[文献書誌] S.S.Baek, S.L.Lee, I.H.Kwon, H.S.Yu, E.G.Na, J.S.Ha, T.Hashida, S.H.Chung: "New Technique Development of High Temperature Creep Evaluation by Small Punch-Creep Test"Proc. of Asian Pacific Conference on Fracture and Strength '01(APCFS '01) and International Conference on Advanced Technology in Experimental Mechanics '01(ATEM '01)(October 20-22, 2001, Sendai International Center, Japan). 309-315 (2001)