2012 Fiscal Year Final Research Report
Study on temperature rise of printed circuit boards havingdifferent thermal conductivity values across a board
| Project/Area Number |
21560221
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Thermal engineering
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| Research Institution | Toyama Prefectural University |
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Principal Investigator |
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| Project Period (FY) |
2009 – 2012
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| Keywords | 対流 / 伝導 / 伝熱機器 / 輻射 / エネルギー工学 |
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| Research Abstract |
This paper describes an evaluation of effective thermal conductivities of Printed CircuitBoards (PCBs) for thermal design of electronic equipment. To formulate the in-plane effectivethermal conductivity of the PCBs, we define two types of a thermal resistance by usingspreading resistance equation. One is the thermal resistance as a function of the thermalconductivity of copper wire and of base material, and the other is that of effective thermalconductivities. The thermal resistance by using the thermal conductivity of copper wire and ofbase material is almost matched with experimental results when heat diffusion radius inin-plane direction by copper wire is about 26.5 mm. On the other hand, the thermal resistanceby using effective thermal conductivities is in good agreement with experimental results whenwe multiply 1D thermal resistance term in the proposed equation by 0.45. Therefore, in-planeeffective thermal conductivity of the PCBs can be evaluated by using proposed equations
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[Presentation] Heat Sink Design inHome Appliances and personal computer2010
Author(s)
(Invited)M.Ishizuka
Organizer
1st WORKSHOP On Leading-edgeTheories and Practices in Design-Perspectives of Product Design andFundamental Technology -Session I -Leading-edge Product Design(Part 1)
Place of Presentation
IIIT-J(Indian Institute of Information &Technology, Jabalpur) , India
Year and Date
20101012-15
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