| 研究課題/領域番号 |
23K04443
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| 研究機関 | 国立研究開発法人産業技術総合研究所 |
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研究代表者 |
山田 ムハマドシャヒン 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員 (90868746)
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| 研究期間 (年度) |
2023-04-01 – 2026-03-31
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| キーワード | HAD / Bonding mechanism / Single particle impact / Substrate materials |
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| 研究実績の概要 |
Highly dense and crack-free Al2O3 coatings were deposited by the HAD process on various substrates, including alumina, stainless steel 304, aluminum, and glass. To investigate adhesion phenomena, a high-speed multi-layer shutter system was developed to deposit single particles on substrates under vacuum. During HAD, fine particles were activated without melting and accelerated toward the substrate, adhering at room temperature.
Metallic substrates, being ductile, allow strong film anchoring due to plastic deformation from the first impacting particles. Hard ceramic substrates, however, do not show this classic anchoring layer as they lack the ductility needed for plastic deformation. Therefore, higher particle velocities may be required to form adhering layers on hard ceramic substrates.
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
1: 当初の計画以上に進展している
理由
The ongoing project aims to clarify particle deformation, adhesion phenomena, and bonding mechanisms on various substrates (ceramics, SUS, Al, glass, plastics) by studying single particle impact behavior. Using the single particle concept allows for quantitative evaluation of particle deformation, adhesion strength, peeling behavior, and the influence of substrate material during impact, as well as atomic-level observation of the particle-substrate interface. This approach ensures smooth research progress.
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| 今後の研究の推進方策 |
Develop Simulation Model for Particle Deformation and Bonding During HAD:
This part will focus on using molecular dynamics (MD) and ANSYS simulation software to develop 3D simulation models for:
① First Particle Deformation and Impact Behavior: Analyze deformation and impact behavior of the first particle on different substrates (ceramics, SUS 304, Al, glass, plastics) as a function of particle size, spray angle, particle velocity, load, and temperature.
② Film Growth and Bonding Mechanisms: Study film growth and bonding mechanisms between multiple particles during HAD coating development on various substrates.
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| 次年度使用額が生じた理由 |
The order was postponed by the maker to next year.
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