Research on Manufacturing Technology of Etalon : A Core Element of Tunable Dispersion Compensator for Optical Communication, by means of CMG Process

2009 Fiscal Year Final Research Report

• Project/Area Number: 19360056
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Ibaraki University
• Principal Investigator: ZHOU Libo Ibaraki University, 工学部, 教授 (90235705)
• Co-Investigator(Kenkyū-buntansha): SHIMIZU Jun 茨城大学, 工学部, 准教授 (40292479) ; OJIMA Hirotaka 茨城大学, 工学部, 講師 (90375361) ; YAMAMOTO Takeyuki 茨城大学, 工学部, 技術専門職員
• Co-Investigator(Renkei-kenkyūsha): KAMIYA Sumio , トヨタ自動車・第2機能材料部, 担当部長 ; IWASE Hisao , トヨタ自動車・第2機能材料部 ; YAMASHITA Teruki , トヨタ自動車・第2機能材料部 ; TASHIRO Yoshiaki 東京ダイヤモンド工具製作所, 技術部 ; TIAN Yebin 茨城大学, VBL, 非常勤研究員
• Project Period (FY): 2007 – 2009
• Keywords: キーワード / エタロン / 単結晶シリコン / 極薄ウエハ / CMG / 化学・機械融合加工

Research Abstract

Si based etalon is a core element of tunable dispersion compensator for ultra high-speed optical communication, which demands both high geometrical accuracy and high surface integrity. Aiming at establishing manufacturing technology to fulfill such application, this research has developed a one-stop grinding system by full use of the advantage of CMG. After optimizations of CMG wheel and process, it was successful to thin 8 inch Si wafer down to 15μm with GBIR<0.3μm.

