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[文献書誌] Y.Ju, Y.Hirosawa, M.Saka, H.Abe: "Development of a Millimeter Wave Compact Equipment for NDT of Materials"International Journal of Infrared and Millimeter Waves. 24・3. 391-397 (2003)
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[文献書誌] Y.Ju, M.Saka, H.Abe: "Microwave Imaging of Conductivity Distribution of Silicon Wafers"International Electronic Packaging Technical Conference and Exhibition '03. InterPack2003-35117(CD-ROM). 1-4 (2003)
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[文献書誌] Y.Ju, H.Yamamoto, M.Saka: "Nondestructive Inspection of Chip Size Package by Millimeter Waves"International Electronic Packaging Technical Conference and Exhibition '03. InterPack2003-35118(CD-ROM). 1-4 (2003)
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[文献書誌] Y.Ju, Y.Ohno, M.Saka, H.Abe: "Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves"International Conference on Advanced Technology in Experimental Mechanics 2003. OS02W0125(CD-ROM). 1-4 (2003)
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[文献書誌] Y.Ju, Y.Hirosawa, H.Soyama, M.Saka: "Contactless Measurement of Conductivity of Silicon Wafers by a Microwave Compact Equipment"Proc.5th International Conference on Electronics Materials and Packaging. 141-144 (2003)
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[文献書誌] M.Saka, Y.Ju, Y.Uchimura, T.Miyadu: "On Microwave Dual Frequency Technique for Evaluation of Surface Cracks"Key Engineering Materials. 261-263. 955-961 (2004)
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[文献書誌] Y.Ju, Y.Ohno, M.Saka: "A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves"Key Engineering Materials. (印刷中). (2004)
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[文献書誌] M.Saka, T.Miyadu, Y.Ju: "Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks"Key Engineering Materials. (印刷中). (2004)
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[文献書誌] Y.Ju, T.Miyadu, H.Soyama, M.Saka: "Quantitative Evaluation of Cracks Underwater by Microwaves"Proc.Asian Pacific Conference for Fracture and Strength '04. (発表予定). (2004)
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[文献書誌] Y.Ju, Y.Hirosawa, H.Soyama, M.Saka: "Contactless Measurement of Conductivity of Silicon Wafers by Minimeter Waves"Proc. the Fifth International Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves. (発表予定). (2004)
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[文献書誌] Y.Ju, Y.Ohno, H.Soyama, M.Saka: "Electrical Characterization of Doped Silicon Using High-Frequency Electromagnetic Waves"Proc.4th International Forum on Advanced Material Science and Technology. (発表予定). (2004)
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[文献書誌] Y.Ju, K.Nakagawa, H.Soyama, M.Saka: "Investigation of Electrical Properties of Semiconductor Wafers Using THz Electromagnetic Waves"Proc.The 29th International Conference on Infrared and Millimeter Waves. (発表予定). (2004)