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2020 年度 実施状況報告書

Improved cryogenic thermoelectric performance of MgAgSb-based materials by modulation doping of Cu

研究課題

研究課題/領域番号 20K22486
研究機関芝浦工業大学

研究代表者

苗 蕾  芝浦工業大学, 工学部, 教授 (60455540)

研究期間 (年度) 2020-09-11 – 2022-03-31
キーワードthermoelectrics / cryogenic temperature / MgAgSb / Cu / cold energy utilization
研究実績の概要

MgAgSb-based alloy was successfully prepared via ordinary planetary ball milling and spark plasma sintering. The element Zr, Cu, Sm, Gd, Er and Yb successfully doped into MgAgSb to cooperatively optimize the electrical and thermal transport properties, respectively. The main parameters including nominal composition of raw powders Mg, Ag, Sb, Cu doping ratio, SPS and heat treating conditions have been optimized. Meanwhile, the thermoelectric properties were systematically investigated at cryogenic temperatures range of 173-573K. As a result, the PF value of 1373 μW/mK-2 at 173K for MgAg0.935Cu0.015Sb0.95 was about 12% increased than 1226 μW/mK-2 for pure MgAg0.95Sb0.98. Thus, thermoelectric properties of MgAgSb-based alloys at low temperature can be enhanced by Cu doping.

現在までの達成度 (区分)
現在までの達成度 (区分)

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理由

We had performed material synthesis and confirmed that thermoelectric properties of MgAgSb-based alloys at low temperature can be enhanced by Cu doping. Ordinary planetary ball milling has been confirmed as a low cost and effective way to synthesis thermoelectric materials.According to the project proposal plan, progress goes smoothly.

今後の研究の推進方策

1.The optimal ratio and enhancement of TE performances of MgAgSb materials via to introduce Cu, Zr, Sm, Gd, Er or Yb element still needs to be further investigated by lots of experiment.
2.The mechanism for improving thermoelectric performance will be explored through theoretical calculation combined with experimental result. The mechanism such as, modulation doping of Cu into MgAgSb for improvement ZT at cryogenic temperatures by narrowing band gap and localized electron resonance around fermi level, proposed in project will be examined.
3. Thermoelectric module will be prepared for cryogenic applications.
4. 1-2 papers are preparing for submission.

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公開日: 2021-12-27  

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