| 研究課題/領域番号 |
16F16348
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| 研究機関 | 東京大学 |
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研究代表者 |
染谷 隆夫 東京大学, 大学院工学系研究科(工学部), 教授 (90292755)
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| 研究分担者 |
ORDINARIO DAVID 東京大学, 大学院工学系研究科(工学部), 外国人特別研究員
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| 研究期間 (年度) |
2016-11-07 – 2019-03-31
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| キーワード | Bioelectronics / Ionic Sensing / Biological Sensing / Chemical Sensing / E-Skin / Organic Electronics / Flexible Electronics |
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| 研究実績の概要 |
The goal of the research project is to develop a new type of “e-skin” (referred to hereafter as ionic e-skin) that can bridge the gap between electronic and biological systems. The project commenced with the evaluation and testing of various materials for integration with flexible substrates. Currently, the project is still in its initial phases and has not had time to progress very far. Thus, as of now there are no published works (journals, books, conference proceedings, etc) resulting from the project. However, once material evaluation and selection has concluded the materials will next be integrated with flexible substrates. Once this happens, at least one journal publication can be expected from the project.
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
2: おおむね順調に進展している
理由
Presently, the research is focused on evaluating various materials for use with the flexible substrates that current “e-skins” are fabricated from. At the time of writing, materials as diverse as conducting polymers, inorganic thin films, and organic thin films have all been evaluated. Parameters that the materials are evaluated on include (but are not limited to): electrical properties, optical properties, mechanical properties, and biocompatibility. Once all possible candidates have been investigated, the best materials will be selected. In summary, the current research plan is proceeding as expected.
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| 今後の研究の推進方策 |
Following the materials selection phase, the next step will be to integrate the best materials with ultra-flexible substrates. This is necessary due to the fact that current “e-skins” are inherently mechanically flexible; any materials that would be used to augment their functionality must therefore also be at least as mechanically flexible. This step will involve taking the selected materials, combining them with ultra-flexible substrates, and optimizing the resulting combination in such a manner where the performance of the integrated materials will be preserved as much as possible. Once this is accomplished, the next step will be to integrate the material with current “e-skins” in order to augment their functionality for ionic/biological/chemical sensing applications.
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