| 研究課題/領域番号 |
21J10839
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| 研究機関 | 東北大学 |
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研究代表者 |
王 真金 東北大学, 工学系研究科, 特別研究員(DC2)
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| 研究期間 (年度) |
2021-04-28 – 2023-03-31
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| キーワード | Composite manufacturing / Spin coating / Piezoelectric composite / Energy-harvesting |
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| 研究実績の概要 |
This year, we continue to work on the development of functionally graded piezoelectric composite (FGPC) for energy harvesting. A new manufacturing process for fabricating barium titanate (BaTiO3, BTO)/ poly (vinylidene fluoride-co-trifluoroethylene) [P(VDF-TrFE)] FGPC was developed, dubbed Additive Spin Coating (ASC). The composites made by ASC are defined as AFGPC. With the same structure, both energy harvesting efficiency and stability of the composite are improved by the new fabrication method.This work optimized the manufacturing process of FGPC, resulting in increased energy-harvesting capability under different energy-harvesting modes for the FGPC which introduces a revolutionary fabrication process for enhancing the energy-harvesting efficiency of piezo-composite materials.
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
2: おおむね順調に進展している
理由
Compared to the planned research progress, the actual progress is slower.
Although in previous studies, we verified the superiority of functionally graded piezoelectric composite for environmental power generation applications. However, in the follow-up study, we found that the material may deteriorate in performance after long-term use. Therefore, we optimized the structure and fabrication method of the material, which further improved the stability and energy-harvesting efficiency. The new material has significant durability after long-term using.
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| 今後の研究の推進方策 |
To meet more situations during the application, a smaller energy-harvester is needed. Next year, we will focus on the research of micro-size energy harvesters for the microelectromechanical system.
We plan to use MEMS fabrication techniques to develop a micro-size energy harvester with both energy generating and outputting circuits. The multilayer sputter deposition technique is used to form an energy harvesting cantilever on the Silicon-on-Insulator (SOI) substrate. The cantilever is made of high piezoelectric material which can convert mechanical vibration to electromechanical, and power output circuits are printed by MEMS technique.
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