| 研究課題/領域番号 |
22H03679
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| 配分区分 | 補助金 |
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| 研究機関 | 九州大学 |
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研究代表者 |
Ho HsinNi 九州大学, 芸術工学研究院, 准教授 (60466406)
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| 研究分担者 |
佐藤 克成 奈良女子大学, 工学系, 准教授 (00708381)
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| 研究期間 (年度) |
2022-04-01 – 2027-03-31
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| キーワード | Shitsukan recognition / Thermal perception / Haptics / Material perception |
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| 研究実績の概要 |
In FY2022, we successfully established the necessary research environments and acquired the required research facilities. We carried out human experiments on material recognition based on thermal cues and the integration between thermal and tactile cues. We found a thermophysical property that can predict the subjective material judgement and identify an integration rule for thermal and tactile cues.We have presented these findings in domestic meetings. Our findings have the potential to inform the engineering design of haptic technologies for reproducing material characteristics, ultimately enhancing user experiences.
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| 現在までの達成度 (区分) |
現在までの達成度 (区分)
1: 当初の計画以上に進展している
理由
In the initial plan, the first year was designated for hardware development, with human experiments scheduled to commence in the second year. Our progress has exceeded expectations, as we not only established the essential research environments but also conducted human experiments and presentated our results in research meetings.
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| 今後の研究の推進方策 |
In FY2023, we will analyze FY2022 data and advancing our understanding of hand-material interactions for haptic technology. We plan to present key findings at an international conference, fostering knowledge exchange within the scientific community. Our thermal display development will continue, aiming to accurately replicate skin temperature changes during hand-material interactions, refining existing technology, and exploring innovative methods to enhance realism and user experience. Moreover, we will establish a comprehensive material database by measuring the physical properties of material samples, such as thermal effusivity and surface roughness. These samples will inform future experiments and support our research objectives in haptic technologies and their applications.
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