| 研究課題/領域番号 |
23K19055
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| 研究機関 | 大学共同利用機関法人高エネルギー加速器研究機構 |
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研究代表者 |
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| 研究期間 (年度) |
2023-08-31 – 2025-03-31
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| キーワード | 3D detectors / Fast timing / Radiation sensors / 4D tracking / Physics instrumentation |
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| 研究実績の概要 |
In the past fiscal year, discussion with detector manufacturers has resulted in a first production of 3D silicon detectors for use in fast timing applications. These include sensors of different geometries to optimize future designs. Additionally, 2 fast timing read out boards have been procured that enable measurement of the time resolution of these detectors in the lab with a radioactive source, and future measurements with a test beam. First characterization of all devices from the first batch, in terms of Capacitance-voltage and current-voltage measurements have been carried out. Time resolution measurements are now beginning and running as planned.
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
2: おおむね順調に進展している
理由
So far the procurement of sensors and test equipment has progressed smoothly so far. Measurements are being carried out by myself and a newly hired postdoc, who will also work on simulations. Thing measurements are underway and the first results expected by summer.
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| 今後の研究の推進方策 |
Now that electrical characterization before irradiation of the 3D detectors has completed, timing measurements will be performed to compare different detector geometries. After the timing measurement, a select set of sensors will be sent to Ljubljana in Slovenia to be neutron irradiated to various fluencies. This will allow us to characterize and repeat the measurements after irradiation. Also, a test beam at CERN is planned for the fall of this year in order to better characterize the timing performance of these detectors when exposed to high energy particle beams. Finally, a full size sensor will be bump-bonded to a read out ASIC, Timepix4, in order to create the first full detector module prototype comprising a sensor with many channels and the latest in fast timing readout chips.
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| 次年度使用額が生じた理由 |
The value to be used in the next fiscal year will be to pay for test beam activities by traveling to CERN. Additionally, dicing of detectors from some larger wafers is needed to perform the timing results. This money will be used to pay the dicing company in Japan to cut the sensors from the wafers.
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