Thermal properties mesurement device for nanogap
| Project/Area Number |
26600062
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Nano/Microsystems
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| Research Institution | Kyoto University |
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Principal Investigator |
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| Project Period (FY) |
2014-04-01 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2015: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2014: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
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| Keywords | ナノギャップ / 熱膨張アクチュエータ / 静電櫛歯アクチュエータ / へき開破壊 / 単結晶シリコン / 熱電子放出 / MEMS / 熱アクチュエータ / 静電アクチュエータ / SOI |
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| Outline of Final Research Achievements |
A nanogap fabrication and measurement device has been proposed, fabricated and tested, in order to measure the thermal and electrical transportation properties of a very narrow conformal gap (called nanogap) of a few to tens of nm wide and a few micrometer square. The device actuates thermal actuator to cause cleave fracture on a single crystal silicon structure and to form the nanogap consisting from a pair of fracture surfaces separated from one body. We successfully fracture-fabricated a nanogap by operating the device. By measuring the voltage-current relationship of the gap of 120 nm wide, we confirmed that the electron emission between the nanogap.
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Report
(3 results)
Research Products
(8 results)
