| Project/Area Number |
26820306
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Composite materials/Surface and interface engineering
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| Research Institution | Osaka University |
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Principal Investigator |
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| Project Period (FY) |
2014-04-01 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2015: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2014: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
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| Keywords | 接合 / 炭化ケイ素 / 粉体 / ペースト / 焼結 / 放電プラズマ焼結装置 / Siペースト / 微粒子 / 融点降下 / 再溶融温度 / SiC |
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| Outline of Final Research Achievements |
This study aims at the development of low-temperature bonding process to obtain joint structure of SiC-fiber-reinforced SiC-matrix composites (SiC-CMCs), and paste-like Si powder is selected as the insert material to reduce bonding temperature to less than 1400°C and to maintain high-temperature reliability of the joints. SiC sintered materials were used for fundamental investigation, and the paste-like Si powder was inserted at the bonding interface. The SiC sintered materials were successfully bonded at 1300°C due to formation of the insert layer consisting of sintered Si powder. The joint strength increased as the densified sintered Si powder was obtained. The densification behavior in the sintered Si powder correlated with the median diameter and volume fraction of particles in the paste-like Si powder was systematically investigated. Based on these results, this process was considered to be applicable to SiC-CMCs.
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