| 研究課題/領域番号 |
20K05161
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| 研究機関 | 国立研究開発法人産業技術総合研究所 |
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研究代表者 |
SHAHIEN Mohammed 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究員 (90868746)
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| 研究期間 (年度) |
2020-04-01 – 2023-03-31
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| キーワード | Deposition mechanism / Plasma assistance AD / Single particle |
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| 研究実績の概要 |
Ｐｌａｓｍａ ａｓｓｉｓｔａｎｃｅ ａｅｒｏｓｏｌ ｄｅｐｏｓｉｔｉｏｎ （ＰＡＤ） ｉｓ ａ ｃｏａｔｉｎｇ ｔｅｃｈｎｏｌｏｇｙ ｃｏｎｓｉｓｔ ｏｆ ｐｌａｓｍａ ａｓｓｉｓｔａｎｃｅ ａｎｄ ｆｉｎｅ ｐａｒｔｉｃｌｅｓ ｄｅｐｏｓｉｔｉｏｎ ｕｎｄｅｒ ｖｅｒｙ ｈｉｇｈ ｓｐｅｅｄ． Ｔｈｅ ｍｅｃｈａｎｉｓｍ ｏｆ ＰＡＤ ｐｒｏｃｅｓｓ ｉｓ ｓｉｇｎｉｆｉｃａｎｔｌｙ ｒｅｌａｔｅｄ ｔｏ ｔｈｅ ｒｅｌａｔｉｏｎ ｂｅｔｗｅｅｎ ｔｈｅ ｐｌａｓｍａ ｓｐｅｃｉｅｓ ａｎｄ ｔｈｅ ｆｉｎｅ ｐａｒｔｉｃｌｅｓ． Ｔｏ ｅｌｕｃｉｄａｔｅ ｔｈｅ ＰＡＤ ｍｅｃｈａｎｉｓｍ ２ ｓｙｓｔｅｍｓ ｈａｄ ｂｅｅｎ ｓｕｃｃｅｓｓｆｕｌｌｙ ｄｅｖｅｌｏｐｅｄ： １－ Ｏｐｔｉｃａｌ ｅｍｉｓｓｉｏｎ ｓｐｅｃｔｒｏｓｃｏｐｙ ａｎａｌｙｓｉｓ ｆｏｒ ｅｌｕｃｉｄａｔｉｎｇ ｔｈｅ ｐｌａｓｍａ ｄｉａｇｎｏｓｔｉｃｓ （ｔｅｍｐｅｒａｔｕｒｅ ａｎｄ ｐｌａｓｍａ ａｃｔｉｖｅ ｓｐｅｃｉｅｓ） ａｎｄ ｉｎｖｅｓｔｉｇａｔｅ ｔｈｅ ｉｎｆｌｕｅｎｃｅ ｏｆ Ｐｌａｓｍａ ｐｏｗｅｒ ｏｎ ｔｈｅ ｐｌａｓｍａ ｄｉａｇｎｏｓｔｉｃｓ．
２－ Ｄｅｖｅｌｏｐｍｅｎｔ ｏｆ ａｎ ｅｌｅｃｔｒｏｓｔａｔｉｃ ｐｒｅｃｉｐｉｔａｔｏｒ ｓｙｓｔｅｍ ｕｎｄｅｒ ｔｈｅ ｖａｃｕｕｍ ｔｏ ｃｏｌｌｅｃｔ ｔｈｅ Ｓｉｎｇｌｅ ｆｉｎｅ ｐａｒｔｉｃｌｅｓ ｄｕｒｉｎｇ ｆｌｉｇｈｔ ｂｅｆｏｒｅ ｉｍｐａｃｔ ｏｎ ｓｕｂｓｔｒａｔｅ． Ｔｈｅ ｐｌａｓｍａ ｉｎｔｅｒａｃｔｉｏｎ ｗｉｔｈ ｆｉｎｅ ｐａｒｔｉｃｌｅ ｋｉｎｅｔｉｃｓ ａｎｄ ｃｈａｒａｃｔｅｒｉｓｔｉｃｓ ｄｕｒｉｎｇ ｉｎｆｌｉｇｈｔ ｃａｎ ｂｅ ｉｎｖｅｓｔｉｇａｔｅｄ．
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
2: おおむね順調に進展している
理由
The processing is going steady to clarify the PAD mechanism by elucidating the inflight plasma-assistance and adhesion mechanisms of the individual single particle (starting coating build-up unit). The single particles picked up inflight by using the developed electrostatic precipitator system before impact on substrate and investigate plasma interaction with inflight particle kinetics and characteristics
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| 今後の研究の推進方策 |
Elucidating the deformability of the collected single particle after PAD spraying by using in-situ compression.
Investigating the adhesion phenomenon, bonding mechanism of the 1st single particle with the substrate via deposition of only single particle on the substrate by using multi-layer high speed shutter. Followed by quantitative evaluation of the deposited particle Adhesion strength and peeling behavior by using a nano scratch test. Microstructure observation of the cross-section of the deposited single particle. Investigating the particle-substrate interface at atomic level to investigate the factors of interfacial bonding of solid ceramic particle. Chemical analysis of substrate surface before and after particle impacting to fully elucidate the adhesion phenomenon and bonding.
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| 次年度使用額が生じた理由 |
The order was postponed by the maker to next year.
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