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[文献書誌] M.Koyama: "Ab Initio Calculations for Sic-A1 Interfaces." Materials SScience Forum. 207-209. 269-272 (1996)
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[文献書誌] M.Koyama: "Ab Initio Calculations for Sic-A1 Interfaces by Conjugate-Gradient Techniques." MAS Symp.Proc.408. 49-54 (1996)
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[文献書誌] M.Koyama: "Ab Initio Calculations for Sic-A1 Interfaces : Tests of Electronic-Minimization Techniques." Modellin Simul.Master.Sci.Eng.4. 397-408 (1996)
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[文献書誌] N.Hosoda,L.YANG,T.Suga: "Reversible Interconnection by control of interface structure" 日本MRS1996年度学術シンポジウム. 92 (1996)
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[文献書誌] L.Yang,N.Hosoda,T.Suga: "TEM Inverstigation of the SUS/A1 Interface Created by the Surface Activated Bonding Method." 日本MRS1996年度学術シンポジウム. 151 (1996)
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[文献書誌] T.Suga: "Recent Progress of the Surface Activated Bonding" International Materials Conference Ceramic Microstructures '96 ″Control at the Atomic Level″. 57 (1996)
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[文献書誌] T.Suga: "The Surface Activated Bonding for Materials Interconnection" 8th Japan Institute of Materials International Symposium ″Interface Science and Materials Interconnection″. 2a1-6 (1996)
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[文献書誌] N.Hosoda,T.Suga: "Reversible Interconnection" 8th Japan Institute of Materials International Symposium ″Interface Science and Materials Interconnection″. p-64 (1996)
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[文献書誌] L.Yang,N.Hosoda,T.Suga: "Microstructure Evolution of Stainless-Steel/Aluminium Interface Created by the Surface Activated Bonding Method." 8th Japan Institute of Materials International Symposium ″Interface Science and Materials Interconnection″. 2p2-6 (1996)
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[文献書誌] T.R.Chung.L.Yang,N.Hosoda,T.Suga: "Room Temperature Wafer Direct Bonding by The Surface Activated Bonding Method" 8th Japan Institute of Materials International Symposium ″Interface Science and Materials Interconnection″. p-63 (1996)
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[文献書誌] T.Akatsu,I,Misumi,G.Sasaki,N.Hosoda,T.Suga: "Microstructure of Metal-Ceramic Interfaces Fabricated Using the Surface Activated Bonding Method" 8th Japan Institute of Materials International Symposium ″Interface Science and Materials Interconnection″. p-62 (1996)
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[文献書誌] H.Takagi,R.Maeda,T.R.Chung,T.Suga: "Room Temperature Bonding of Silicon Wafers by The Surface Activation Method" 8th Japan Institute of Materials International Symposium ″Interface Science and Materials Interconnection″. 2p2-3 (1996)
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[文献書誌] A.C.Rechards,M.R.Richards and F.S.Ohuchi: "A New,Versatile Coating Technique : Levitation Chemical Vapor Deposition" Surface Coating Engieering. (In Press). (1997)
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[文献書誌] T.W.Little and S.S.Ohuchi: "″X-ray photoelectron spectroscopy investigation of the interaction of NF3 with silicon" Materials Research Society Proceeding. (In Press). (1997)
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[文献書誌] H.L.Bech,M.H.Lee,and F.S.Ohuchi: "Effect of ion bombardment on chemical interactions at SiC surface and A1/SiC interfaces" Materials Research Society Proceeding. (In Press). (1997)
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[文献書誌] H.L.Bech,and F.S.Ohuchi: "Aluminum-Silicon Carbide Interfaces : Effects Of Ion Bombardment On Chemical Interactions" the 8th Japan Institute of Metals International Symposium. (1996)
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[文献書誌] H.L.Bech and F.S.Ohuchi: "Preferential Sputtering of SiC (001) by Ar+Ion Beam" in preparation.
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[文献書誌] 葛巻徹,林卓哉,市野瀬英喜,宮澤薫一,伊藤邦夫,石田洋一: "塑性変形したカーボンナノチューブの微細組織" 日本金属学会誌. 60・1. 1-5 (1996)