Research Products

• [Journal Article] Molecular Dynamics Simulation of Chemical Reaction Assisted Grinding of Silicon Wafer by Controlling Interatomic Potential Parameters (2010)
  • Author(s): J. Shimizu, L. Zhou, T. Yamamoto
  • Journal Title: J.of Computational and Theoretical Nanoscience Vol.7, No.10 Pages: 1-6
  • Peer Reviewed
• [Journal Article] Siウエハインフィード研削における切削軌跡密度と機械剛性の影響 (第2報 : 実験的考察) (2010)
  • Author(s): 周立波, 光田孝仁, 清水淳, 田業氷, 山本武幸
  • Journal Title: 砥粒加工学会誌 Vol.45, No.2 Pages: 92-96
  • Peer Reviewed
• [Journal Article] Siウエハインフィード研削における切削軌跡密度と機械剛性の影響 (第1報 : モデルと解析) (2010)
  • Author(s): 周立波, 光田孝仁, 清水淳, 田業氷, 山本武幸
  • Journal Title: 砥粒加工学会誌 Vol.45, No.1 Pages: 45-49
  • Peer Reviewed
• [Journal Article] ポテンシャルパラメータ制御によるシリコンウエハ化学作用援用研削の分子動力学シミュレーション (2010)
  • Author(s): 清水淳, 周立波, 山本武幸
  • Journal Title: 砥粒加工学会誌 Vol.45, No.1 Pages: 41-44
  • Peer Reviewed
• [Journal Article] Research on Chemo-Mechanical-Grinding of Large Size Quartz Glass Substrate (2009)
  • Author(s): L. ZHOU, T. SHIINA, Z.J. QIU, J. SHIMIZU, T. YAMAMOTO, Y. TASHIRO
  • Journal Title: Precision Engineering Vol.33 Pages: 499-504
  • Peer Reviewed
• [Journal Article] Study on reaction mechanism of Si and pure CeO_2 for chemical-mechanical-grinding process (2009)
  • Author(s): S. Kamiya, H. Iwase, K. Kishita, L. Zhou, H. Eda, Y. Yoshida
  • Journal Title: J.of Vacuum Science and Technology B Vol.27, No.3 Pages: 1496-1502
  • Peer Reviewed
• [Journal Article] Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process (2009)
  • Author(s): Y.B. Tian, L. Zhou, J. Shimizu, T. Tashiro, R.K. Kang
  • Journal Title: J.of App.Surface Science Vol.255, No.7 Pages: 4205-4211
  • Peer Reviewed
• [Journal Article] Study on Improvement of Material Removal Rate in Chemo-mechanical Grinding (CMG) of Si Wafer (2009)
  • Author(s): J. Sasaki, T. Tsuruga, B. Soltani., H, T. Mitsuta, Y.B. Tian, J. Shimizu, L. Zhou, H. Eda, Y. Tashiro, H. Iwase, S. Kamiya
  • Journal Title: Key Engineering Materials Vols.389-390 Pages: 13-17
  • Peer Reviewed
• [Journal Article] Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (2009)
  • Author(s): D.M. Guo, Y.B. Tian, R.K. Kang, L. Zhou, M.K. Lei
  • Journal Title: Key Engineering Materials Vol.389-390 Pages: 459-464
  • Peer Reviewed
• [Journal Article] Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding (2009)
  • Author(s): H. Huang, Y.Q. Wu, Y. Wang, J. Zou, L. Zhou
  • Journal Title: Key Engineering Materials Vols.389-390 Pages: 465-468
  • Peer Reviewed
• [Journal Article] 微小引っかきによるシリコンウエハ研削現象の解析 (2008)
  • Author(s): 清水淳, 周立波, 山本武幸, 津村貴史, 岡部秀光, 江田弘
  • Journal Title: 砥粒加工学会誌 Vol.52, No.10 Pages: 601-606
  • Peer Reviewed
• [Journal Article] Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer (2008)
  • Author(s): Jun Shimizu, Hiroshi Eda, Libo Zhou, Hidemitsu Okabe
  • Journal Title: Tribology Online Vol.3, No.5 Pages: 248-253
  • Peer Reviewed
• [Journal Article] Molecular Dynamics Simulation of Effect of Grinding Wheel Stiffness on Nanogrinding Process (2008)
  • Author(s): Jun Shimizu, Libo Zhou, Hiroshi Eda
  • Journal Title: Int'l J.of Abrasive Technology Vol.1, No.3/4 Pages: 316-326
  • Peer Reviewed
• [Journal Article] Characteristics of Silicon Substrates Fabricated using Nanogrinding and CMG (2008)
  • Author(s): H. Huang, B.L. Wang, Y. Wang, J. Zou, L. Zhou
  • Journal Title: Materials Science and Engineering A Vol.479 Pages: 373-379
  • Peer Reviewed
• [Journal Article] Formation Mechanism of Nanocrystalline High-Pressure Phases in Silicon during Nanogrinding (2007)
  • Author(s): Y. Wang, J. Zou, H. Huang, L. Zhou, B.L. Wang, Y.Q. Wu
  • Journal Title: Nanotechnology Vol.18, 465705 Pages: 1-5
  • Peer Reviewed
• [Journal Article] Fabrication and evaluation for extremely thin Si wafer (2007)
  • Author(s): L. Zhou, B. S. Hosseini, T. Tsuruga, J. Shimizu, H. Eda, S. Kamiya, H. Iwase, Y. Tashiro
  • Journal Title: Int.J.Abrasive Technology Vol.1, No.1 Pages: 94-105
  • Peer Reviewed
• [Journal Article] Molecular Dynamics Simulation of Nano Grinding-Influence of Tool Stiffness- (2007)
  • Author(s): J. Shimizu, Libo Zhou, Hiroshi Eda
  • Journal Title: Int.J.Manufacturing Science & Technology Vol.9, No.1 Pages: 69-75
