研究課題/領域番号 |
22KF0382
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補助金の研究課題番号 |
22F21341 (2022)
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研究種目 |
特別研究員奨励費
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配分区分 | 基金 (2023) 補助金 (2022) |
応募区分 | 外国 |
審査区分 |
小区分21050:電気電子材料工学関連
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研究機関 | 国立研究開発法人物質・材料研究機構 |
研究代表者 |
廖 梅勇 国立研究開発法人物質・材料研究機構, 電子・光機能材料研究センター, 主席研究員 (70528950)
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研究分担者 |
ZHANG ZILONG 国立研究開発法人物質・材料研究機構, 電子・光機能材料研究センター, 外国人特別研究員
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研究期間 (年度) |
2023-03-08 – 2024-03-31
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研究課題ステータス |
交付 (2023年度)
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配分額 *注記 |
2,300千円 (直接経費: 2,300千円)
2023年度: 1,100千円 (直接経費: 1,100千円)
2022年度: 1,200千円 (直接経費: 1,200千円)
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キーワード | ダイヤモンド / MEMS / 磁気センサ |
研究開始時の研究の概要 |
We integrate magnetic thin films with high-Curie temperature (>900K) on diamond MEMS resonators to develop high-reliability magnetic sensors. We will investigate the interface between diamond and the magnetic thin film to optimize the sensing properties.The dimensions of diamond MEMS resonators will also be optimized to achieve high sensitivity.
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研究実績の概要 |
The aim of this project is to develop high-temperature diamond MEMS magnetic sensors that can operate up to 500oC. In this year, to improve the magnetic sensing properties at high temperatures, different interlayers of Ti film, WC film, and WC/Ti film were adopted between the diamond cantilevers and the FeGa thin films in the MEMS magnetic sensors. The thermal-stability of the microstructures, phase structures, and magnetic properties of the FeGa thin films were greatly enhanced by these interlayers. The magnetic sensor with the FeGa/SCD structure has the weakest magnetic sensitivity of 1.96 Hz/mT @573 K and the FeGa/WC/Ti/SCD structure held the highest magnetic sensitivity of 75.40 Hz/mT @673 K. We also developed the on-chip diamond MEMS magnetic sensor up to 773K.
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現在までの達成度 (区分) |
現在までの達成度 (区分)
2: おおむね順調に進展している
理由
The on-chip diamond MEMS magnetic sensor was developed.
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今後の研究の推進方策 |
In the future, we aim to achieve much higher magnetic sensitivity from room temperature to high temperatures. Diamond MEMS magnetic sensor arrays will be developed. To achieve these aims, we will (1) systematically investigate the effect of the quality factor and dimensions of the diamond MEMS resonators on the magnetic sensing performance. (2) An atomic eching process will be adopted to achieve the quality factor over 100,000. (3) The thermal stability with a variation of the quality factor and resonance frequency will be estabilshed. (4) the mechanism of the on-chip actuation and sensing behavior will be studied. (5) Diamond MEMS magnetic sensors of 8x8 array will be developed.
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