2011 Fiscal Year Final Research Report
Elucidation of Dynamic Dislocation Behavior in Nano-scale Metal Component
| Project/Area Number |
21686013
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| Research Category |
Grant-in-Aid for Young Scientists (A)
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| Allocation Type | Single-year Grants |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Kyoto University |
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Principal Investigator |
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| Project Period (FY) |
2009 – 2011
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| Keywords | ナノ / 塑性変形 / 転位 / 透過型電子顕微鏡 / 力学解析 |
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| Research Abstract |
In order to investigate the plastic deformation mechanism in nano-components where a nano-thickness copper(Cu) film is sandwiched between a silicon(Si) substrate and silicon nitride(SiN) layer, we developed a bending specimen, of which understructure can be observed in-situ by means of a transmission electron microscope(TEM), and examined the plastic behavior of a Cu portion. TEM images exhibited that an initial plastic deformation took place near the interface edge(junction between the Cu/Si interface and the surface) in the Cu portion with a high critical resolved shear stress(400. 420 MPa). The TEM observation after the experiment indicated that stacking fault layers governed the plastic deformation in nano-scale region near the dissimilar interface.
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[Presentation]2009
Author(s)
澄川貴志, 宍戸徹也, 北村隆行
Organizer
日本機械学会2009年度材料力学カンファレンス
Place of Presentation
札幌
Year and Date
20090700
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