  • Peer Reviewed
• [Presentation] Study on ultra-precision machining process of silicon-based etalon, -Effects of diamond grinding on breakage of ultra-thin etalon- (2009)
  • Author(s): H. SATO, Y.B. TIAN, J. SHIMIZU, L. ZHOU
  • Organizer: Proceedings of Asian Symposium for Precision Engineering and Nanotechnology
  • Place of Presentation: Kitakyushu/Japan
  • Year and Date: 20091111-20091113
• [Presentation] Modeling and Analysis of Effects of Machine Tool Stiffness and Cutting Path Density on Infeed Surface Grinding of Silicon Wafer (2009)
  • Author(s): L. Zhou, T. Mitsuta, J. Shimizu, T. Tajima
  • Organizer: Advanced Materials Research
  • Place of Presentation: Gold Coast/Australia
  • Year and Date: 20090926-20090929
• [Presentation] A Novel Single Step Thinning Process for Extremely Thin Si Wafers (2009)
  • Author(s): Y.B. Tian, L. Zhou, J. Shimizu, H. Sato, R.K. Kang
  • Organizer: Advanced Materials Research
  • Place of Presentation: Gold Coast/Australia
  • Year and Date: 20090926-20090929
• [Presentation] Effects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si Wafer (2009)
  • Author(s): H. Takahashi, Y.B. Tian, J. Sasaki, J. Shimizu, L. Zhou, Y. Tashiro, H. Iwase, S. Kamiya
  • Organizer: Advanced Materials Research
  • Place of Presentation: Gold Coast/Australia
  • Year and Date: 20090926-20090929
• [Presentation] Molecular Dynamics Simulation of Chemo-Mechanical Grinding by Controlling Interatomic Potential Parameters to Imitate Chemical Reaction (2009)
  • Author(s): J. Shimizu, L. Zhou, T. Yamamoto
  • Organizer: Advanced Materials Research
  • Place of Presentation: Gold Coast/Australia
  • Year and Date: 20090926-20090929
• [Presentation] Study on Reaction Mechanism of Si and pure CeO_2 for CMG Process (2008)
  • Author(s): S Kamiya, H. Iwase, K. Kishita, L. Zhou, H. Eda, Y. Yoshida
  • Organizer: The 1st International Conference on Nanomanufacturing
  • Place of Presentation: Singapore
  • Year and Date: 20080714-20080716
• [Presentation] Research on CMG of large size silica glass substrate (2007)
  • Author(s): T. Shina, L. Zhou, Z.J Qiu, T. Yamamoto, J. Shimizu, H. Eda
  • Organizer: Proceeding of LEM21
  • Place of Presentation: Fukuoka/Japan
  • Year and Date: 20071106-20071109
• [Presentation] Development of High Performance Wheels for Chemo-Mechanical-Grinding (2007)
  • Author(s): Y. Tashiro, M. Kenmochi, B. Soitani, T. Tsuruga, L. Zhou, J. Shimizu, H. Eda
  • Organizer: Proceeding of LEM21
  • Place of Presentation: Fukuoka/Japan
  • Year and Date: 20071106-20071109
• [Presentation] Study on Nanomachining Process of Si Wafer using an Atomic Force Microscope (2007)
  • Author(s): J. SHIMIZU, T. TSUMURA, Y. SUEHISA, L. ZHOU, H. EDA
  • Organizer: Proceeding of LEM21
  • Place of Presentation: Fukuoka/Japan
  • Year and Date: 20071106-20071109
• [Presentation] Development of On-machine 3D Measuring System for Large Size Si Wafer Thinning Process, Advances in Abrasive technology X (2007)
  • Author(s): T. Mitsuta, B. Soltani, T. Tsuruga, J. Sasaki, L. Zhou, J. Shimizu, H. Eda
  • Organizer: Proceedings of ISAAT2007
  • Place of Presentation: Detroit/USA
  • Year and Date: 20070926-20070928
• [Presentation] Study on Thinning Process of Large Size Si wafer, Advances in Abrasive technology X (2007)
  • Author(s): T. Tsuruga, B. Soltani, J. Sasaki, T. Mitsuta, J. Shimizu, L. Zhou, H. Eda
  • Organizer: Proceedings of ISAAT2007
  • Place of Presentation: Detroit/USA
  • Year and Date: 20070926-20070928
• [Presentation] Simulation and Experimental Study on Nanoscracthig of Silicon Wafer (2007)
  • Author(s): J. Shimizu, H. Okabe, T. Tsumura, Y. Suehisa, L. Zhou, H. EDA
  • Organizer: Proceedings of Int'l Conference on Tribology in Manufacturing Process (ICTMP) 2007
  • Place of Presentation: Yokohama/Japan
  • Year and Date: 20070924-20090926
• [Remarks] ホームページ等
  • URL: http://info.ibaraki.ac.jp/scripts/websearch/index.htm
• [Patent(Industrial Property Rights)] 工作物表面加工方法 (2009)
  • Inventor(s): 神谷純生, 岩瀬久雄, 長池哲也, 江田弘, 周立波
  • Industrial Property Rights Holder: トヨタ自動車 (株)
  • Industrial Property Number: 特許第4283088
  • Acquisition Date: 2009-03-27