(s)
      新岡七奈子, 深瀬政秋, 今井雅, 古見薫, 三浦祐輝, 黒川敦
    • Organizer
      電子情報通信学会 回路とシステムワークショップ
    • Place of Presentation
      兵庫県淡路市(淡路夢舞台国際会議場)
    • Year and Date
      2015-08-03
    • Related Report
      2015 Research-status Report
  • [Presentation] ウィンドウベースL 逆行列によるTSV 間容量抽出2015

    • Author(s)
      小林徹哉, 今井雅, 深瀬政秋, 新岡七奈子, 黒川敦
    • Organizer
      電子情報通信学会 総合大会 講演論文集
    • Place of Presentation
      滋賀県草津市(立命館大学)
    • Year and Date
      2015-03-13
    • Related Report
      2014 Research-status Report
  • [Presentation] An effective model for evaluating vertical propagation delay in TSV-based 3-D ICs2015

    • Author(s)
      Masayuki Watanabe, Nanako Niioka, Tetsuya Kobayashi, Rosely Karel, Masa-aki Fukase, Masashi Imai, and Atsushi Kurokawa
    • Organizer
      Proc. of the International Symposium on Quality Electronic Design (ISQED)
    • Place of Presentation
      サンタクララ、CA、USA
    • Year and Date
      2015-03-04
    • Related Report
      2014 Research-status Report
  • [Presentation] Modeling of substrate contacts in TSV-based 3D ICs2014

    • Author(s)
      Masayuki Watanabe, Masa-aki Fukase, Masashi Imai, Nanako Niioka, Tetsuya Kobayashi, Rosely Karel, and Atsushi Kurokawa
    • Organizer
      Proc. of the IEEE International Conference on 3D System Integration (3DIC)
    • Place of Presentation
      キンセール、アイルランド
    • Year and Date
      2014-12-01
    • Related Report
      2014 Research-status Report
  • [Presentation] Effect of substrate contacts on reducing crosstalk noise between TSVs2014

    • Author(s)
      Masayuki Watanabe, Rosely Karel, Nanako Niioka, Tetsuya Kobayashi, Masa-aki Fukase, Masashi Imai, and Atsushi Kurokawa
    • Organizer
      Proc. of the IEEE Asia Pacific Conference on Circuit and Systems (APCCAS)
    • Place of Presentation
      沖縄県石垣市
    • Year and Date
      2014-11-20
    • Related Report
      2014 Research-status Report
  • [Presentation] Impact of on-chip interconnects on vertical signal propagation in 3D ICs2014

    • Author(s)
      Nanako Niioka, Masayuki Watanabe, Rosely Karel, Tetsuya Kobayashi, Masashi Imai, Masa-aki Fukase, and Atsushi Kurokawa
    • Organizer
      Proc. of the IEEE Asia Pacific Conference on Circuit and Systems (APCCAS)
    • Place of Presentation
      沖縄県石垣市
    • Year and Date
      2014-11-19
    • Related Report
      2014 Research-status Report
  • [Presentation] インダクタンス逆行列を用いた三次元集積回路の貫通シリコンビア間結合容量抽出2014

    • Author(s)
      小林徹哉,新岡七奈子,深瀬政秋,黒川敦
    • Organizer
      電気学会 電子・情報・システム部門大会 講演論文集
    • Place of Presentation
      島根県松江市(島根大学)
    • Year and Date
      2014-09-03
    • Related Report
      2014 Research-status Report
  • [Presentation] Substrate contact effect on TSV-to-TSV coupling2014

    • Author(s)
      Rosely Karel, Masa-aki Fukase, Masashi Imai, Nanako Niioka, Tetsuya Kobayashi, and Atsushi Kurokawa
    • Organizer
      Proc. Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
    • Place of Presentation
      山形県米沢市(山形大学)
    • Year and Date
      2014-08-21
    • Related Report
      2014 Research-status Report
  • [Presentation] Modeling and analysis of vertical interconnects in 3D ICs2014

    • Author(s)
      Nanako Niioka, Masashi Imai, Masa-aki Fukase, Rosely Karel, Tetsuya Kobayashi, and Atsushi Kurokawa
    • Organizer
      Proc. Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
    • Place of Presentation
      山形県米沢市(山形大学)
    • Year and Date
      2014-08-21
    • Related Report
      2014 Research-status Report

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Published: 2014-04-04   Modified: 2018-03-22  

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