Visualize granulation technology for rich art expression. Interdisciplinary study of art and engineering

• Project/Area Number: 26370176
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Art at large
• Research Institution: Bunka Gakuen University
• Principal Investigator: narui miho 文化学園大学, 造形学部, 助教 (70459957)
• Co-Investigator(Kenkyū-buntansha): 石黒 孝 東京理科大学, 基礎工学部材料工学科, 教授 (10183162)
• Research Collaborator: OHASHI OSAMU
• Project Period (FY): 2014-04-01 – 2017-03-31
• Project Status: Completed (Fiscal Year 2016)
• Budget Amount: ¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000); Fiscal Year 2016: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000); Fiscal Year 2015: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000); Fiscal Year 2014: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
• Keywords: 粒金細工 / ジュエリー / 復元 / 文化財 / 金 / 銀 / 拡散接合 / ろう材 / ろう接

Outline of Final Research Achievements

I conduct research from the perspectives of arts and material science.In the literature survey, I reviewed studies on the granulation process and the ancient bonding techniques.In the analytical examination of actual granulated items, I used gold belts and a gold belt buckle at Miho Museum to examine the joints where the granules come in contact with the base using a digital microscope. In South Korea, a gold earring from an excavation site was examined using a nondestructive testing (NDT) method. Through these examinations, it was found out that copper compounds were used to attach the granules to the base. Also, in a replication experiment using an electric furnace filled with charcoal, copper carbonate was reduced to copper, which acts as an adhesive agent. The bonding strength was evaluated by ball shear tests and X-ray CT, and it was demonstrated that good bonding has been achieved due to eutectic reaction.

Research Products

• [Journal Article] 古代の金のマイクロ接合・粒金 (2016)
  • Author(s): 大橋修、成井美穂、相原健作、原田一敏、穂坂雅喜、稲垣肇、津田修
  • Journal Title: マテリア Volume: 55 Pages: 468-474
  • NAID: 130005597933
  • Peer Reviewed / Open Access
• [Presentation] 韓国で出土した新羅時代の金製耳飾の金属学的調査と復元制作に向けて (2016)
  • Author(s): 成井 美穂，相原健作，大橋修，穂坂雅喜，藤井和夫
  • Organizer: 日本金属学会
  • Place of Presentation: 東京理科大学(東京都葛飾区）
  • Year and Date: 2016-03-23
• [Presentation] 古代の金のマイクロ接合・粒金 (2015)
  • Author(s): 大橋 修, 成井 美穂, 相原 健作, 穂坂 雅喜, 稲垣 肇, 津屋 修, 原田一敏
  • Organizer: 日本金属学会
  • Place of Presentation: 東京大学 (駒場キャンパス)(東京都目黒区）
  • Year and Date: 2015-03-19