| 研究課題/領域番号 |
23K04443
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| 研究種目 |
基盤研究(C)
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| 配分区分 | 基金 |
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| 応募区分 | 一般 |
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| 審査区分 |
小区分26050:材料加工および組織制御関連
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| 研究機関 | 国立研究開発法人産業技術総合研究所 |
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研究代表者 |
山田 ムハマドシャヒン 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員 (90868746)
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| 研究期間 (年度) |
2023-04-01 – 2026-03-31
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| 研究課題ステータス |
交付 (2023年度)
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| 配分額 *注記 |
4,810千円 (直接経費: 3,700千円、間接経費: 1,110千円)
2025年度: 1,560千円 (直接経費: 1,200千円、間接経費: 360千円)
2024年度: 1,560千円 (直接経費: 1,200千円、間接経費: 360千円)
2023年度: 1,690千円 (直接経費: 1,300千円、間接経費: 390千円)
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| キーワード | HAD / Bonding mechanism / Single particle impact / Substrate materials / Plasma assistance AD |
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| 研究開始時の研究の概要 |
Dense coatings had been developed on different substrates of metallic, ceramics, glass, and plastics. However, it is difficult to clarify the influence of substrate materials during the coating formation, where huge number of particles are deposited on substrate. This study proposes a new concept to clarify the substrate effect via elucidating: ① Investigates deformation, adhesion phenomenon, bonding mechanism of single particle. ② Develop 3D simulation modeling to validate the experimental hypothesis. ③ Process upgrading and integration to achieve strong adhesion on different substrates.
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| 研究実績の概要 |
Highly dense and crack-free Al2O3 coatings were deposited by the HAD process on various substrates, including alumina, stainless steel 304, aluminum, and glass. To investigate adhesion phenomena, a high-speed multi-layer shutter system was developed to deposit single particles on substrates under vacuum. During HAD, fine particles were activated without melting and accelerated toward the substrate, adhering at room temperature.
Metallic substrates, being ductile, allow strong film anchoring due to plastic deformation from the first impacting particles. Hard ceramic substrates, however, do not show this classic anchoring layer as they lack the ductility needed for plastic deformation. Therefore, higher particle velocities may be required to form adhering layers on hard ceramic substrates.
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
1: 当初の計画以上に進展している
理由
The ongoing project aims to clarify particle deformation, adhesion phenomena, and bonding mechanisms on various substrates (ceramics, SUS, Al, glass, plastics) by studying single particle impact behavior. Using the single particle concept allows for quantitative evaluation of particle deformation, adhesion strength, peeling behavior, and the influence of substrate material during impact, as well as atomic-level observation of the particle-substrate interface. This approach ensures smooth research progress.
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| 今後の研究の推進方策 |
Develop Simulation Model for Particle Deformation and Bonding During HAD:
This part will focus on using molecular dynamics (MD) and ANSYS simulation software to develop 3D simulation models for:
① First Particle Deformation and Impact Behavior: Analyze deformation and impact behavior of the first particle on different substrates (ceramics, SUS 304, Al, glass, plastics) as a function of particle size, spray angle, particle velocity, load, and temperature.
② Film Growth and Bonding Mechanisms: Study film growth and bonding mechanisms between multiple particles during HAD coating development on various substrates.
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