Electric field activated slurry polishing technique

2017 Fiscal Year Final Research Report

• Project/Area Number: 15K05745
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Akita Industrial Technology Center
• Principal Investigator: Akagami Yoichi 秋田県産業技術センター, その他部局等, 所長 (00373217)
• Co-Investigator(Kenkyū-buntansha): 中村 竜太 秋田県産業技術センター, 素形材プロセス開発部, 研究員 (00634213) ; 久住 孝幸 秋田県産業技術センター, 素形材プロセス開発部, 主任研究員 (40370233)
• Project Period (FY): 2015-04-01 – 2018-03-31
• Keywords: 電界砥粒制御技術 / 電界撹拌技術

Outline of Final Research Achievements

CMP is widely used as a finishing technology for semiconductor substrates such as silicon wafers, and especially colloidal silica slurry is mainly used for final finishing. This slurry is a colloidal solution in which silica particles having a nano-level particle diameter are stably dispersed, and depending on use conditions, polishing characteristics may be deteriorated due to aggregation. Therefore, before applying the colloidal silica slurry to the polishing region, an electric field was applied to try to control the zeta potential which dominates the dispersibility of the silica particles. As a result, we report to be succeed in improving the polishing increase efficiency 11%.

Free Research Field

精密加工　流体制御技術