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2021 Fiscal Year Final Research Report

Insulative, flexible, and high thermal conductivity heat transfer sheets with diamond particles

Research Project

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Project/Area Number 20K14777
Research Category

Grant-in-Aid for Early-Career Scientists

Allocation TypeMulti-year Fund
Review Section Basic Section 21050:Electric and electronic materials-related
Research InstitutionKyushu University

Principal Investigator

Inaba Masafumi  九州大学, システム情報科学研究院, 助教 (20732407)

Project Period (FY) 2020-04-01 – 2022-03-31
Keywordsダイヤモンド / 放熱シート / 伝熱シート / 電界整列 / 誘電泳動 / 複合材料
Outline of Final Research Achievements

To efficiently dissipate heat generated by electronic devices, a flexible heat-transfer sheet with high thermal conductivity that follows the roughness of the material surface and has high thermal conductivity is required to be inserted between the device and the heat-dissipating part. In this study, diamond, which has the highest thermal conductivity among the insulating materials, is composited as a filler in a flexible resin to form a heat transport path by electric field alignment method, aiming to fabricate a heat transfer sheet with flexibility, high thermal conductivity, and electrical insulation properties. The heat-transfer sheet was fabricated by considering the alignment conditions. As a result, a thermal conductivity of 1 W/mK was obtained with a heat-transfer sheet containing 60 wt% diamond particles.

Free Research Field

電気・電子材料工学

Academic Significance and Societal Importance of the Research Achievements

電力駆動系の半導体デバイスの高性能化、高集積化に伴い、電子デバイスの発熱が問題になり、小さい素子から効率よく熱を逃がす、サーマルマネジメントの重要性が増している。特にパワーデバイスは温度で特性が大きく変化することに加え、配線などが熱膨張・収縮を繰り返すことにより疲労劣化し、最終的にデバイス破壊につながることも懸念される。
本研究では、このサーマルマネジメントに貢献する複合材料に、絶縁対中最高の熱伝導率をもつダイヤモンドを用いて、電圧印加という簡便な手法で高熱伝導率化を目指している。ダイヤモンドはヤスリ等に用いられる比較的安価なものを用いることで、コスト的な課題をクリアできる。

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Published: 2023-01-30  

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