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2022 年度 実績報告書

ポリマー繊維整然配列によってヒドロゲル熱伝導率の研究について

研究課題

研究課題/領域番号 20J22608
研究機関東京大学

研究代表者

GUO RULEI  東京大学, 工学系研究科, 特別研究員(DC1)

研究期間 (年度) 2020-04-24 – 2023-03-31
キーワードTDTR / Thermal conductivity / TR-MOKE / Wafer bonding
研究実績の概要

1.The building of the time-domain thermoreflectance (TDTR) thermal property measurement system. Thermal property measurement is essential for understanding the transport and interaction processes of heat carriers and developing novel materials with desired thermal properties. Among the numerous measurement methods, TDTR offers unique advantages, including easy sample preparation, non-contact measurement, wide applicability, specific suitability for ultrathin films, thermal boundary conductance (TBC) measurement, and probing the ultrafast transport process. A TDTR measurement system with controll and data process programm has been developed with some new features, such as multiple objective lenses, wide range of modulation frequency, mapping sample stage, TDTR and TR-MOKE dual detectors.
2.The TBC measurement of wafer bonding. In recent years, thermal management has become increasingly important for large-scale integrated circuits with the rising density of FETs integrated both horizontally and vertically in a limited space (3D ICs). Wafer bonding technology, which connects the device layer to a substrate with high thermal conductivity, holds promise for solving this issue. In that case, the thermal boundary conductance (TBC) of the interface between the two bonded wafers plays a vital role in thermal management performance. In this study, we developed a mapping system to obtain not only the value of TBC but also the spatial distribution of TBC of the Si-SiC sample, providing more detailed and stochastic knowledge about thermal transport at the interface.

現在までの達成度 (段落)

令和4年度が最終年度であるため、記入しない。

今後の研究の推進方策

令和4年度が最終年度であるため、記入しない。

  • 研究成果

    (2件)

すべて 2022

すべて 雑誌論文 (1件) (うち査読あり 1件) 学会発表 (1件)

  • [雑誌論文] Phase-transition-induced giant Thomson effect for thermoelectric cooling2022

    • 著者名/発表者名
      Modak Rajkumar、Murata Masayuki、Hou Dazhi、Miura Asuka、Iguchi Ryo、Xu Bin、Guo Rulei、Shiomi Junichiro、Sakuraba Yuya、Uchida Ken-ichi
    • 雑誌名

      Applied Physics Reviews

      巻: 9 ページ: 011414~011414

    • DOI

      10.1063/5.0077497

    • 査読あり
  • [学会発表] SiC-Si接合界面での熱伝導のマッピング測定2022

    • 著者名/発表者名
      Rulei Guo
    • 学会等名
      第59回日本伝熱シンポジウム

URL: 

公開日: 2023-12-25  

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