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Study on green process for Si anisotropic wet etching

Research Project

Project/Area Number 26390042
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Nano/Microsystems
Research InstitutionTsuruoka National College of Technology

Principal Investigator

Hiroshi Tanaka  鶴岡工業高等専門学校, その他部局等, 教授 (60609957)

Project Period (FY) 2014-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥520,000 (Direct Cost: ¥400,000、Indirect Cost: ¥120,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
Keywordsシリコン / ウエットエッチング / グリーン化 / 低濃度 / マイクロピラミッド / グリーンプロセス / 高速エッチング / 平滑エッチング / 極低濃度エッチング液 / 界面活性剤作用
Outline of Final Research Achievements

Etching process using a high concentration alkaline aqueous solution at high temperature is used to manufacture an silicon semiconductor sensor for automobiles and so on. In order to construct a future environmentally friendly processing method, we studied whether an etching in a lower concentration aqueous solution is possible.
Conventionally, in the case of a lower concentration, it has been reported that the etched surface became rough. However, in this work, it was confirmed that an use of an air bubbling or addition of the surfactant into the etching solution were effective to get a smooth etched surface. In the future, we will continue studying methods that can achieve both higher etching rate and smoothness.

Report

(4 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Research-status Report
  • 2014 Research-status Report
  • Research Products

    (8 results)

All 2017 2016 2015 2014 Other

All Journal Article (1 results) (of which Peer Reviewed: 1 results,  Acknowledgement Compliant: 1 results) Presentation (6 results) (of which Int'l Joint Research: 1 results,  Invited: 1 results) Remarks (1 results)

  • [Journal Article] Si (100) and (110) etching properties in 5, 15, 30 and 48 wt% KOH aqueous solution containing Triton-X-1002017

    • Author(s)
      H. Tanaka, M. Takeda and K. Sato
    • Journal Title

      Microsystem Technologies

      Volume: - Issue: 12 Pages: 5343-5350

    • DOI

      10.1007/s00542-017-3368-y

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Presentation] Suppress the generation of micro pyramid on Si (100) surface etched in 1wt%KOH solution using air bubbling2016

    • Author(s)
      Y. Saito and H. Tanaka
    • Organizer
      The 8th Asia-Pacific Conference of Transducers and Micro/Nano Technologies (APCOT 2016)
    • Place of Presentation
      Kanazawa, Japan
    • Year and Date
      2016-06-26
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Development of high speed and precise Si anisotropic wet etching technology in mass production for automotive sensor2015

    • Author(s)
      Hiroshi TANAKA
    • Organizer
      Five Days Workshop cum Certificate Course on MEMS & NEMS - Design and Fabrication with Experimental Hands on Sessions
    • Place of Presentation
      India Institute of Technology, Hyderabad
    • Year and Date
      2015-12-14
    • Related Report
      2015 Research-status Report
    • Invited
  • [Presentation] 1wt%KOH水溶液によるSi異方性ウエットエッチング加工特性2015

    • Author(s)
      齋藤祐樹,田中 浩
    • Organizer
      日本機械学会第7回マイクロ・ナノ工学シンポジウム
    • Place of Presentation
      朱鷺メッセ(新潟)
    • Year and Date
      2015-10-27
    • Related Report
      2015 Research-status Report
  • [Presentation] 低濃度アルカリ水溶液によるシリコン異方性ウエット エッチング加工特性2015

    • Author(s)
      田中 浩,齋藤祐樹,佐藤一雄
    • Organizer
      2015年度日本機械学会年次大会
    • Place of Presentation
      北海道大学
    • Year and Date
      2015-09-16
    • Related Report
      2015 Research-status Report
  • [Presentation] TMAH水溶液によるシリコン異方性ウエットエッチングの 高温および低濃度での加工特性2014

    • Author(s)
      田中 浩,齋藤祐樹
    • Organizer
      日本機械学会第6回 マイクロ・ナノ工学シンポジウム
    • Place of Presentation
      くにびきメッセ(松江)
    • Year and Date
      2014-10-20 – 2014-10-22
    • Related Report
      2014 Research-status Report
  • [Presentation] KOH水溶液に微量界面活性剤を添加した場合の シリコン異方性エッチング加工特性2014

    • Author(s)
      武田将人,田中 浩,佐藤一雄
    • Organizer
      日本機械学会第6回 マイクロ・ナノ工学シンポジウム
    • Place of Presentation
      くにびきメッセ(松江)
    • Year and Date
      2014-10-20 – 2014-10-22
    • Related Report
      2014 Research-status Report
  • [Remarks] 鶴岡工業高等専門学校 機械工学科 機械工作研究室 ホームページ

    • URL

      http://pr.tsuruoka-nct.ac.jp/~htanaka/

    • Related Report
      2014 Research-status Report

URL: 

Published: 2014-04-04   Modified: 2018-03-22  

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