2009 Fiscal Year Final Research Report
Research on Manufacturing Technology of Etalon : A Core Element of Tunable Dispersion Compensator for Optical Communication, by means of CMG Process
| Project/Area Number |
19360056
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Ibaraki University |
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Principal Investigator |
ZHOU Libo Ibaraki University, 工学部, 教授 (90235705)
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| Co-Investigator(Kenkyū-buntansha) |
SHIMIZU Jun 茨城大学, 工学部, 准教授 (40292479)
OJIMA Hirotaka 茨城大学, 工学部, 講師 (90375361)
YAMAMOTO Takeyuki 茨城大学, 工学部, 技術専門職員
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| Co-Investigator(Renkei-kenkyūsha) |
KAMIYA Sumio , トヨタ自動車・第2機能材料部, 担当部長
IWASE Hisao , トヨタ自動車・第2機能材料部
YAMASHITA Teruki , トヨタ自動車・第2機能材料部
TASHIRO Yoshiaki 東京ダイヤモンド工具製作所, 技術部
TIAN Yebin 茨城大学, VBL, 非常勤研究員
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| Project Period (FY) |
2007 – 2009
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| Keywords | キーワード / エタロン / 単結晶シリコン / 極薄ウエハ / CMG / 化学・機械融合加工 |
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| Research Abstract |
Si based etalon is a core element of tunable dispersion compensator for ultra high-speed optical communication, which demands both high geometrical accuracy and high surface integrity. Aiming at establishing manufacturing technology to fulfill such application, this research has developed a one-stop grinding system by full use of the advantage of CMG. After optimizations of CMG wheel and process, it was successful to thin 8 inch Si wafer down to 15μm with GBIR<0.3μm.
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Research Products
(31 results)
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[Journal Article] Study on Improvement of Material Removal Rate in Chemo-mechanical Grinding (CMG) of Si Wafer2009
Author(s)
J. Sasaki, T. Tsuruga, B. Soltani., H, T. Mitsuta, Y.B. Tian, J. Shimizu, L. Zhou, H. Eda, Y. Tashiro, H. Iwase, S. Kamiya
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Journal Title
Key Engineering Materials Vols.389-390
Pages: 13-17
Peer Reviewed
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